Monday, November 10, 2014

Issues in Solvent Testing for Counterfeits

http://www.us-tech.com/RelId/1337592/ISvars/default/Issues_in_Solvent_Testing_for_Counterfeits.htm


Fighting against counterfeit electronic components requires many tools, including multiple test methods to identify the counterfeits. Use of improper or incorrect testing procedures can lead to incorrect or misleading results, at times identifying authentic parts as being counterfeit.

Over the past few years, new techniques of black top, remark, and resurface marking tests have been implemented to discover nonauthentic marking and coating processes that have been used on electronic components and devices. While these tests can be very effective at identifying counterfeit plastic components, the same tests can also yield false positive readings for ceramic-packaged devices that have not been blacktopped/coated or on can package devices that have not been resurfaced. Some of the experiences with false results from solvent testing were reported at the recent Components for Military and Space Electronics (CMSE) conference in Los Angeles, CA (February 2014).

In one instance, a hermetically sealed non-resurfaced) packaged device which was authentic failed Dynasolve testing, which indicated that it was a counterfeit part. The part in question was a model SNJ54HC4040J from Texas Instruments (www.ti.com) which failed Dynasolve testing that should have never been performed. The component was falsely identified as counterfeit according to the Dynasolve test.
This shows a TO can (non-resurfaced) packaged device that would fail mineral spirits testing for authentic/counterfeit differentiation.
 


In another example, a model LM158H from National Semiconductor, which is supplied in a can-type package, failed mineral spirits testing for authentic/counterfeit verification. The testing on the can (non-resurfaced) device revealed an authentic part to be counterfeit. The mineral spirits testing should never have been performed on this type of packaged component, which are notably those in TO housings, such as TO-3 and TO-8 can packages.

Another category are QML components, which are supplied in hermetic housings, such as ceramic, glass, or TO can packages. These packages and their markings should never have been subjected to acetone, M2P, or Dynasolve solvents since they are not designed to pass these tests in checking for counterfeit/authentic product validation. These solvents should only be used to test plastic-encapsulated-microcircuit (PEMS) housings for blacktopping that had been used to hide any remarking that has been performed.

Experiences in testing a wide range of packaged devices and components for authentic/counterfeit differentiation has helped identify some proper testing methods for different components. The first group of these testing "lessons" applies to a nonmilitary, non-printed-circuit-board (non-PCB) assembly solvent test for remarking and resurfacing according to SAE AS6081, paragraph 4.2.6.4.3 requirements. For example, experience in the use of scrape testing have been useful in early stage detection of resurfaced electronic devices and components. An industry recommendation is for the single-use application of a sterile cotton-tip applicator (6-in.) and wood shaft specimen data collection applicator.

The second group of these testing "lessons" applies to military and industrial non-resurfaced PCB assemblies, for marking permanency testing. Marking permanency testing is performed per the requirements of military standards MIL-STD-883 for microcircuits and MIL-STD-750 for semiconductors. These tests are recommended for use with components and devices in hermetic ceramic and can-type packages which show no evidence of resurfacing as well as for aerospace and military marking tests for other components and devices. Testing involves the use of bristle brushes with three long rows of hard bristles, fabricated from nonreactive materials for checking the resurfacing of the components and devices under test.
Effective scrape testing can help reveal resurfaced electronic components.
 
As an example of testing on hermetically sealed ceramic packaged devices for the MIL-STD marking permanency tests, some test methods that have delivered good results with non-hermetic devices have not shown the same measure of success with hermetic devices. Such tests as mineral spirit tests, acetone tests, 1-methyl, 2-pyrrolidone tests, and Dynasolve tests have been vital in uncovering many anomalies associated with parts that have been remarked or resurfaced. But these same tests, when used improperly on hermetically sealed ceramic devices or can-type packages that have not been resurfaced, can provide false positive results for counterfeiting.

The proper exercises and applications for the first and second groups of devices/components to be tested include performing marking permanency testing according to MIL-STD-883 and MIL-STD-750 requirements for the first group of devices and components, and performing a solvent test for resurfacing according to SAE AS6081 Para 4.2.6.4.3 for the second group of devices and components.

Tuesday, August 26, 2014

Samsung, Micron May See DRAM Price Lift as iPhone 6 Crunches Supply Chain

http://blogs.barrons.com/techtraderdaily/2014/08/25/samsung-micron-may-see-dram-price-lift-as-iphone-6-crunches-supply-chain/?mod=BOLBlog

Cowen & Co.’s semiconductor analyst Timothy Arcuri today writes that pricing is set to rise for DRAM memory chips because the entire supply chain in Asia is being rocked by the rush to produce Apple’s (AAPL) iPhone 6.
That is leading to capacity constraints, which in turn may raise prices for DRAM for Samsung Electronics (005930KS) and Micron Technology (MU), two principal suppliers to the iPhone, even though the device itself won’t see a rise in DRAM content:
Our supply chain work in Asia suggests PC DRAM pricing is tracking to a ~3-5% M/M increase in Sept, owing to some pre-iPhone 6 launch supply constraints. While it is too early to see actual supply impact from Samsung ramping DRAM in S3 – likely starting CQ2:15 (we have long said 30k wsm is max it will ultimately produce) – Samsung is back in the supply chain on iPhone 6 for DRAM (in addition to MU via Elpida) after being excluded for iPhone 5/5S. So, we believe Samsung’s production has vectored to a large degree from PC DRAM to mobile DRAM; we feel this is unexpected by the market because Samsung mobile DRAM capacity was already tight based to some degree on captive smartphone demand. While this will help near-term pricing, we don’t see significant DRAM content increase in iPhone 6 unlike NAND where the SKU’s are likely to mix up from 64GB on high-end to now include a 128GB high-end model for both 4.7″ and 5.5″.
Arcuri thinks SanDisk (SNDK) may be a prime beneficiary of the NAND increase mentioned.
In the same report, Arcuri writes that a Chinese government investigation into Qualcomm (QCOM) “might come to a head in the near-term,” citing his examination of the matter and media reports. It may be Qualcomm takes a lower royalty rate, muses Arcuri, but “We feel that, even in a worst case where the NDRC would achieve lower royalty rates in China, QCOM would be better off to cede major swaths of royalties in China rather than jeopardize existing cash flows.”

