Friday, July 29, 2016

ams sells NFC, RFID technologies to ST

Sensor specialist ams is selling its NFC and RFID reader IP, technologies and product lines to STMicroelectronics for $79.3million. The deal is also said to include a ‘substantial deferred earn out consideration’. Depending on future results, this could be worth another $37m. However, ams will retain its sensor related NFC/RFID tags business and relevant design capabilities as it looks to develop wireless IoT sensor solutions and support upcoming sensor nodes.
Alexander Everke, ams’ CEO, pictured, said: “Divesting certain RFID/NFC product lines streamlines our product and technology portfolio around our core sensor solutions competence while maximising the value of our high performance wireless IP. This transaction is a next strategic step on our way to make ams the world’s leading provider of sensor solutions for all major end markets.”
Included in the deal are NFC front end and antenna boost solutions, as well as integrated HF/UHF RFID reader assets. Around 50 employees will transfer to ST.

http://www.newelectronics.co.uk/electronics-news/ams-sells-nfc-rfid-technologies-to-st/144020/

Thursday, July 28, 2016

Samsung, SK hynix to spend more on chips for self-driving cars

Korean chipmakers Samsung Electronics and SK hynix are pouring more resources into producing chips for self-driving cars amid their slowing sales in key sectors such as PCs.

SK hynix, the second-largest memory chipmaker next to Samsung, said on July 26 that its car business now makes more than 10 percent of DRAM sales. DRAM chips are used for temporary data storage.

The company added the figure for NAND chips, used for long-term data storage on smartphones and computers, is lower than that for DRAM but continues to grow.

“We are also producing chips for ADAS (advanced driver assistance systems) and self-driving cars since 2015,” the company said in a conference call. “We will continue to focus resources into the futuristic technologies.”

Chipmakers are recently struggling with falling prices as the demand for PCs and smartphones is continuing to decline.

SK hynix said its second-quarter profit plunged 67.1 percent to 452.8 billion won (US$399 million) from a year ago especially due to its slowing DRAM sales. Compared to its compatriot rival Samsung, it has a large sales portion of DRAM chips.

Samsung, the market leader on memory chips, has also been keeping a close eye on automotive chips. The company’s vice chairman and semiconductor business chief Kwon Oh-hyun currently oversees the company’s automotive parts business overall.

Samsung recently acquired a 1.92 percent stake in China’s BYD, the world’s largest electric vehicle maker, in a way for it to expand its presence in the soaring automotive parts market in an era of electric mobility.

The company plans to supply its own connected car solution Samsung Connect Auto to US telecom behemoth AT&T from next month. First unveiled in February this year, the solution is a little plastic box powered by Samsung’s Tizen OS that plugs directly into a vehicle’s on-board diagnostics to monitor the car’s operation, provide updates on eco driving efficiency and offer Internet connections for entertainment.

http://www.koreaherald.com/view.php?ud=20160727000801

Wednesday, July 27, 2016

Tsinghua Leads Creation of $2.8 Billion Chinese Chip Giant

Tsinghua Unigroup Ltd. merged its memory chip-making operations with Chinese government-run XMC’s, creating a $2.8 billion company to spearhead the country’s effort to become a global semiconductor player.
The company is folding XMC, also known as Wuhan Xinxin Semiconductor Manufacturing Corp., into its growing portfolio of assets and consolidating their production capacity, Tsinghua’s billionaire chairman Zhao Weiguo said via e-mail. The newly merged entity is called Changjiang Storage Co. and has a registered capital of 18.9 billion yuan ($2.8 billion), according to a website operated by the State Administration for Industry and Commerce.
Changjiang Storage will count among its shareholders the 138 billion-yuan National Integrated Circuit Industry Investment Fund Co., whose mandate is the development of a domestic chip sector and in which Tsinghua is an investor. Other shareholders include the provincial governments of Wuhan and Hubei, though the website didn’t list their stakes.
Zhao will become chairman of the new entity, he said. Tsinghua, an affiliate of the prestigious Beijing university of the same name, harbors ambitions of becoming a global player in semiconductors. It has pursued deals around the globe as the standard-bearer of China’s effort to build a local industry giant and wean the country off foreign technology. Its core business of semiconductors is seen by the nation’s political leadership as vital to national security.The company is just one of several affiliates of state-backed Tsinghua University, the school that’s produced Chinese leaders from President Xi Jinping to his predecessor Hu Jintao. Other arms include Tsinghua Unisplendour Co. and Tsinghua Tongfang Co.
Together they’ve spearheaded a spate of high-profile acquisitions in recent years. Unigroup bought RDA Microelectronics Inc. and Spreadtrum Communications Inc., and came close to a potential $23 billion bid for Micron Technology Inc. But it withdrew from a $3.8 billion investment in Western Digital Corp. in the face of a U.S. security review.
Its latest target, XMC, began operations in 2008 and says it’s one of the largest players in domestic semiconductors. It’s unveiled plans to participate in the building of a $24 billion semiconductor manufacturing mega-complex that the government is establishing in its home province. XMC didn’t respond to a phone call seeking comment.
Closely held Unigroup had sales of 52 billion yuan ($8 billion) last year with an after-tax profit of 3.9 billion yuan, according to the company. In its chip design business, profit came to $200 million on sales of 13.5 billion yuan. Its target, XMC, began operations in 2008 as a foundry for memory chip and image sensor production.

http://www.bloomberg.com/news/articles/2016-07-26/tsinghua-unigroup-xmc-merge-chip-assets-to-create-chinese-giant

Tuesday, July 26, 2016

SK Hynix tips first-half pickup after sharp second-quarter profit drop


South Korean memory chip maker SK Hynix Inc (000660.KS) on Tuesday tipped a strong pickup in DRAM memory chips for mobile devices in the second half after its second-quarter operating profit fell to its lowest in more than three years.
The world's No. 2 memory chip maker after Samsung Electronics Co Ltd (005930.KS) said key clients would launch new smartphone products, boosting a market which has been hurt by weak demand for consumer electronics.
"The third quarter is a time when demand from key clients for new smartphone products rises significantly, which will have a positive effect," SK Hynix said in a statement.
SK Hynix said in a regulatory filing its April-June profit was 453 billion won ($397 million), the lowest since the first quarter of 2013 and matching analysts' estimates from a Thomson Reuters StarMine SmartEstimate survey.
The chipmaker's shares were down 2.1 percent as of 0206 GMT, compared with a 0.2 percent rise for the broader market .KS11, briefly touching their lowest price since July 8.
Yuanta Securities analyst Lee Jae-yun said concerns about tougher competition amid speculation about a takeover of U.S. Micron Technology Inc (MU.O) was weighing on investor sentiment.
Micron earlier this month announced job cuts and other savings after guiding for weaker-than-expected fiscal third-quarter sales, underscoring the strains on the industry.
Sluggish global economic conditions are weighing on demand for products ranging from smartphones to personal computers, hurting prices for components such as chips.
SK Hynix said second-quarter shipments of DRAM chips, used for temporary data storage, rose 18 percent from January-March while average selling prices fell 11 percent.
Shipments for NAND chips, used for long-term data storage on products such as smartphones and computers, rose 52 percent and the average selling price fell 11 percent.
Second-quarter revenue SK Hynix fell 15 percent from a year earlier to 3.9 trillion won, compared with a Thomson Reuters StarMine SmartEstimate of 3.8 trillion won.
The impending launch of new premium smartphones from firms such as Apple Inc (AAPL.O) and Samsung Electronics could help chipmakers in the current quarter, however.
Researcher TrendForce said earlier this month contract prices for DRAM chips had stabilized in June and would rise by between 4 percent and 8 percent in the third quarter.
SK Hynix also said it would push to grow its memory sales for vehicles, focusing on high-end applications such as self-driving technologies.


http://www.reuters.com/article/us-sk-hynix-results-idUSKCN106079

Monday, July 25, 2016

Samsung Electro-Mechanics to invest W263b in chip technology

Through the investment, Samsung Electro-Mechanics will develop the next-generation chip packaging facilities, which will be deployed at Samsung Display’s manufacturing complex in Cheonan, South Chungcheong Province.

