The semiconductor industry enjoyed a particularly strong
first quarter followed by a particularly weak second quarter, according
to Bough Lin, chairman for packaging and testing house Silicon Precision
Industries (SPIL). End market demand is unlikely to rebound until
August, said Lin.
For 2015, the semiconductor industry
should hit bottom in June-July, Lin indicated. PC sales remain sluggish
while smartphone demand in emerging markets rises at a slower pace.
Meanwhile, demand for consumer electronics devices has been weaker than
expected thus far in 2015, Lin said.
However, chip
demand will start to pick up in August and grow through October, Lin
suggested. Seasonal demand for smartphones and wearable devices will
help the industry return to its growth track in the second half of 2015,
Lin said.
In addition, Lin disclosed that SPIL's
development of system-in-package (SiP) is still lagging behind rival
Advanced Semiconductor Engineering (ASE). The target applications for
SPIL's SiP solutions will expand to include in-vehicle networking, smart
home, wearables and industrial, Lin said.
Lin also
revealed that SPIL's package-on-package (PoP) technology will be ready
for volume production between the second and third quarters of 2016.
Meanwhile, SPIL's fan-out type WLP will be available mainly for
handset-use application processors, Lin added.
SPIL's
shareholders have approved the distribution of a cash dividend per share
of NT$3 (US$0.10) for the company's 2014 operations. SPIL reported
record revenues of NT$83.07 billion for 2014, while net profits soared
99.1% on year to NT$11.73 billion. Net EPS for the year came to NT$3.76.
http://www.digitimes.com/news/a20150616PD208.html
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