Fairchild Semiconductor To Close Two Manufacturing Facilities In Realignment

http://www.rttnews.com/2374543/fairchild-semiconductor-to-close-two-manufacturing-facilities-in-realignment.aspx

 Chip maker Fairchild Semiconductor International Inc. (FCS: Quote) said Monday that it will close two manufacturing facilities and reduce its wafer fabrication lines as part of a realignment of its global manufacturing operations. The company noted that the realignment will enable it to improve product quality and lower costs.

San Jose, California-based Fairchild Semiconductor said it will eliminate its internal five-inch manufacturing facilities and significantly reduce its six-inch wafer fabrication lines. This will result in the closure of its manufacturing and assembly facilities in West Jordan, Utah and Penang, Malaysia, as well as the remaining five-inch wafer fabrication lines in Bucheon, South Korea.

Fairchild said the closures of the two manufacturing facilities in West Jordan as well as Utah and its fabrication lines in Bucheon, South Korea, are planned to occur from the second quarter to the fourth quarter of 2015.

The company is working closely with customers to complete the qualifications required and build adequate supply to support their needs. During the transition, Fairchild expects its internal and external supply chain to service customer orders without disruption.

Mark Thompson, Chairman and CEO of Fairchild, said, "The realignment we are announcing today will maximize the utilization of eight-inch factories and reduce the complexity of our manufacturing footprint, while creating the flexibility to support ongoing customer demand through a greater use of external manufacturing sources. Fairchild will continue operating eight-inch wafer fabrication lines in South Portland, Maine and Mountain Top, Pennsylvania, as well as the Bucheon six- and eight-inch fabrication lines."

Fairchild will also continue to operate the assembly and test facilities in Cebu, Philippines and Suzhou, China.

Chip maker Fairchild Semiconductor International Inc. (FCS: Quote) said Monday that it will close two manufacturing facilities and reduce its wafer fabrication lines as part of a realignment of its global manufacturing operations. The company noted that the realignment will enable it to improve product quality and lower costs.

San Jose, California-based Fairchild Semiconductor said it will eliminate its internal five-inch manufacturing facilities and significantly reduce its six-inch wafer fabrication lines. This will result in the closure of its manufacturing and assembly facilities in West Jordan, Utah and Penang, Malaysia, as well as the remaining five-inch wafer fabrication lines in Bucheon, South Korea.

Fairchild said the closures of the two manufacturing facilities in West Jordan as well as Utah and its fabrication lines in Bucheon, South Korea, are planned to occur from the second quarter to the fourth quarter of 2015.

The company is working closely with customers to complete the qualifications required and build adequate supply to support their needs. During the transition, Fairchild expects its internal and external supply chain to service customer orders without disruption.

Mark Thompson, Chairman and CEO of Fairchild, said, "The realignment we are announcing today will maximize the utilization of eight-inch factories and reduce the complexity of our manufacturing footprint, while creating the flexibility to support ongoing customer demand through a greater use of external manufacturing sources. Fairchild will continue operating eight-inch wafer fabrication lines in South Portland, Maine and Mountain Top, Pennsylvania, as well as the Bucheon six- and eight-inch fabrication lines."

Fairchild will also continue to operate the assembly and test facilities in Cebu, Philippines and Suzhou, China.

Through the combined actions, Fairchild expects to incur cash restructuring and other costs of about $36 million, and non-cash charges of about $25 million for accelerated depreciation.

On completion of the realignment, Fairchild expects to realize annual savings of about $45 million to $55 million from the second quarter of 2014 financial baseline. The company also expects about 75 percent of the estimated savings to be cash savings, with the balance attributable to lower depreciation costs.

FCS is trading at $17.03, up $0.01 or 0.03 percent on a volume of 193,102 shares.

Wednesday, July 23, 2014

STMicro Profit Turnaround Eclipsed by Optimistic Rivals

http://www.bloomberg.com/news/2014-07-23/stmicro-posts-first-profit-in-11-quarters-on-cost-cuts.html

STMicroelectronics NV (STM)’s first profit in 11 quarters, showing Europe’s largest semiconductor maker rebounding from its phone-chip troubles, was eclipsed by rivals’ more optimistic predictions for rising demand.
The chipmaker’s shares fell as much as 4.5 percent after its forecast for the current quarter lined up with analysts’ projections. In contrast, forecasts from Intel Corp. and Texas Instruments Inc. topped estimates, fueling expectations that the smartphone and personal-computer markets are picking up.
“It’s disappointing relative to peers,” said Janardan Menon, an analyst at Liberum Capital Ltd. in London. “ST’s quarter is broadly in line, but many companies in the sector are coming ahead of expectations.”
STMicro is reducing its reliance on the wireless business after shutting down its unprofitable phone-chip unit with Ericsson AB, focusing instead on the more lucrative power-management products, microcontrollers and sensors sold to the likes of Samsung Electronics Co. and Volkswagen AG. The shift is starting to pay off, with costs falling and margins recovering.
The company still faces challenges. Free cash flow was negative $99 million last quarter and the return to profit -- net income was $38 million -- was helped by $100 million of public funding as part of France’s project to aid the development of nanoelectronics technologies. Revenue fell 8.9 percent to $1.86 billion, Geneva-based STMicro said.
Photographer: Simon Dawson/Bloomberg
STMicroelectronics NV Chief Executive Officer Carlo Ferro said, “We anticipate further... Read More

‘Realistic Numbers’

STMicro forecast sales will increase about 3 percent in the current quarter from the second, plus or minus 3.5 percentage points, and gross margin will be about 34.4 percent, plus or minus 2 percentage points. Gross margin last quarter was 34 percent, topping the 33.6 percent analysts predicted.
“The outlook is a result of many things -- growth, transition from legacy products,” Chief Executive Officer Carlo Bozotti said on a conference call. “We gave realistic numbers. What’s important for us is making sure we have the right trajectory.”
The shares fell 4 percent to 6.68 euros at 12:48 p.m. in Paris, giving the company a market value of 6.1 billion euros ($8.2 billion). The stock had jumped 19 percent this year through yesterday.