Teaming up with Samsung Electronics’ system LSI division, in charge of developing non-memory chips such as application processors, the electronic components firm will start a project to develop the fan-out wafer level package or FoWLP technology, which can reduce the size of a chip and production cost in a dramatic manner.

Thanks to an upper hand in its own FoWLP technology, TSMC, a Taiwanese chip foundry firm, was able to strike a supply deal of mobile application processor for Apple’s next iPhones.

http://www.koreaherald.com/view.php?ud=20160722000587

Friday, July 22, 2016

Intel, Samsung, Western Digital investing in Auburn-based tech startup

Technology giants Intel Corp., Samsung Electronics Co. Ltd. and Western Digital Corp. are investing in an Auburn-based startup.
Samsung Ventures, the venture capital arm of Korean consumer electronics company Samsung Electronics, led the $4.5 million equity financing round for Kazan Networks Corp. Intel Capital, the venture arm of the semiconductor-maker Intel (Nasdaq: INTC), and data-storage products developer Western Digital (Nasdaq: WDC) also invested, according to Kazan.
The Auburn-based company, which launched in December 2014, has developed technology to allow cloud data center servers to quickly access solid-state memory that is not physically in or near the server. That “allows for data center configurations that are game changers,” said Bryan Cowger, Kazan Networks' head of marketing.

http://www.bizjournals.com/sacramento/news/2016/07/21/intel-samsung-western-digital-investing-in-startup.html

Thursday, July 21, 2016

Strategic investments in high-performance computing enhance U.S. competitiveness

n recent months, scientists at the Pittsburgh Supercomputing Center reported progress in the fields of genomics, public health, chemistry and machine learning thanks, in part, to a new National Science Foundation-funded supercomputer – Bridges. The system, which was also used to model the possible benefits of influenza vaccine choice, provided compelling results that suggest adopting a vaccine choice policy could curtail the national cost and enormous annual burden of influenza in the United States.
Federal funding and support for supercomputers or high-performance computing (HPC) projects, such as Bridges, is critical for enabling new scientific discoveries and cures for diseases, enhancing national security and cyber defenses and improving economic competitiveness. Yet, U.S. leadership in this market is being contested as other countries are beginning to invest aggressively as they recognize the technology’s strategic importance.
Think of it like the Space Race of the 1960s, but with investment going into software and large-scale HPC systems rather than rockets. The stakes are different, but the potential for world-changing results is just as important.While the U.S. continues to hold a prominent position in HPC, the Associated Press recently reported that China has now officially displaced the U.S. for the first time with the most supercomputers on the Top 500 listing of the fastest supercomputers in the world. Fifteen years ago China didn’t even have one HPC on the Top 500 listing. According to the International Data Corporation, the Asia Pacific region had a HPC growth of 15 percent in 2015, where the U.S. was only at 5 percent. The European Union has recently doubled their investment in supercomputing research, and Japan’s High Performance Computing Initiative program shows they are focused on building an exascale supercomputer by 2020, whereas the U.S. is currently on target for 2023.
The reality is that HPC systems are no longer a technology reserved for elite academic institutions, but are now bleeding into the enterprise, disrupting industries and impacting our nation’s competitiveness and innovation. For example, imagine a wind turbine. Without HPC, researchers could only test for very general system-wide improvements. With it, researchers can use HPC systems to handle massive amounts of data and complex calculations to analyze the impact of friction at multiple points on a single turbine blade, making improvements a millimeter at a time. Efficiency gains can multiply quickly at that level, leading to a whole new paradigm for investing in clean wind energy.
Organizations like the Pittsburgh Supercomputing Center are also pushing the HPC envelope with new and innovative architectures. Bridges represents a new approach to supercomputing that focuses on research problems that are limited by data movement. In addition to serving traditional supercomputing users, Bridges will help researchers tackle new kinds of problems in genetics, the natural sciences and social sciences, where scientists are impacted by the volume of data rather than computational speed. This project highlights another innovative way HPC can help solve pressing issues facing the U.S.
But we can’t stop there. Given the explosion of vast amounts of data and the increasing importance of simulations in scientific research, we need to make the next exponential leap in HPC, exascale computing and next generation computing. To put in perspective, an exascale supercomputer could operate faster than 50 million laptops. As with the semiconductor industry, the country or region that leads HPC and exascale will capture the related economic and societal benefits. The U.S. simply cannot afford to fall behind in this race.
While the private sector continues to make significant HPC-related investments, the federal government also plays a vital role in advancing HPC research. HPE recently participated in an Information Technology Industry Foundation (ITIF) panel on Capitol Hill to urge Congress to fully fund the Administration’s FY2017 request on the National Strategic Computing Initiative (NSCI). The NCSI names three lead agencies, Department of Energy (DOE), Department of Defense, and National Science Foundation to lead these efforts.
Specifically, DOE plans to establish, over the next 15 years, a viable path forward for future HPC systems, and to research new progressive technologies that perform “beyond Moore’s law,” including the all-important exascale computing.
We continue to urge Congress to fund these critical investments, so the U.S. can enjoy the greatest rewards of HPC-driven technology and give our nation the advantage when attempting to solve the world’s most pressing challenges.

http://thehill.com/blogs/congress-blog/technology/288315-strategic-investments-in-high-performance-computing-enhance-us

Wednesday, July 20, 2016

Seagate unveils hard drives with up to 10TB capacity

Seagate today announced a new line of hard drives with up to 10TB of capacity for desktops computers, network-attached storage (NAS) and surveillance systems.
The high-capacity drives, dubbed the Guardian Series, represent a 2TB increase over the capacity of previous Seagate hard drives in the consumer and small business category.


The Guardian series consists of the BarraCuda Pro desktop drive, the Seagate IronWolf for NAS applications and the Seagate SkyHawk for video surveillance systems.
Seagate also said it has resurrected the Barracuda brand for its line of consumer desktop and laptop hard drives, a name it did away with in favor of the "Desktop Hard Drive" brand a few years ago. Seagate changed the spelling to "BarraCuda."

The standard BarraCuda line now includes hard disk drives with spindle speeds ranging from 5,900rpm to 7,200rpm and capacities ranging from 500GB to 10TB. The drives also come with 16GB to 64GB of DRAM cache, depending on the overall capacity, and are being offered in 2.5-in. laptop form factors and 3.5-in. desktop sizes. The thinnest 2.5-in. BarraCuda drive is 7mm thick, small enough for ultrathin notebooks; it offers up to 2TB of capacity.
The updated BarraCuda drive line will offer sustained data transfer rates of up to 210MB/s. The 2TB models will retail for $81 and the 3TB models will sell for $100.
Seagate also announced a new drive for PC "enthusiasts," the BarraCuda Pro, which comes in capacities of up to 10TB. The drive has a 7,200rpm spindle speed and a data transfer rate of up to 220MB/s, and comes with a five-year limited warranty. That's more than twice the typical two-year BarraCuda HDD warranty.
"BarraCuda Pro offers the highest PC Compute spin speed at 7200 RPM for 3.5-in. HDD drives on the market," said Chris Deardorff, a Seagate senior marketing strategist.