Intel, Texas

Chipmakers are well-positioned to benefit from an economic recovery. The 18-nation euro-area has returned to growth, though modest, and U.S. expansion is set to accelerate.
“We begin with a favorable macroeconomic backdrop and there are areas where there is strong traction, in automotive and industrial for example,” STMicro’s Bozotti said. “In other areas like wireless, it’s more customer specific.”
Shares of Intel, the world’s largest chipmaker, rose to a 10-year high on July 16 after it forecast sales that indicate demand for PCs is starting to recover among consumers.
Texas Instruments, the biggest maker of analog semiconductors, this week forecast third-quarter profit that may top analysts’ estimates on demand for chips used in industrial machinery, cars and mobile-phone systems. ARM Holdings Plc, the chip designer whose products power Apple Inc.’s iPhone and iPad, said its revenue growth will accelerate.

Wednesday, April 9, 2014

Micron Reorg Focuses on 4 Key Businesses

http://www.eetimes.com/document.asp?doc_id=1321820&

Wednesday, March 19, 2014

Anatomy of an Electronics Counterfeit Operation

http://electronicspurchasingstrategies.com/2014/03/06/anatomy-counterfeiter/

If the supply chain could cobble together a worst-case scenario in counterfeit components, it would read a lot like the case of Hao Yang. Yang, a Chinese national, was prosecuted earlier this year as a co-conspirator in a scheme to sell counterfeit ICs to the U.S. military. Details of the case, outlined on the Immigration and Customs Enforcement (ICE) home page, are familiar:
1. An individual sets up a U.S.-based import and distribution firm under one or several phony identities. According to ICE: “Yang and his co-conspirators created and operated several companies in Maryland, Pennsylvania, and elsewhere, to facilitate the conspiracy, including MS Technologies and A-One Electronics in Baltimore; A-Best Technologies in China; and ARRCORD Group, SMC Group and Smooth LLC.”
2. The principals then procure counterfeit ICs from China and try to sell them as authentic mil-spec components: “The defendant imported counterfeit goods from China and fraudulently sold them as legitimate merchandise,” said U.S. Attorney Rod J. Rosenstein. “Counterfeit integrated circuits from China were falsely represented to be legitimate American-made parts.”
The counterfeit circuits received by Yang, a number of which were military-grade, were supplied by one specific co-conspirator located in China.
3. Operate as a distributor: The ICE press release doesn’t divulge how the scheme was uncovered, but from the language of the release it appears that some, if not all, the counterfeits were headed to different secondary handlers before they got into the military supply chain. “This co-conspirator sold, or attempted to sell, the circuits to various individuals, companies and government agencies in the United States,” ICE said in its report. The U.S. government organ outlined the following steps taken by the counterfeiters:
  • Yang used his residence to warehouse the counterfeit goods, including counterfeit military goods, sent to him by his co-conspirators in China. He then shipped specific items to buyers in the United States based on the order information provided by his co-conspirators. Yang maintained numerous bank accounts to deposit his illegal commissions and make payments associated with his counterfeit activities. He also used the commissions he received from his co-conspirators to pay for living expenses and other purchases, including his 2010 Acura TSX sedan.
  • The counterfeit circuits received by Yang, a number of which were military-grade, were supplied by one specific co-conspirator located in China. This co-conspirator sold, or attempted to sell, the circuits to various individuals, companies and government agencies in the United States. Yang then distributed the counterfeit circuits, via his domestic businesses, to the buyers in the United States sometimes in repackaged form.
  • The co-conspirator paid Yang a commission of $500 per month for his distribution services. To conceal the fact that the counterfeit circuits were being imported from China, Yang and his co-conspirator formed ARRCORD Group to create the appearance that the co-conspirator’s company in China (from which the counterfeit circuits were being distributed) was actually based in the United States. By using counterfeit circuits, their malfunction or failure could likely have caused serious bodily injury or impaired military operations, personnel or national security.
  • Throughout the course of the conspiracy, Yang also obtained other counterfeit goods, including computer software, DVDs, and sports jerseys, from other co-conspirators in China and Hong Kong, which he then distributed in the United States. As was the case with the counterfeit circuits, Yang and these other co-conspirators concealed the fact that the goods they sold were counterfeit and produced in China and Hong Kong. Yang received commissions from these co-conspirators of $1,000 to $2,000 per month for his distribution services.
  • Between March 2011 and April 2013, Yang received hundreds of shipments from China and Hong Kong, including shipments involving integrated circuits. For example, in June 2012, Yang received two shipments of counterfeit military-grade integrated circuits sent to ARRCORD Group at his residence and also received three shipments of other counterfeit goods, including DVDs and counterfeit computer software, sent to SMC Group at Yang’s residence. The Manufacturers Suggested Retail Price of the counterfeit DVDs and computer software was over $58,000.
False-front distribution operations have been around forever and have proliferated with adoption of the Internet. These companies frequently change names and maintain multiple bank accounts. They are often one- or two-person operations.  The military market is targeted by counterfeiters because of the high value of military components and because devices that have reached their end of life (EOL) are often sold into the open market; Military equipment has a longer lifespan than commercial products so EOL components are frequently in demand.
After discovering counterfeit electronics components in its supply chain, the U.S. Department of Defense (DoD) stepped up its anti-counterfeit efforts. In December 2011, revisions to the National Defense Authorization Act (NDAA) were signed by President Obama. Among its provisions, the NDAA calls for DoD contractors and subcontractors to report counterfeit electronic parts or suspect counterfeit electronic parts via the Government Industry Data Exchange Program (GIDEP). It also specifies the need to source electronic components from “trusted suppliers” if the devices are not available directly from component manufacturers or through authorized distributors. According to ICE, Yang was selling goods as late as 2013.
The GIDEP requirements and the term “trusted supplier” have spurred controversy in the electronics supply chain. Individuals familiar with GIDEP, for example, point to a possible shortcoming in the requirement. Both buyers and sellers of suspected counterfeit parts are identified in GIDEP reports. Experts posit that companies avoid GIDEP for fear of legal repercussions and the stigma associated with counterfeiting. The ICE release doesn’t say if GIDEP played a role in the Yang case. (EPS has a call into ICE to see if that information is available).
“Trusted supplier” is also a hot button in the industry. Advocates of the authorized supply chain object to the term because it includes independent distributors. Independents differ from authorized distributors in that they are not franchised directly by component suppliers. Also, because independents buy and sell excess inventory in the open market, there’s a higher risk of sourcing counterfeits. Top-tier independents have invested in processes and equipment to minimize the risk of counterfeits and have distanced themselves from brokers – companies that speculate in electronic commodities and fly-by-night companies such as Yang’s.
The government has embarked on other efforts to stem counterfeiting such as the use of plant DNA to track components through the supply chain. Separately, the electronics industry is working on its own counterfeit-mitigation standards. Under the auspices of SAE International, an association of engineers and related technical experts in the aerospace, automotive and commercial-vehicle industries, the G-19CI committee released its first standard,  AS5553. The committee is working on a revision. In 2013, SAE released the standard (AS6081) for independent distributors.
Clearly, anti-counterfeiting has become a priority. “Counterfeit military goods pose a threat to our national security as they could end up in the wrong hands and legitimate manufacturing and high technology businesses may believe they are receiving authentic goods,” the ICE report noted, adding Homeland Security and ICE ”… will continue to protect the American public and America’s warfighters from the introduction of counterfeit, non-conforming, and substandard materials and goods from entering the United States.”
However, the electronics industry remains divided on anti-counterfeiting efforts. The authorized channel in general opposes measures that include independent distributors. Military contractors say independents are sometimes their only choice. It’s also difficult to tell just how bad the problem is. GIDEP data, which shows a decline in counterfeiting reports during 2013, is only part of the picture. The commercial supply chain collects data from industry consortia and organizations that accept and investigate anonymous tips.
Yang stopped short of being a worst-case scenario because the scheme was uncovered. As a standalone example, the Yang case counts as an anti-counterfeiting victory. In the grand scheme of things, it’s difficult to determine if it also represents progress in any of the government’s anti-counterfeiting efforts.  Yang offered a plea agreement and faces a maximum of 10 years in prison, according to ICE.