The drive also comes with Seagate's Self-Encryption Drive (SED) technology, which password protects data on the drive but also allows users to crypto-erase it by changing the encryption key, ensuring no one can access it.
The BarraCuda Pro can sustain up to 55TB of data writes per year, according to Deardorff. The 10TB BarraCuda Pro will retail for $535.
Another hard drive announced today in the BarraCuda lineup is the FireCuda, which is aimed at gamers and comes in both 2.5-in. and 3.5-in. Form factors, and either 1TB or 2TB of capacities.
The FireCuda is a solid-state hybrid drive (SSHD), which means it uses a small amount (8GB) of NAND flash as a caching element to increase performance up to five times over standard BarraCuda drives. Data is first written to the NAND flash prior to the hard drive, which enables higher performance considering the spindle speed is just 5,900rpm. The drive has a maximum sustained read rate of 210MB/s.
Seagate has been selling SSHDs since 2011, so the FireCuda is not new technology. The FireCuda will retail for $85 for a 1TB drive, $110 for the 2TB model.
For small businesses, Seagate has refreshed its NAS drive lineup with the IronWolf brand. The IronWolf is aimed at NAS devices with one to 16 drive bays and comes with up to 10TB capacity and Seagate's AgileArray (formely NASworks) software on it. AgileArray technology supports error recovery controls, power management and vibration tolerance for reliability when used in multi-bay NAS devices.

The IronWolf, which is rated for up to 180TB of writes per year, sports a higher resiliency than other Seagate drive models with a one million meantime before failure (MTBF) rating, according to Jennifer Bradfield, a Seagate senior director of product marketing.

The drive can also power down into a sleep mode while not being used, sipping only .8 watts of power compared with the 6.8 watts of power it uses while active.
The IronWolf HDDs offer a Rescue Data Recovery Service plan that protects against data loss from viruses, software issues, or mechanical and electrical breakdowns in a NAS or RAID environment. A failed drive can be sent back to Seagate where its in-house "Rescue Service" will attempt to retrieve data. The drive also comes with a three-year limited warranty. The IronWolf 10TB HDD will retail for $470.
Seagate's new SkyHawk HDD lineup is a rebrand of the previous Sv35 series video surveillance hard drive. The new 7,200rpm drive comes with up to 10TB of capacity for storing up to 10,000 hours of HD video. It also comes with ImagePerfect firmware from MTC Technology.
The firmware, which allows the drive to be used by motion-sensing cameras, powers down the drive when it's not in use to reduce power consumption and heat generation. It then powers up quickly to provide uninterrupted recording.
Like the IronWolf, the SkyHawk drives use rotational vibration sensors to help minimize read/write errors, and it can support up to 64 HD cameras -- more than any other drive on the market, according to Aubrey Muhlach, Seagate's Worldwide Surveillance Segment marketing manager.
Designed for modern, high-resolution systems running around the clock, SkyHawk drives also come with a data recovery services option.
The SkyHawk HDD supports up to 180TB worth of data writes per year, has a one million hour MTBF and a three-year limited warranty.
The 10TB SkyHawk HDD will retail for $460.

http://www.computerworld.com/article/3097264/data-storage/seagate-unveils-hard-drives-with-up-to-10tb-capacity.html

Tuesday, July 19, 2016

Will China’s memory chips push threaten Samsung?

China’s latest move to contend in the memory chips segment could threaten the dominant positions of two South Korean firms in the global market --Samsung Electronics and SK Hynix -- and incur a possible technology leak through the departures of local professionals to the neighboring country, market watchers warned Tuesday.

China’s chip-maker JHICC recently broke ground for its DRAM plant with an investment of around 6 trillion won ($5.2 billion), aiming to produce 60,000 sheets of 12-inch (30-centimeter) wafers monthly by 2018. It plans to double the production capacity within five years.

JHICC is not the only Chinese firm making massive investment in memory chips in the neighboring country.

Tsinghua Unigroup and XMC also announced that they would be investing 13 trillion won and 27 trillion won each for technological self-sufficiency.

China, under the leadership of President Xi Jinping, aims to replace more than 50 percent of DRAM and NAND flash memory with their own products by 2025 by investing public funds worth 140 trillion won.

Market watchers said China’s push has caused a stir in the monopoly of the three firms.

The global DRAM market has been dominated by Samsung Electronics, which has an around 50 percent share, followed by SK Hynix with 30 percent and Micron Technology with 20 percent. There has been no new entrant in the market over the last three years due to high entry barriers.

“The import volume of semiconductors in China is around 272 trillion won annually. Even if only half of them becomes self-sufficient, that would strike a huge blow to Korean companies in the long term,” said Lee Seung-woo, an analyst from IBK Securities.

Samsung feels uncomfortable too.

“We are not at ease with China’s push in the memory chip market. Although there are still technology gaps between Korea and China, it appears to be inevitable to lose our market (share)-- such as chips for low-end smartphones or cars -- to the Chinese firms to some extent,” a senior source from Samsung told The Korea Herald.

Chips for cars -- autonomous and electric -- are relatively bigger than those for smartphones, which require tinier and more advanced technologies, according to industry sources.

Apart from losing the market share, China’s push to attract Korean engineers are also emerging as new challenges. They have already hired engineers from Japan, Taiwan and Silicon Valley by acquiring the firms.

“Brain drain is becoming a serious issue in the local chip industry. Chinese companies are luring Korean engineers by offering salaries nine times higher than they receive here,” said Park Jae-gun, a professor of Hanyang University’s engineering college.

By Shin Ji-hye (shinjh@heraldcorp.com)
http://www.koreaherald.com/view.php?ud=20160719000858

Monday, July 18, 2016

Toshiba and Western Digital Open New Flash Memory Fab in Japan

Toshiba Corp. and storage maker Western Digital Corp. (WDC) have opened a new semiconductor fab dedicated to the manufacturing of next-generation NAND flash memory.
The fab, located in Yokkaichi, Mie Prefecture, Japan, will support the conversion of the companies’ 2-D NAND capacity to 3-D flash memory used in smartphones, solid state drives and other applications. The companies say the fab will allow for higher densities from the flash memory as well as better device performance.
A photo of the cleanroom inside the Toshiba and Western Digital semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan. Source: Toshiba The fab began construction in September of 2014 when Toshiba and SanDisk formed an agreement for the mass production of 3-D flash memory. In May, Western Digital completed its acquisition of SanDisk with this fab, and having access to a high-volume supply of flash memory was one of the key aspects of the deal. The first phase of production at the facility began in March.
Toshiba and WDC plan to invest to expand the fab capacity over time and dependent upon market conditions. The Yokkaichi fab includes a site-wide integrated production system—which uses big data to analyze more than 1.6 billion data points each day—and will be used to improve the efficiency and quality of the 3-D NAND flash memory.

http://electronics360.globalspec.com/article/7007/toshiba-and-western-digital-open-new-flash-memory-fab-in-japan

Friday, July 15, 2016

Samsung Electronics seeks stake in China electric carmaker BYD


South Korean technology giant Samsung Electronics Co Ltd on Friday said it is in talks to acquire a stake in Chinese automaker BYD to boost its chip business for electric cars.
In December, Samsung Electronics, the world's top maker of smartphones and memory chips, created a team to develop automotive-related businesses, seeking a new growth engine as the global smartphone industry is slowing.
Automakers and technology companies have formed a series of partnerships in recent years as the race to develop electric, self-driving, internet-connected vehicles has created demand for more electronics components and software.