Monday, February 24, 2014

DARPA wants to scrub scourge of counterfeit computer gear

http://m.networkworld.com/community/node/84878

ew things can mess up a highly technical system and threaten lives like a counterfeit electronic component, yet the use of such bogus gear is said to be widespread.
A new Defense Advanced Research Projects Agency (DARPA) program will target these phony products and develop a tool to "verify, without disrupting or harming the system, the trustworthiness of a protected electronic component."
+More on Network World: Old electronics don't die, they pile up+
DARPA said in March it will detail a program called Supply Chain Hardware Integrity for Electronics Defense (SHIELD) that will develop a small (100 micron x 100 micron) component, or dielet, that authenticates the provenance of electronics components. Proposed dielets should contain a full encryption engine, sensors to detect tampering and would readily affix to today's electronic components such as microchips, the agency said.
DARPA said it eversions this dielet will be inserted into the electronic component's package at the manufacturing site or affixed to existing trusted components, without any alteration of the host component's design or reliability. There is no electrical connection between the dielet and the host component. Authenticity testing could be done anywhere with a handheld probe or with an automated one for larger volumes. Probes need to be close to the dielet for scanning. After a scan, an inexpensive appliance (perhaps a smartphone) uploads a serial number to a central, industry-owned server. The server sends an unencrypted challenge to the dielet, which sends back an encrypted answer and data from passive sensors-like light exposure-that could indicate tampering, DARP said.
"SHIELD demands a tool that costs less than a penny per unit, yet makes counterfeiting too expensive and technically difficult to do," said Kerry Bernstein, DARPA program manager. "The dielet will be designed to be robust in operation, yet fragile in the face of tampering. What SHIELD is seeking is a very advanced piece of hardware that will offer an on-demand authentication method never before available to the supply chain."
The idea behind SHIELD will be to develop what DARPA calls a "hardware root‐of‐trust" comprising full onboard encryption, intrusion sensors, wireless communication and power, and hardened cipher key storage.
Technical areas DARPA says the program will look to develop include a new on‐chip hardware‐root‐of‐ trust secret key containers,  passive sensors that detect potential compromises,  ID chip self‐ destruct mechanisms to counter attempted reverse engineering, new manufacturing process technologies to fabricate, personalize, and place these devices, the integration and design of the small ID chips comprising these features.

In the end, DARPA says a system that can successfully protect key core systems would be:
- Extremely low cost, with minimal impact to the component manufacturer, distributor, or end‐ user, as well as to the host component itself;
- Effective at mitigating most supply chain security threats;
- Be simple, very fast, and executable by untrained operators;
- Trustworthy, reliable, and prohibitively difficult to spoof;
- Executable at any place and at any time along the supply chain, providing instant results on‐site;
- Performed using a minimum of specialized, inexpensive interrogation equipment;
- Standardized and widely adoptable by government and industry;
- Manufacturable in high volume using standard foundry processes; and
- A value‐add to the end‐product, recognized and requested by the component consumer.

Thursday, February 20, 2014

Chips Sales Top a Trillion in 2016

http://www.eetimes.com/document.asp?doc_id=1321045&

Global semiconductor unit shipments, including integrated circuits and optical, sensor, and discrete (OSD) devices are slated to break the 1 trillion mark in 2016, according to a new report. The news comes as semiconductor unit growth is expected to increase to about 8% this year, according to a February 18 report by IC Insights. In 2015, shipments are projected to grow 11% and then 12% in 2016, pushing the industry past the 1 trillion mark for the first time.
After 2016, shipments of a trillion or more chips is expected to become the norm. The forecast is based on data published in the 2014 edition of “The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry.” While the sheer number of semiconductor shipments is impressive, the report also takes the long view of the past four decades to show how far the industry has come.
For example, in 1978 semiconductor unit shipments totaled 32.6 billion. During the next 36 years, the average annual growth rate averaged 9.4% -- a testament to the increasing reliance on semiconductors in different aspects of modern life. However, the market is not without its slumps. Between 2008 and 2013, the annual growth rate slowed to just about 5% as a result of a worldwide economic recession. Now that most of the global economy has recovered, the growth rate is expected to reach 8%, a sign that the industry has not suffered any long-term effects and that the desire for semiconductors is still strong, especially in the increasingly popular mobile market.
The report’s historic information finds that semiconductors first topped the 100-billion shipment mark in 1987. From there, it took another 19 years, until 2006, for the market to reach 500 billion units. The next 100-billion unit mark was achieved the very next year, as the market topped 600 billion units in 2007. Thus the total of unit shipments of semiconductors has steadily increased at higher rates over time, bringing about each milestone at a quicker pace compared to the last. That is thanks in part of the consumer market and the explosive growth of items from smartphones to game consoles.
Since 1978, the percentage of ICs and OSD devices among total semiconductor shipments has remained about the same, in spite of various changes in the industry and advances in integrated circuit technology. ICs made up 21% of semiconductor units in 1978, whereas OSD devices accounted for 79% of total units. In 2016, OSD devices are expected to make up 74% of total semiconductor units compared to 26% for ICs.

Thursday, February 6, 2014

Aston Martin recalls 17,590 cars due to counterfeit material

http://uk.reuters.com/article/2014/02/05/uk-autos-astonmartin-recall-idUKBREA141T420140205

(Reuters) - Aston Martin expanded a recall on Wednesday to cover most of its sports cars built since late 2007 after discovering a Chinese sub-supplier was using counterfeit plastic material in a part supplied to the British luxury sports carmaker.
Owned by Kuwaiti and private equity investors, Aston Martin said it would now recall 17,590 cars, including all of its left-hand drive models built since November 2007 and all right-hand drive models built since May 2012.
That affects about 75 percent of all vehicles built in that period, a spokeswoman said. Its Vanquish model is not affected.

Aston Martin found that Shenzhen Kexiang Mould Tool Co Limited, a Chinese subcontractor that moulds the affected accelerator pedal arms, was using counterfeit DuPont plastic material, according to documents filed with the U.S. National Highway Traffic Safety Administration.
The material was supplied by Synthetic Plastic Raw Material Co Ltd of Dongguan, according to the documents.
The cars are being recalled from model years 2008 through 2014 because the accelerator pedal arm may break, increasing the risk of a crash, according to the NHTSA documents. The engine would return to idle and the driver would be unable to maintain or increase speed, according to the documents.
Aston Martin spokeswoman Sarah Calam said there had been no reports of accidents or injuries related to the issue and 22 failed parts had been reported. She said the financial impact to the automaker was small, but did not quantify the total.
The cost of the recall is of great interest because Aston Martin has struggled to fund the development of a range of new vehicles while rivals like Bentley, owned by Volkswagen (VOWG_p.DE), and Rolls Royce, owned by BMW (BMWG.DE), have the ability to draw on the resources of their parent firms.
Aston Martin's owners include Italian private equity fund Investindustrial, Kuwait-based Adeem Investment and Prime Wagon.
Germany's Daimler AG (DAIGn.DE) also has stake of less than 5 percent in the British automaker.
Of the Aston Martin cars affected in the recall, 7,271 are in Europe and 5,001 in the United States, Calam said. The company sells cars in 41 countries.
The latest recall replaces one announced last May and expanded in October.
Because of the issue, Aston Martin is now being supplied directly by a DuPont distributor.
Both Aston Martin and chemical company Dupont (DD.N) sent people to China to directly supervise the production of all pedal arms, including verifying each bag of DuPont plastic material, Calam said.
PIRACY PROBLEM
The automaker plans to shift production of the pedal arms from China to the United Kingdom "as soon as possible" in 2014, she said.
Last May, Aston Martin initially recalled 2,832 cars globally to replace the accelerator pedal arm after finding the affected part included material that did not meet specifications, Calam said.
After another arm broke that was not part of that group, the company expanded the recall to 16,825 cars and required the use of material made by DuPont.
When one of the replacement parts broke in December during installation by a U.S. dealer in Connecticut, however, Aston Martin froze the recall and found the counterfeit plastic material was being used in place of the DuPont material, she said.
The recall includes all the cars previously repaired, Calam said. Under the recall, Aston Martin will replace the accelerator pedal assemblies.
The manufacturer of the throttle pedal assembly that included the counterfeit material is Precision Varionic International Limited, according to the NHTSA documents.
The company's quality director, John Penman, did not immediately return calls and messages seeking comment.
It is not the first time DuPont has dealt with piracy in relation to China.
U.S. prosecutors indicted a California businessman in 2011 with stealing DuPont trade secrets in order to sell them to a Chinese company. That trial is ongoing.