"The latest investment aims at strengthening electric vehicle parts and smartphone parts businesses for the two companies," Samsung said in a statement.
"We plan to discuss cooperation in various businesses going forward."
Samsung said it has not finalised how much it would spend to buy the stake, nor how big a holding it would take in BYD, which specializes in electric vehicles and is backed by Warren Buffett's Berkshire Hathaway Inc.
The Korea Economic Daily reported earlier on Friday that Samsung agreed to buy new shares worth 3 billion yuan ($449 million) in BYD, which would give Samsung a 4 percent stake in the automaker.
BYD confirmed in a stock exchange filing that Samsung Electronics had participated in their non-public issuance, but did not disclose the amount of its investment as the offering had yet to close. The automaker, however, denied Samsung Electronics would buy a 4 percent stake as reported in the Korea Economic Daily.
The Korean company's shares firmed 1.2 percent, versus the broader market's 0.3 percent rise, hitting their highest levels in more than three years and extending gains posted since it said last week it expected a 17.4 percent rise in quarterly profit.
Shares in the electronics firm's affiliate Samsung SDI jumped more than 8 percent in early trading in Seoul on hopes that it might be in line to supply electric vehicle batteries to BYD.
But Samsung denied that battery supply was part of the BYD tie-up. Samsung SDI shares trimmed gains and were traded flat as of 0500 GMT.


http://www.reuters.com/article/us-byd-samsung-elec-equity-idUSKCN0ZV09A

Thursday, July 14, 2016

TSMC’s Outlook Tops Estimates as IPhone 7 Helps It Defy Slowdown

Taiwan Semiconductor Manufacturing Co. forecast better-than-anticipated sales as Apple Inc. prepares to trot out its latest iPhone, helping the chipmaker defy the mobile industry’s worst-ever downturn.
TSMC gave its outlook after reporting second-quarter profit that topped analysts’ projections, as demand from up-and-coming Chinese smartphone brands such as Oppo and Vivo filled a void created by the global slowdown and a months-long lull ahead of the iPhone 7’s debut.
The world’s largest contract chipmaker, as a major supplier to Apple and other industry heavyweights from Qualcomm Inc. to Huawei Technologies Co, has emerged as a key industry bellwether. It’s now grappling with a pronounced slowdown in global demand, with Apple predicting its second straight revenue decline and smartphone sales in 2016 seen rising by a single-digit percentage for the first time, according to Gartner Inc.
But TSMC’s lead in chipmaking technology is helping it buck the doldrums. As one of the key suppliers for the iPhone, TSMC may already have begun to crank out chipsets for the latest model, according to SinoPac Securities Investment Service. Smartphone-related demand will support half of the Taiwanese company’s growth in the coming five years, said Mark Liu, TSMC’s co-chief executive.
For a Gadfly column on TSMC’s results and outlook, please click here.
Demand for lower-end Qualcomm chipsets from Chinese brands “are keeping TSMC’s factories busy,” said Roger Sheng, a research director at Gartner Inc. “Although the iPhone series wasn’t doing well this year, TSMC was able to get the majority of iPhone chip orders, which remains a lucrative deal for them.”
TSMC now supplies more than half the world’s smartphones, Liu told investors on a call.
The custom chipmaker, which competes with Samsung Electronics Co. to make processors for Apple, is predicting revenue of NT$254 billion to NT$257 billion for third quarter, exceeding the NT$250.1 billion that analysts predict on average. That’s coming off its third-highest quarter for sales on record and a second-quarter net income of NT$72.5 billion, which also topped estimates.
Gross margins came to 51.5 percent in the second quarter, up from 44.9 percent in the previous three months and surpassing the estimate. Margins had declined due in part to an earthquake that disrupted production in February.
TSMC’s shares ended Thursday up 0.3 percent. The stock has gained about 18 percent this year and is hovering near an all-time high.
“The rising popularity of Oppo and Vivo smartphones provides upside potential to our FY16-18 sales forecasts,” CIMB Securities Ltd. analysts led by Eric Lin wrote before the results.
Scale is pivotal in an industry grappling with rising production costs and intensifying competition. TSMC’s now targeting capital spending of $9.5 billion to $10.5 billion in 2016, up from a previous target of $9 billion to $10 billion as it continues to upgrade and expand its manufacturing capabilities to hold rivals at bay. The company now plans to erect a $3 billion wafer plant in eastern China to help it win more clients in the country.But questions remain about when investments in more advanced 7-nanometer and 10 nanometer production processes will start to pay off. Gokul Hariharan, an analyst at JPMorgan Chase & Co., downgraded TSMC to neutral from overweight, warning that the third quarter is likely a peak for the Taiwanese giant because demand for those higher-end processes may not fully materialize till 2018.
While smartphone sales growth is slowing, shipments should continue rising between now and 2020 and TSMC in turn would benefit, said Steve Myers, an analyst at Haitong International Securities Group.
“Is there growth likely from the aggregate of TSMC’s customer base? Probably yes,” he said. “I don’t see any reason to assume that either, both or neither 2017 and 2018 will be gap years.”

http://www.bloomberg.com/news/articles/2016-07-14/tsmc-profit-tops-estimates-as-chinese-phones-make-up-for-apple

Wednesday, July 13, 2016

Microchip to boost 8bit AVR range following acquisition

What is going to happen to Atmel’s 8bit AVR microcontrollers now that Microchip has bought the company?

Nothing bad, is the short answer, according to Microchip’s strategic marketing manager for 8bit MCUs Lucio Di Jasio.
“There is a new generation of AVRs coming in the summer, if anyone doubted it,” he said.
Long-time Microchip employee Di Jasio is now free to admit a secret admiration for the AVR architecture since it appeared in 1997 – with all the advantages that two decades of architectural innovation had delivered since 1976 when the first PIC was introduced.
According to Di Jasio, the 8bit PIC and 8bit AVR design teams (the latter based in Trondheim Norway), have more than warmed to each other since they were merged following the acquisition.
“It was like twins separated at birth. Most people in Microchip 8bit division are really excited. We talked to the Atmel 8bit guys, and we realised we came up with same solutions for same customers,” he said. “Atmel had been focusing on its [ARM] Cortex-based 32bit parts, and they were pleased that Microchip focuses on 8bit. We really believe in 8bit continuing to develop, and we are going to do the same for AVR. We have consistency of purpose.”
That said, from the 32bit point of view, “the addition of all the new Cortex devices represents an important expansion of our portfolio”, added Di Jasio.
New AVRs
With the introduction of its ‘F1’ PICs five years ago, Microchip added what it calls Core Independent Peripherals – peripherals that can be set-up to co-operate while the processing core concentrates on other tasks, or sleeps to save power.
Microchip’s view is that these peripherals are most valuable when they are used to stretch the performance of low-pin-count PICs – 14-28pins – as it allows them to be used in applications not normally open to 8bit parts.
Atmel has Event System, a mechanism through which peripherals can communicate, and has been modifying peripherals to work with it.
“Atmel had done some development of core-independent peripherals, but put the innovation into the XMega family – very large chips with a lot of pins,” said Di Jasio. “We immediately discussed putting the core-independent peripherals into its [lower pin-count] Tiny and Mega ranges.”
And these are the parts that will start to appear in September.
Microchip doesn’t have a name for the logic in PICs that does the same job as Atmel’s Event System, and Atmel never separately branded its core-independent peripherals.
“We are merging our vocabulary for when we talk to customers,” said Di Jasio. “There is going to be a lot of cross-pollination.”
Tools
Both firms have integrated development environments – MPLAB for Microchip and Atmel Studio for Atmel.
Is Microchip going to combine them?
“These are two pretty complete tool sets, and there is no way of saying one is better than the other,” said Di Jasio. “We want to be very cautious as we move along because it gets very personal to developers very quickly.”
Some are resisting integration:
Microchip made a major change to MPLAB six years ago, moving from PC-only MPLAB 8 to Java-based MPLAB-X which works on Windows, Linux and MacOS.
“I still meet customers that say MPLAB 8 was much better, and people still download it every day,” said Di Jasio.
On the flip-side:
“Some users have been using both Microchip and Atmel architecture for many years and immediately asked us to unify,” said Di Jasio. “Our main concern is that we don’t want to alienate users; we don’t want people to think we are going to dictate the future.”
So any changes are going to happen slowly and carefully: “We see some low-hanging fruit,” said Di Jasio. “It is easy to merge some pieces under the same umbrella.”
One of those is compilers.
C compilers for PIC24 and PIC32 microcontrollers are derivatives of the GCC architecture and are already integrated into MPLAB-X. As the AVR compiler is also GCC-derived, it would fit onto the hooks already in MPLAB-X.
Atmel’s ‘Start’ automatic code generation is another.
Microchip has a tool – both MPLAB-based and web-based – called Code Configurator that simplifies the creation of start-up code. The user selects a particular PIC and fills in a series of dialogue boxes that describe the required initial state of on-die peripherals. The tool automatically writes C to set the chip into that state.
Atmel’s Start is similar, but only works for Atmel’s 32bit processors – a situation that is due to change in September when Start will support the new 8bit AVR product line.


http://www.electronicsweekly.com/news/products/micros/microchip-to-boost-8bit-avr-range-following-acquisition-2016-07/

Tuesday, July 12, 2016

This mobile chip is faster than the one in Samsung's Galaxy S7

A mobile chip faster than the one in flagship smartphones like Samsung's Galaxy S7 and LG's G5 will start appearing in handsets this quarter.

The Snapdragon 821, announced by Qualcomm on Monday, is an incremental upgrade to the Snapdragon 820. In addition to mobile phones, it's also aimed at tablets, drones, robots and virtual reality headsets.
The Snapdragon 821 is about 10 percent faster than its predecessor. It is also more power-efficient, meaning batteries in smartphones and phablets will last longer.
Smartphone buyers can look at smartphone specifications to see if a device has a Snapdragon 821 or 820.

Qualcomm is now the top dog of mobile chip companies, with Intel exiting the race. The company routinely releases incremental upgrades to its top-line chips. It released the Snapdragon 801 chip in 2014, with performance and graphics improvements, as an upgrade to the Snapdragon 800.
The Snapdragon 821 will boast minor graphics improvements, so smartphones with the new chip will be better equipped to handle Google's DayDream mobile VR platform, for example.
The chip can also process 4K video in smartphones to show on external displays.
The Snapdragon 821 will have an integrated modem that can provide download speeds up to 600Mbps (bits per second), which is the same as its predecessor.
The CPU will operate at speeds of up to 2.4GHz. The chip is based on a homegrown architecture code-named Kryo.
Qualcomm didn't provide further details, saying they would be shared at a later date. But it's safe to assume the new chip will support LPDDR4 memory, and even Windows 10 Mobile, which works with Snapdragon 820.

http://www.networkworld.com/article/3093441/this-mobile-chip-is-faster-than-the-one-in-samsungs-galaxy-s7.html

Monday, July 11, 2016

Trade, Innovation Get Major Boost with ITA Expansion


By eliminating tariffs on trade in tech products, ITA expansion will spur an estimated $190 billion in annual GDP growth globally.

Last week, as many Americans were busy finalizing plans for Independence Day weekend, a new trade agreement took effect that eliminates tariffs on a vast array of tech products, including next-generation semiconductors. The Information Technology Agreement (ITA), first agreed to 20 years ago, on July 1 began expanding to cover a whopping $1.3 trillion in tech products, including myriad new devices that have sprung to life over the last two decades. The expanded ITA is a hard-fought victory for free trade, innovation, the semiconductor industry, and America’s economic strength and global competitiveness.
By eliminating tariffs on trade in tech products, ITA expansion will spur an estimated $190 billion in annual GDP growth globally. The agreement covers a long list of products such as MRI machines, GPS devices, solid state drives, video game consoles, loud speakers, video cameras, and sophisticated testing equipment. It also includes advanced semiconductors known as MCOs and a wide range of other products that depend on semiconductors. For the MCOs alone, the ITA will eliminate hundreds of millions of dollars in tariffs annually, and that number is expected to rise considerably as use of MCOs becomes more widespread.
Tariffs on some products will disappear immediately, while other tariffs will be eliminated over the next several years in a process known as “staging.” While the vast majority of ITA countries completed the necessary domestic procedures to begin implementing tariff elimination on these products immediately, there are a few notable slowpokes. China, Korea, and Japan, for example, did not yet complete the technical customs work they needed to do to start tariff cuts on July 1. While disappointing, we are hopeful they will get this work done in the coming months.
These hiccups aside, the free flow of tech products across international borders made possible by the ITA is great news for consumers. By eliminating tariffs on a vast array of tech products, more businesses will be able to ship their goods to customers the world over, allowing for the spread of technology and greater economic opportunities in disadvantaged areas of the world. Eliminating tariffs on these products also helps keep costs down for consumers here in the U.S.
The story of ITA expansion is a reminder of what can be accomplished through hard work and international collaboration. The effort kicked off with a major conference at the World Trade Organization (WTO) in Geneva in May 2012. It has been a long and sometimes bumpy road since that time, involving countless negotiating rounds in Geneva, myriad statements of support by the Asia-Pacific Economic Cooperation economies, significant backing from a global coalition of over 80 trade associations, and substantial work by international negotiators and industry stakeholders. The discussions experienced their share of fits and starts, but on July 1 the effort proved to be well worth the wait.
In addition, ITA expansion marks a meaningful win for the WTO and stands to give greater momentum to other tariff-elimination agreements, including the Environmental Goods Agreement and the ongoing Trade in Services Agreement talks. All these negotiations represent an important new template for the WTO to make needed progress in opening markets around the world.
The expanded ITA will strengthen the semiconductor industry, the tech sector, and the U.S. economy. In the midst of heated anti-trade rhetoric in the U.S. presidential campaign and the reverberations felt around the world as a result of Brexit, July 1 was a good and much-needed day for trade and innovation the world over.