Wednesday, January 22, 2014

Lfoundry closes ex-Atmel wafer fab in France; 600 jobs lost

http://www.edn-europe.com/en/lfoundry-closes-ex-atmel-wafer-fab-in-france-600-jobs-lost.html?cmp_id=7&news_id=10003098#.Ut_-OdLTmig

Lfoundry Rousset, the French chip manufacturing site of Lfoundry GmbH, has been declared bankrupt by the Commercial Court of Paris, with an immediate stop to activities on the site from Dec. 26 and the loss of 613 jobs, according to French reports.
The move has prompted angry demonstrations by the workforce in Rousset and Marseille as well as allegations that Lfoundry in Germany misappropriated €20 million (about $27.5 million) from Lfoundry in France. The German group is now the subject of a French criminal investigation, according to a report in Le Figaro.
Analog and mixed-signal chip maker Lfoundry bought the Rousset site from Atmel Corp. in 2010 for €1 together with a lengthy order book and Atmel was the main customer for Rousset until mid-2013. However, when Atmel's requirement turned down suddenly in June 2013 the Commercial Court in Paris placed Lfoundry into receivership with a six-month observation period to give time to develop a continuation plan for the business.
A voluntary redundancy plan was sketched out in November 2013 (see Jobs to go at Lfoundry Rousset) but it has failed to postpone the closure of the business.
The Rousset site will be preserved for a further three months while efforts continue to try and find a buyer but this will be for the site and equipment rather than for the business as a going concern with employees.
General Vision Inc. (Petaluma, Calif.) has expressed an interest, according to Varmatin, a local online publication. However, General Vision is a developer of image recognition systems rather than a chip manufacturer. The company is led by French expatriate imaging experts Anne Menendez and Guy Paillet.
The German parent company Lfoundry GmbH was formed in 2008 by the management buy-out of a Renesas wafer fab in Landshut, Germany. However, it subsequently closed the Landshut fab in 2011 after if failed to find sales to replace legacy orders from the original owner of the fab.
Immediately prior to Lfoundry Rousset being put into receivership, Lfoundry GmbH entered into an agreement to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy (a fab originally constructed and operated by Texas Instruments). In June 2013 it was announced that the takeover would be undertaken by way of a 50:50 joint venture between an entity called LFoundry Europe and Marsica Innovation SpA, a company owned by the Italian fab's management.
The Rousset wafer fab made chips on 200-mm diameter wafers in a clean room of about 12,000 square meters. It has a manufacturing capacity of about 25,000 wafer starts per month, according to data provided by the company in 2011.

Texas Instruments Cutting 1,100 Jobs; 4Q Profit Up

http://www.manufacturing.net/news/2014/01/texas-instruments-cutting-1100-jobs-4q-profit-up?et_cid=3725660&et_rid=490548696&type=headline

DALLAS (AP) -- Chipmaker Texas Instruments Inc. said Tuesday that it will cut 1,100 jobs worldwide, about 3 percent of its workforce, to trim costs and will reduce its investments in certain markets.
The company said the cuts in its embedded processing unit and in Japan will result in $130 million in annual savings by the end of 2014. The job cuts are in the U.S., India and Japan.
The Dallas-based company also said Tuesday that its fourth-quarter net income nearly doubled as restructuring charges fell and revenue ticked up 2 percent.
Texas Instruments has been reshaping its business, paring back its wireless unit as its biggest smartphone and tablet customers develop their own chips. It is shifting its focus to industrial and automotive customers.
The embedded processing unit is not part of the wireless division. Revenue in the embedded processing business, whose products serve various industries, rose 11 percent in the fourth quarter to $604 million.
In the three months through Dec. 31, Texas Instruments' overall net income rose to $511 million, or 46 cents per share, matching analyst expectations. In the same quarter the year before, profit came to $264 million, or 23 cents per share. But the fourth quarter's results included a restructuring charge of $49 million, or 3 cents per share, which Texas Instruments did not account for when issuing its guidance.
Revenue rose to $3.03 billion from $2.98 billion. That beat the $2.99 billion expected by analysts polled by FactSet.
For the first quarter, the company said it expects revenue between $2.83 billion and $3.07 billion and earnings per share of 36 cents to 44 cents including restructuring charges of about $30 million. Analysts were looking for first-quarter earnings per share of 44 cents on revenue of $2.95 billion.
Shares slipped 10 cents to $43.75 in after-hours trading. The stock closed regular trading up 40 cents at $43.85, and is up 31 percent over the past 12 months.

Monday, January 20, 2014

Slumping Intel To Cut More Than 5,000 Jobs In 2014

SAN FRANCISCO (AP) -- Intel plans to trim more than 5,000 jobs from its workforce this year in an effort to boost its earnings amid waning demand for its personal computer chips.
The Santa Clara-based company confirmed the job cuts Friday, the day after Intel Corp. reported its profit and revenue had fallen for the second consecutive year.
The purge represents about 5 percent of the roughly 108,000 jobs that Intel had on its payroll at the end of December. The company intends to jettison the jobs without laying off workers, said Intel spokesman Bill Calder. The reductions instead will be achieved through attrition, buyouts and early retirement offers.
The company didn't estimate how much money it hopes to save by eliminating jobs. But Intel needs pare its expenses if it hopes to end a two-year slump that has seen its earnings fall from $12.9 billion in 2011 to $9.6 billion in 2013. Intel is forecasting its revenue this year will be about the same as in 2013, making it unlikely its profits can rise without cost cuts.
This marks Intel's first significant job cuts since a company insider, Bryan Krzanich, succeeded Paul Otellini as CEO eight months ago.
"We are constantly evaluating and realigning our resources to meet the needs of our business," Calder said.
Intel's financial performance is faltering because the company didn't adapt quickly enough as the growing popularity of smartphones and tablet computers undercut sales of PCs running on its chips. Worldwide PC sales have dropped from the previous year in seven consecutive quarters, an unprecedented decline.
The trend is a problem for Intel because most mobile devices don't rely on its processors.
As Intel has struggled to come up with a successful strategy for mobile computing, the company has turned into a stock market laggard.
Since Intel's stock hit a five-year high of $29.27 in May 2012, the shares have fallen by 12 percent. Meanwhile, the Standard & Poor's 500 index has climbed by 31 percent.
Intel's stock dropped 69 cents Friday to close at $25.85, then dipped another 4 cents in extended trading.
http://www.manufacturing.net/news/2014/01/slumping-intel-to-cut-more-than-5000-jobs-in-2014?et_cid=3721261&et_rid=490548696&type=cta