http://www.eetimes.com/author.asp?section_id=189&doc_id=1330067

Friday, July 8, 2016

MediaTek reports revenue hit all-time high in June

Handset chip designer MediaTek Inc (聯發科) yesterday reported quarterly growth of about 30 percent in second-quarter revenue after revenue hit an all-time high last month, underpinned by rebounding demand for 4G smartphones in China and emerging markets.
Revenue last month rose 0.95 percent from May to NT$24.87 billion (US$769.83 million), which brought revenue for the quarter that ended last month to NT$72.53 billion, MediaTek said.
MediaTek, which counts several Chinese handset vendors among its clients, generated NT$55.91 billion in revenue in the first quarter.
The second-quarter figure fell in the high end of the company’s revenue forecast, which ranged from NT$69.3 billion to NT$73.8 billion, but surpassed HSBC Securities Taiwan Corp analyst Yolanda Wang’s (王郁雅) projection of NT$71.44 billion and the NT$71.29 billion predicted by Macquarie Capital Securities Ltd’s Patrick Liao (廖光河).
Accelerating migration to 4G handsets in China and developing markets is to drive revenue growth in the second half and for the whole year of this year, MediaTek chairman Tsai Ming-kai (蔡明介) said last week, adding that a shortage of chips would extend into September.
MediaTek’s chip packaging services provider, Advanced Semiconductor Engineering Inc (ASE, 日月光半導體), yesterday said consolidated revenue last month grew 5.7 percent from May’s NT$20.6 billion to NT$21.77 billion.
In the second quarter, ASE’s consolidated revenue grew 0.4 percent quarter-on-quarter from NT$62.37 billion to NT$62.6 billion.
Revenue from its core businesses, chip testing and packaging services, increased 8.3 percent quarter-on-quarter from NT$35.54 billion to NT$38.5 billion in the second quarter, in line with the company’s expectation of “mild sequential growth.”
Separately, United Microelectronics Corp (UMC, 聯電), the world’s No. 2 contract chipmaker, yesterday posted record revenue of NT$13.53 billion for last month, with quarterly revenue growing 7.56 percent from NT$34.4 billion in the first quarter to NT$36.97 billion.
However, Vanguard International Semiconductor Corp (世界先進), which makes controller chips for LCD panels, and memorychip maker Marconix International Co (旺宏電子) reported that monthly revenue last month declined 4.6 percent to NT$2.21 billion and 2.3 percent to NT$1.7 billion respectively.
In the second quarter, Vanguard reported that quarterly revenue increased 4.02 percent from NT$6.22 billion to NT$6.47 billion, while Macronix’s quarterly revenue expanded 1.77 percent from NT$5.09 billion to NT$5.18 billion.

http://www.taipeitimes.com/News/biz/archives/2016/07/08/2003650564

Thursday, July 7, 2016

Taiwan Tech Industry Faces "Greatest Challenge" As Rival China Backs Nat'l Champions

Taiwan’s electronics industry has been a pillar of its prosperity for the past four decades, turning the island into a key supplier for the likes of Apple, IBM and Dell, and spawning billionaires such as Hon Hai’s Terry Gou and Quanta’s Barry Lam.
Yet rising competition from China is increasingly challenging Taiwan.  Just how badly?  To learn more, I exchanged with Matt Cleary, head of research at Trenchant Tech Research in Taipei.  Excerpts follow.
Q. The fortunes of Taiwan’s richest tech entrepreneurs are lower on the new Forbes Taiwan Rich List in part of because of relatively short-term worries about orders from Apple. (Click here for link to main list.)  Longer term,  how seriously is Taiwan’s electronics industry being challenged by mainland China companies in global markets?
A. Taiwan’s electronics industry is arguably facing its greatest challenge ever, as both the central government in Beijing and the regional and city governments throughout China are redoubling efforts to bolster domestic, state-invested competitors. Under these subsidy regimes, system makers which can reach a targeted percentage of component value from approved vendors are granted what, by the standards of prevailing profit margins are massive rebate subsidies. Whereas mere import substitution had once been a sufficient goal of state policy, now the Chinese government is trying to foster domestic champions.
Q. Which segments of the industry are most threatened for Taiwan and why?
A. Clearly the smartphone and tablet food chain companies are the most vulnerable, followed by the PC component group. Conversely, networking and automotive component makers are far less vulnerable. Moreover, there are certain products such as high-end camera lenses and 4K LCD TV panels where the inherent engineering challenges will buffer the leading manufacturers, such as Largan Precision and AUOptronics, respectively. TSMC should also be largely insulated, as advanced wafer foundry too is an area with steep technological barriers to entry.
As for why the smartphone and tablet food chain, I would say that the reasons are mainly threefold. First, these are areas where the Chinese government has most focused it subsidies, as these are large and still growing segments. So it makes sense to concentrate efforts here. Secondly, most of the components going into mid-range and low-end smartphones and tablets are less technically advanced, and thus within the reach of aspiring new Chinese competitors. Finally, these are consumer products where there is both more willingness to buy lesser-known brands, and less overall end-market scrutiny of the components within. The situation is very much the opposite in both networking and automotive electronics.
Q. Do you expect China’s capabilities to  continue to improve and and why?
A. I expect that we will continue to see Chinese would-be national champions narrow the technological gap, although this will happen at varying degrees. These barriers to entry will likely prove most durable in foundry wafer production. But these technology deficits should also prove relatively persistent in advanced displays and optics, as resolution migrations continue. While IC packaging and testing has thus far suffered little impact from the so-called “red supply chain,” we are concerned that the advantage of the Taiwanese incumbents ASE and Siliconware Precision will prove less durable over the 2-3 year view. Global chip makers are eager to avoid being singled out, as Qualcomm was in recent year. One way that they’ll seek to do this is to engage in hand-holding of Chinese manufacturers, helping these newer entrants up the quality curve.
Q. How does the ASE-SPIL deal fit into this picture?  Originally, SPIL was looking to team up with a mainland investor that was also looking to invest in other Taiwan tech companies (Tsinghua Unisplendor).
A. We are pretty skeptical that the ASE-Siliconware Precision tie-up will yield a great deal of benefits without any integration of the two companies. Simply putting these two competitors under the same umbrella company is likely to yield meager benefits in such areas as procurement of supplies. Moreover, combining the industry’s largest and third-largest players is likely to increase their customers’ interest in fostering Chinese suppliers which can meet their technological requirements. Even if the new umbrella firm were to invite Chinese investment, it is very unlikely to be of the scale necessary for the firm’s products to be considered domestic Chinese content.
Q. What are the risks for the likes of Hon Hai and Quanta?
A. The risk is that the Chinese government continues to throw state funds at the tech sector in a desperate effort to foster world-class players. They’ve already seen, for instance in foundry chip production, that a decade and a half of lavish subsidies have not enabled SMIC to either appreciable close the technology gap nor win leading-edge orders from global chip makers without the sort of behind-the-scenes arm-twisting that Qualcomm has suffered. This sort of industrial coercion can only get China’s national champions so far, as the SMIC case clearly demonstrates. The risk to Taiwanese component vendors is that not all segments of the electronics industry place such a high premium on cutting-edge technologies as do high-end logic chips. Companies like Hon Hai may have some ability to defend themselves through their global network of clients, manufacturing capabilities, and distribution. But even Hon Hai is not immune to these pressures.
Companies like Delta and Quanta however have a few relatively more sheltered, more technologically-intensive product areas where they can easily hold off the new entrants from China. In the case of Quanta, servers and other data center hardware will play that role. For Delta, automotive electronics should offer them a means to win business that the global car makers are unlikely to entrust to Chinese firms. Even HTC is likely to find refuge in its Vive line of VR hardware, given the company’s early-mover status and the fact that they’ve aligned themselves with a very capable software partner in the form of Steam. HTC’s management have clearly learned from their smartphone struggles the importance of establishing a viable platform. And we believe that they’re well positioned to do so in VR in a defensible manner.
Q. You mentioned AUO.  What’s ahead for Innolux?
A. I’m personally quite optimistic about both Innolux and AUO. While both of the Korean display giants (Samsung and LG Display) have tried to avoid rising Chinese completion by shifting to organic light-emitting diode (OLED) displays, both have struggle to really make this pay off. In the meantime, both AUO and Innolux have worked to leverage their expertise in LCDs. And this ha worked out well for them, especially as the migration to 4K (UHD) TVs has happened more quickly than expect. While the Chinese display makers have used lavish government subsidies to build new capacity, they’ve found that quadrupling pixel density a massive engineering challenge. Their resulting low yields have muted the resulting supply impact. At the same time, TV makers are telling us that Samsung is unable to fill orders for a number of TV panel sizes, as they are also suffering product migration hiccups, as they try to move to thinner motherglass and incorporate other new technologies. Consequently, we’ve seen prices for some panels bounce by as much as 15% from their lows, with further gains likely.
For Innolux, the big question is of course what Hon Hai boss Terry Gou plans to do with the newly-acquired Sharp assets. While many in the industry expect that he will ultimately find a way to leverage Sharp technologies within Innolux, he has yet to show his hand. Innolux has already completed an important transition, migrating a great deal of the labor-intensive, ‘back-end’ module assembly back to Taiwan – a move that will both yield logistical efficiencies, and enable the company to avoid rising Chinese wages by applying greater use of automation back home in Taiwan. These changes leave Innolux in a strong position.
http://www.forbes.com/sites/russellflannery/2016/07/06/taiwan-tech-industry-faces-greatest-challenge-as-rival-china-backs-natl-champions/#79801d653f19

Wednesday, July 6, 2016

Why DRAM Prices Are Expected to Rise in Q3

Demand for instant application performance is up, but supply is down in the DRAM production business, thanks to several factors.

With more demand in the markets for real-time or near real-time performance in enterprise and mobile applications, DRAM (dynamic random access memory) is now becoming a hotter commodity, and market prices are soon going to show it. DRAM is used in virtually all smartphones, laptops and tablet PCs to handle hot data and in most servers for in-memory-based applications. In-memory servers such as SAP's HANA and Oracle's Database In-Memory run their entire application in DRAM. DRAMeXchange, a division of market analyst TrendForce, reported July 5 that DRAM prices -- which had been in decline from October 2014 to June 2016 -- have leveled off and will be going up during the coming months. Over the last two years, the average contract price of 4GB DDR3 plunged 62 percent, from $32.75 to $12.50. DRAMeXchange expects DRAM contract prices to rebound up in the third quarter, with the increases ranging from about 4 percent to 8 percent, due to a tightening of supply because of a downturn in sales of laptop PCs and other factors.

According to Avril Wu, DRAMeXchange research director, demand from mobile and server applications will be the main driving force that help raise average contract prices in the DRAM market during the third quarter. But PC demand remains in a slump, and the Windows 10 licensing scheme, which sets fees according to system specs, further discourages PC vendors from increasing the memory content per box for their products.
The effects of tight supply in the NAND flash market also will contribute to the rebound of DRAM prices in the coming months, Wu said. Strong demand for solid-state disks have raised flash prices, and NAND flash and DRAM work together in virtually all connected devices. Another factor is that Samsung's memory fab in Xian, China, suffered a sudden power outage on June 18. Since this accident cut out a day's worth of NAND flash and DRAM supply for memory module makers, spot prices for both products jumped across the board. In other DRAM news, Micron recorded a loss in its third fiscal quarter from March to May and said it is planning to cut 2,400 jobs. At the same time, however, Micron continues to search for various forms of partnerships within the DRAM industry. Last year, Chinese technology conglomerate Tsinghua Unigroup tried to acquire Micron for $23 billion, but the deal was blocked by the Committee on Foreign Investment in the U.S. (CFIUS). There are reports that China's semiconductor sector is again gathering forces to make another offering to Micron concerning other non-DRAM products. Such a deal would not come in conflict with Micron's plan to acquire Inotera. On the other hand, another U.S.-based semiconductor company has been recently reported to be in talks with Micron as well. DRAM is a type of random-access memory that stores each bit of data (1 or 0) in a separate capacitor within an integrated circuit. Since even non-conducting transistors always leak a small amount, the capacitors will slowly discharge, and the information eventually fades unless the capacitor charge is refreshed periodically. Because of this refresh requirement, it is a dynamic memory as opposed to static random-access memory (SRAM) and other static types of memory. Unlike flash memory, DRAM is volatile memory, since it loses its data quickly when power is removed.
http://www.eweek.com/pc-hardware/why-dram-prices-are-expected-to-rise-in-q3.html

Tuesday, July 5, 2016

1 year later: GlobalFoundries East Fishkill is "innovation hub"

A year after GlobalFoundries was paid $1.5 billion to take over the IBM microchip business, it has established itself as the second largest chip manufacturer in the world.
GlobalFoundries, designers and manufacturers of nanotechnology for everything from faster, more powerful smartwatches and smartphones to missiles and satellites, jumped from fourth to second in terms of revenue following the takeover of IBM's microchip manufacturing facilities in East Fishkill and Burlington, Vermont, last year, according to Gartner, a high-tech research firm.
GlobalFoundries had nearly $4.7 billion in revenue in 2015, up from $4.4 billion in 2014. GlobalFoundries now has control of 9.6 percent of the market. The world’s largest chip manufacturer, Taiwan Semiconductor Manufacturing Co., had $26.5 billion in revenue last year.
One year after the acquisition, GlobalFoundries executives say they are leveraging the might and prestige of former IBM researchers and developers from East Fishkill to create what they call an “innovation hub” there. The company is looking to shed unused or underused buildings at the southern Dutchess campus as it faces uncertain economies in Europe and Asia and a tepid semiconductor sales market.

An innovation hub 

The fabrication facility at East Fishkill is also part of a burgeoning Northeast Technology Corridor, which includes GlobalFoundries’ Fab 8 facility in Saratoga County and research and development locations at SUNY Polytechnic Institute’s College of Nanoscale Science and Engineering in Albany.
As part of the deal, GlobalFoundries acquired the East Fishkill chip fabrication facility and absorbed 5,000 employees, bringing the number of employees up to roughly 18,000. Those former IBMers now work in East Fishkill or Burlington, Vermont.

In the deal, GlobalFoundries also acquired thousands of patents and inventions from IBM created at the East Fishkill site since 1962. Since July 2015, the company added an additional 142 patents. All told, GlobalFoundries now has 10,000 patents.
By leveraging the experience and research of the former Big Blue staff, GlobalFoundries was able to secure a major government contract in June to supply microchips for U.S. spy satellites, missiles and combat jets.

In the future, GlobalFoundries plans to improve on its current technology to create applications for drones, robotics and even self-driving cars, executives say.
“What we are trying to do in East Fishkill now is we are trying to use Fishkill as an innovation hub,” said Anthony Yu, head of East Fishkill’s innovation and technology division. “We have tremendous technologists and people here know they are part of a leading semiconductor innovation here. Employees are excited. They are really driving these new product releases.”
One of the latest developments in innovation at East Fishkill, and one that also leverages 10 years of research at IBM, is the rollout of silicon photonics. Silicon photonics is technology that enables a device such as a smartphone to send enormous amounts of data over great distances using light, allowing for faster bandwidth speeds.
With the explosion of real-time video, texting of photos, and downloading movies onto your phone, photonics allows you to pass huge amount of data at faster speeds and without errors, according to Yu.
“It’s the perfect storm,” Yu said. “He were are in Fishkill, a high volume manufacturing site, leveraging the research that IBM was developing with us as we became GlobalFoundries. We are seeing the demand for bandwidth double every three years. There’s an incredible appetite for bandwidth and we are rolling out products next year to meet those demands.”
Basically, it means computing at the speed of light. And, who wouldn’t want a faster smartphone?

“As I travel, I see people on the plane watching movies on their phones. The appetite for data transmission is going up. It’s not going to slow down,” said Mike Cadigan, senior vice president for product management at GlobalFoundries. “A lot of people’s lives are tied to phones. That will continue to drive massive amounts of data and video. Meanwhile, voice is becoming the lowest consumption of bandwidth.”
But, as technology becomes more advanced and expensive to develop, executives say they will have to be mindful of cost-competitiveness with other chip manufacturers.
“We’re in an industry that is very competitive,” Cadigan said. “In every location, there is a drumbeat around cost competitiveness. You’re not going to avoid it — no matter where you go.”