Friday, January 17, 2014

Panasonic To Sell 3 Overseas Chip Assembly Plants

http://www.manufacturing.net/news/2014/01/panasonic-to-sell-3-overseas-chip-assembly-plants?et_cid=3716997&et_rid=490548696&type=cta

OSAKA (Kyodo) -- Panasonic Corp. plans to sell three semiconductor assembly plants in Southeast Asia to Singaporean chip manufacturer United Test and Assembly Center Ltd., sources close to the matter said Friday.
The move is part of efforts by the Japanese electronics manufacturer to accelerate outsourcing of its slumping semiconductor manufacturing operation. Last month, the company said it will sell off three of its semiconductor plants in central Japan to an Israeli chipmaker.
Panasonic aims to unload the plants in Indonesia, Malaysia and Singapore by the end of fiscal 2014 starting April, with workers at the plants to have their employment transferred to UTAC, the sources said. Other than the three plants, the company is also considering the sale of a plant in China, they said.
The three plants subject to the sale assemble semiconductors for electronics products including flat-panel televisions and digital cameras, but their operating rates have been low due to sluggish sales of digital home electronics products.
After selling the three plants, Panasonic will purchase finished products from UTAC, which assembles and tests semiconductors, the sources said.
Regarding its domestic semiconductor plants, Panasonic will spin off three plants -- two in Toyama Prefecture and another in Niigata Prefecture -- into a separate entity, in which Tower Semiconductor Ltd. has agreed to purchase a 51 percent stake.
The company also plans to close another plant in Okayama Prefecture which makes components related to semiconductor lasers by the end of March to trim losses in the semiconductor business.

Honeywell under investigation for Chinese-made parts in US warplanes

http://www.theguardian.com/world/2014/jan/12/honeywell-investigation-chinese-made-parts-warplanes

The US Justice Department is investigating export and import procedures at Honeywell International Inc after the firm included Chinese parts in equipment it built for the F-35 fighter jet, three sources familiar with the matter said.
Reuters last week reported that the Pentagon twice waived laws banning Chinese-built components in US weapons in 2012 and 2013 for parts supplied by Honeywell for the $392bn Lockheed Martin Corp F-35 programme.
New details have now emerged about one of those waivers, which involved simple thermal sensors that Honeywell initially produced in Scotland before moving that production line to China in 2009 and 2010. The other waivers involved high-performance magnets built in China and elsewhere.
Federal agents from the Defense Criminal Investigative Service, a law enforcement arm of the Pentagon, are working with prosecutors on the case, a person briefed on the matter said. The DCIS and the Pentagon declined to comment.
The precise nature of the investigation could not be confirmed. Typically, however, DCIS export investigations focus on whether a company violated the Arms Control Export Act by sending overseas products or technical specifications for items on the US Munitions List without first obtaining a US government licence. The sensors and F-35 specifications in this case may be subject to the US Munitions List. In terms of import violations, DCIS often investigates whether companies have engaged in fraud by misleading the Pentagon as to the origin of foreign parts.
The case throws a spotlight on the reliance of American companies, even in sensitive areas, on China as a manufacturing base for basic components. In the past 20 years, much production has been shifted out of the United States to lower-cost areas, particularly China.
The sensors are part of the power thermal management system that Honeywell builds to cool the F-35, start its engines and pressurise the cabin, said Joe DellaVedova, spokesman for the Pentagon's F-35 programme office.
A Honeywell spokesman, Scott Sayres, said the company decided in late 2012 – after consulting with Lockheed and the Pentagon – to move production of the sensors used on the F-35 from China to a plant in Boyne City, Michigan. It funded the move at its own cost, he said. Honeywell made the move after the origin of the sensors was discovered during a comprehensive review of the supply chain for the F-35, the newest US warplane.
That was carried out by Lockheed after another key supplier, Northrop Grumman Corp, discovered it had used non-compliant magnets made in Japan in building the jet's advanced radar system. The Pentagon acquisition chief, Frank Kendall, also issued a waiver for those parts.
Sayres said the sensors were part of a basic circuit card used in products sold commercially around the world.
"We firmly believe Honeywell has complied with all applicable US laws and regulations relating to the manufacture of the component in China," Sayres said.
Officials at the Justice Department and Pentagon declined to comment on the reported Honeywell investigation.
One of the three sources familiar with the probe, who were not authorised to speak publicly, said it was focused on Honeywell's processes and procedures, rather than the components involved. They were seen as low-risk items that did not pose any security risk for the F-35 programme.
The sources also cautioned that such investigations can take months or years to complete, and said no determinations had yet been made about Honeywell's actions.
Honeywell's Sayres declined to comment on the Justice Department investigation, telling Reuters: "As a general practice, we do not comment on the existence or nature of any active government investigations."
Honeywell decided to move the sensor production to China to save money and simplify its supply line, he said.
The Government Accountability Office (GAO), the investigative arm of Congress, is also looking into the sensor issue and two others involving the F-35, as part of a report due on 1 March. US lawmakers ordered the GAO report because they are concerned that American firms are being shut out of the speciality metals market, and that US weapons could become dependent on parts made by a potential future adversary.
A Pentagon spokeswoman, Maureen Schumann, said the Pentagon's Kendall had granted national security waivers to allow foreign-built parts on other aircraft in the past, but had no immediate details about those cases.
DellaVedova, the spokesman for the F-35 programme office, said the thermal sensors were simple parts that did not include any software and were not programmable. He said there was no security risk associated with use of the sensors. He said all the Chinese-built sensors would eventually be replaced on the F-35s, but the process had not yet been completed. He had no immediate information on how many Chinese-built sensors were installed on the planes.
"This will all be taken care of," DellaVedova said.

Thursday, January 9, 2014

Medical Electronics Set For Double-Digit Growth

http://globalpurchasing.com/medical/medical-electronics-set-double-digit-growth?NL=ESB-01&Issue=ESB-01_20140108_ESB-01_814&YM_RID=ksnider@erai.com&YM_MID=1442764&sfvc4enews=42&cl=article_1

The medical electronics market has been a strong performer amid the sluggish economic conditions for electronics distributors and manufacturers over the last few years. As 2014 gets underway, those companies can count on an even bigger bang out of the medical market, as analysts predict a return to double-digit growth globally.
Worldwide growth in medical electronics is expected to speed up in the next three years after slowing since 2010, according to the 2014 edition of IC Insights’ IC Market Driversreport, released in November. The research company says medical electronics sales will grow 8% to about $51 billion in 2014 after rising just 3% in 2013 to roughly $47 billion. Sales of semiconductors used in medical systems are also expected to gain strength this year, rising 12% to about $5 billion after growing 7% in 2013 to $4.4 billion.
Also, IC Insights predicts worldwide sales of medical electronics will rise by a compound annual growth rate (CAGR) of 7.3% between 2012 and 2017, reaching $65.4 billion. Sales of semiconductors used for healthcare systems applications will rise by a CAGR of nearly 11% to reach almost $7 billion by 2017, the group says. The researchers cite growing demand for medical equipment in China and other developing countries, along with the trend toward mobile healthcare systems, as key reasons for the expected increase in sales.
“In the years ahead, stronger growth in medical electronics will be fueled by sales of less expensive diagnostic and imaging equipment in China and other developing country markets as well as the explosion of wireless mobile healthcare systems that monitor patients remotely and reduce the need for expensive stays in hospitals,” according to IC Insights. “The 2014 IC Market Drivers report forecasts wireless mobile medical systems and closely associated wearable fitness-tracking devices generating revenues of nearly $1.9 billion in 2014, which is a 53% increase from about $1.2 billion in 2013, when worldwide sales grew 27%.”
IC Insights also points to two key development trends in the marketplace. The first is the drive to make new medical diagnostic systems smaller and less expensive so equipment can be used in patients’ rooms, clinics, and doctors’ offices instead of hospital exam rooms and imaging centers. Hand in hand with that are advances in semiconductor sensors, wireless ICs, and system-on-chip (SoC) designs that enable mobile medical devices. The other trend is the creation of more powerful and integrated systems, which are expensive but will reduce healthcare costs by detecting diseases sooner and supporting less invasive surgery for quick recovery times and shorter hospital stays.
“Computer-assisted surgery systems, surgical robots, and operating-room automation are among new technologies being pursued by some hospitals in developed-country markets,” IC Insights says.
The world’s aging population and China’s heavy investment in healthcare will be growth drivers over the next few years as well. China is expected to invest nearly $64 billion in medical and healthcare infrastructure this decade.

Times Are A-Changin' in the DRAM Market

http://www.ebnonline.com/author.asp?section_id=1162&doc_id=270894&

DRAM demand is on the upswing as sales are expected to continue growing in the double digits through next year. More importantly, there is nothing usual about this latest cyclic rise in DRAM revenues.
While the DRAM sector will experience tighter capacity and rising unit prices as it has during past growth cycles, the supplier base has consolidated to such an extent that only three dominate players account for more than 90% of the market share. This means that heavy hitters Samsung, Hynix, and Micron have more leverage to raise prices than they would have been able to do during the past few years, as they, for the time being, try to put their low-margin and unstable pricing days behind them.
Source: iSuppli
Source: iSuppli
In the immediate future, DRAM suppliers, including the smaller players as well as the big three, are expected to benefit from double-digit growth and revenue gains thanks to higher pricing next year and in 2014. Following a 10.7% drop in DRAM revenues in 2012 to $26.4 billion, DRAM revenues are expected to surge 35.4% to $35.7 billion in 2013 and 10.8% to $39.6 billion in 2014, according to IHS iSuppli.
The rise in demand for DRAM as well as NAND flash memory, which is expected to see revenue growth of 27.7% in 2013, will lift the semiconductor market, IHS iSuppli says. Revenue growth driven by memory demand will increases by almost 5% to $317.9 billion. DRAM sales will account for 1.25% of the semiconductor industry's total growth worldwide, IHS iSuppli said.
Strong demand from the mobile sector from smartphones and tablets has helped the DRAM sector see growth. However, industry consolidation and what IHS iSuppli says is "more rational shipment growth" among DRAM makers are the main factors behind the up cycle.
Samsung, Hynix, and Micron also collectively benefit as the surviving large players in the market following a wave of consolidation. They have a share of over 92% of all DRAM revenues worldwide. Samsung alone in the third quarter had a 37% share of the DRAM market. Hynix and Micron commanded shares of 28% and 27%, respectively, in the third quarter, according to IHS iSuppli.
Micron has especially benefited from the industry consolidation. In the context of the total chip market, Micron's share of the total semiconductor market will more than double to 4.5% in 2013, up from 2.2% in 2012, IHS iSuppli says. Micron's acquisition of Elpida Memory in 2012 was also a main factor in Micron's sales gains this year.
Samsung, Hynix, and Micron are using new market domination to stoke prices in the immediate future. They are doing this in part by not adding manufacturing capacity to meet demand and thus limiting supply growth to 25% to 30%, Mike Howard, senior principal analyst for IHS' DRAM and compute platforms group.
"There are only three DRAM companies left... and there is little threat right now that anyone will jump into the industry," Howard wrote in an email message. "It is our belief that the current players in DRAM are more focused on profits and less focused on market share... a situation that is tenable when [the large players] have at least 25 percent market share and untenable when there are a handful of players with 5-10 percent share."
The bad news for electronics OEMs is, of course, that they will have to wait for at least a year or so before they might be able to seek lower pricing from their DRAM suppliers.
"DRAM suppliers are responding to shortages by raising prices," Howard wrote. "We expect shortages in much of 2014 -- a situation that will keep prices from declining at historical rates."