New company, new culture

As a result of the transition, the culture at the East Fishkill site also has shifted, according to executives.
Cadigan said that former IBM developers, who once had to focus on a myriad of things, including keeping an eye on the financial markets, are now solely focusing on what they do best: designing semiconductors.
“Employees appreciate that,” he said. “They know when they come in to work each Monday that they are going to be working on semiconductors — that’s it. It’s good for morale and it’s good for our focus.”
Nate Buel, of Hyde Park, works on the production side of GlobalFoundries at East Fishkill as a senior wafer fab line lead. Before the acquisition, Buel worked with IBM for 16 years. One year later at GlobalFoundries, Buel said he has noticed “a lot more positive energy” around the fab.
“We were always compared to other groups and always held accountable for different sectors,” Buel said about his time at IBM. “We were always wondering how we can make more chips. Now, we don’t have to worry about other sectors and whether (it will effect) our raises. We know what our goal is.”
Buel said he felt a change in the culture most recently when he was able to bring his family to the fab as part of Family Day. Employees' families took tours of the facility, ate ice cream and even got to douse executives in a dunking booth. Family Day was once a popular tradition at the fab site under IBM but had been abandoned in recent years.
“It was something we always heard about it,” he said about Family Day. “It was great to let (my family) see what we actually do all day.”

Buel said he feels optimistic about his future at GlobalFoundries.
“I think we hit the mark this year,” he said. “We’re less concerned about the transition. There is a lot more positive energy, and I feel pretty confident going forward (with GlobalFoundries).”
Going forward, there are some challenges ahead for GlobalFoundries. Mainly, balancing costs of manufacturing of its technology within an unpredictable and competitive marketplace. In East Fishkill, executives are faced with selling more than 50 percent of the property or 300 acres, much of which has been vacant for several years.
But, with the successful transition, GlobalFoundries executives in East Fishkill say they are optimistic about the future.
“It could not have gone better. There’s a track record in the technology industry that these types of mergers do not play out very well,” Cadigan said. “…We beat the odds — bar none.”
Cadigan is the former head of IBM Microelectronics. Now he leads worldwide sales for the company, and, although his office is in East Fishkill, he often spends his time traveling the world to meet with each of the company’s 250 multinational corporate customers.
“The motivation, the excitement, and the response in the marketplace has been very, very positive for us and our people,” he said.

Time of change

A year ago, IBM, which was among the first companies to develop the transistors that eventually became microchips, suddenly found itself falling behind companies whose sole business was microchip manufacturing. The company was quickly losing money. As the chip market became more competitive, it was untenable for IBM to continue to produce the chips and expect to remain a major player in the market.
But, IBM still needed chips for its own hardware products and a buyer for its East Fishkill site. GlobalFoundries, which was launched in 2009, had been slowly buying up smaller manufacturers, but was competing with chip makers who had a well-established client base. Seeing the needs of each company, IBM and GlobalFoundries struck a deal.
GlobalFoundries still supports IBM’s mainframe products as part of a 10-year deal to supply high-end chips. The chips are manufactured in East Fishkill, sent to GlobalFoundries location in Burlington to be packaged and then shipped to IBM in Poughkeepsie.
"IBM’s strategy is one of innovation, transformation and a constant evolution," said Jamie Thomas, general manager of Strategy and Development at IBM Systems. "As IBM continues to perform the fundamental research, as well as semiconductor circuit and system design, GlobalFoundries has proven to be a trusted manufacturing partner and supplier. Systems of the future will continue to be differentiated at the systems and chip design level, which is where IBM is focused."

Future challenges

Unpredictable stock markets, such as in China, and Britain’s vote to exit from the European Union create unknowns for the company.
“Brexit was a surprise,” Cadigan said. “We continue to see ramifications of that. My call is that it will level out, but it will take a little time. Right now, we haven’t seen any fatal signs, but it is still pretty early since the post-Friday outcome. We have a senior meeting coming up. Part of the discussion is going to be, ‘What headlights can we draw from this thing? What could it mean to us?’”

Semiconductor sales across the market were off to a sluggish start in 2016, according to the Semiconductor Industry Association. Industry forecast projects sales will decrease 2.4 percent in 2016, but increase 2.0 percent in 2017, according to the association.
“The pundits who predict the industry outcome for 2016, there is some scatter around those numbers, some people would say the industry will be flat this year,” Cadigan said. “That’s after a relatively flat or slightly minus last year. A lot of it depends on what market segments you service. Fortunately, for us, we serve two of the market segments. One that is doing quite good — the enterprise segment, the networking also known as cellphone data traffic infrastructure. The other segment is smartphone.”
One way to ensure their success, executives say, is to continue to expand. Although the company is based in Silicon Valley, it has manufacturing operations in Malta, New York, Dresden, Germany, and Singapore, in addition to the East Fishkill and Essex Junction sites.
Most recently, GlobalFoundries announced it has a memorandum of understanding to establish a joint venture in China to manufacture silicon there. Cadigan said that the company hopes to reach a definitive agreement in August.
“It’s competitive market, but if you are going to be a major player in China you have to have a facility in China. There are indications that the Chinese government is putting additional pressure on companies if they are consuming silicon that the silicon has to be made onshore,” Cadigan said. “Maybe that is not today, maybe it’s not tomorrow, but it could eventually occur. So we moved ahead.”
Changes also are in the works for the East Fishkill site.

Once rolling farmland in southern Dutchess County, the 464-acre plot that sits between Route 52 and Interstate 84 in the Town of East Fishkill has become a massive microelectronics complex.
But more than 50 percent of property at GlobalFoundries has been dormant in the past year. Approximately 300 acres will be up for sale. That includes parking lots, woods and 10 buildings with a range of square footage.

Some of the larger buildings were built specifically for industrial manufacturing, while some of the smaller buildings were constructed for mixed use. It would be up to the new property owners to decide whether to redevelop the buildings or tear them down and start from scratch.
Cadigan said the company is still discussing strategies to divide and sell the property with the town.
“The town has been very supportive. The underutilized space and buildings don’t do a lot for commerce,” Cadigan said. “So, if we can do something on the development side, we see it as a positive for the community.”

http://www.poughkeepsiejournal.com/story/news/2016/07/02/1-year-later-globalfoundries-east-fishkill-innovation-hub/86467900/

Friday, July 1, 2016

FDA Clears Use of Electrosurgical Device in Pediatric Patients

JustRight Surgical, LLC, a pediatric medical device company, has received FDA clearance for specific use of their 3mm vessel sealing system in pediatric surgery.
To achieve the additional clearance from the FDA, JustRight subjected its 3mm vessel sealer through rigorous testing, according to the company. The final data was presented at the Society of American Gastrointestinal and Endoscopic Surgeons (SAGES) clinical congress in May.
The sealer was shown to be safe to use in extremely tight or small spaces found in teens, children, infants and neonates. The new, low-power vessel sealing technology was found to permanently fuse vessels while using significantly less energy and was therefore determined to be safe to use in the smallest patients without risk of damaging critical, adjacent structures.
Company achievements have included development a 5mm stapler using the classic titanium wire staple in a clinically accepted "B" shape and the 3mm vessel sealer. Its devices, many of which are five to nine times smaller than previously available, are currently in use for general and thoracic procedures in more than 100 children's hospitals in the U.S. and Europe.
"Pediatric surgeons have been requesting 'right-sized' surgical instruments and technologies for years," according to Russ Lindemann, president and CEO. "This pediatric indication for use of vessel sealing is the first of its kind."
All of JustRight Surgical's products are designed and manufactured in the United States.

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