Wednesday, September 30, 2015

AMD Unveils New GPUs for Embedded Systems


The vendor's latest Radeon discrete graphics cards give customers an array of options in performance, power and energy efficiency. Advanced Micro Devices is rolling out a range of new embedded graphics cards that are aimed at a broad array of embedded applications that demand high-end visual and parallel processing capabilities. The Embedded Radeon graphics products can be used in such areas as gaming systems, digital signage, medical devices systems (such as X-ray and MRI machines), industrial controls and thin clients, according to AMD officials. They're also looking at communications infrastructure, from network switches and routers to systems that support the growing Internet of things (IoT). In addition, the graphics cards offer choices in form factors, from multi-chip modules (MCMs) and mobile PCI Express modules (MXM) to PCIe options. There also are wide ranges of options in everything from performance to power efficiency. They are designed to balance the competing demands for power, performance and graphics memory size in an embedded system space that is increasingly thirsty for graphics, according to Scott Aylor, corporate vice president and general manager of embedded solutions at AMD.


The demand for rich, vibrant graphics in embedded systems is greater than ever before, and that demand is growing," Aylor said in a statement, adding that the new discrete graphics cards can help companies build products that can leverage multiple 4K screens, 3D workloads and interactive displays. "In addition, the powerful capabilities of our GPUs can address the toughest parallel compute challenges."
Graphics technology will play a key role in AMD's efforts to return to profitability through efforts laid out by company officials earlier this year. Among the key markets AMD is targeting are gaming and immersive computing, both of which call for high-end graphics capabilities as well as power efficiency and visualization. AMD officials see the vendor's capabilities in both high-end CPUs and GPUs as key differentiators to such rivals as Intel and Nvidia. The chip maker wants to offer discrete GPUs that not only offer enhanced longevity and reliability, but also scalability, they said. The new graphics cards offer three levels of performance—ultra-high, high and power-efficient. The E8950MXM module is the embedded GPU with the highest performance. It can be used in general-purpose GPU (GPGPU) computing environments, and supports 4K decode and encode and up to six 4K displays. AMD pointed to such systems as high-end casino and arcade gaming machines, medical imaging devices, and military and aerospace systems as possible uses. Given that it's smaller than standard commercial GPUs, it also can be used in space-constrained environments, such as airplane cockpits and ultrasound machines, officials said. The E8950MXM module offers 32 compute units, 3 teraflops (trillion floating point operations per second) peak performance, 8GB of GDDR5 memory and a thermal design power (TDP) of less than 95 watts. In the high-performance category, the E8870MXM and E8870PCIe offer 12 compute units and 1.5 TFLOPs of peak performance, 4GB of GDDR5 memory and less than 75 watts TDP. The E6465MCM, E6465MXM and E6465PCIe GPUs also are aimed at energy-efficiency uses, such as mobile signage, retail kiosks, conventional military and aerospace displays, and thin clients. They offer two compute units, 192 GFLOPs (billion floating point operations per second) performance and 2GB of GDDR5 memory, all in cards with less than 20 watts TDP. The embedded GPUs come with a five-year supply commitment, and each supports Microsoft's Windows 7, 8.1 and 10 operation systems as well as Linux.
http://www.eweek.com/pc-hardware/amd-unveils-new-gpus-for-embedded-systems.html

Tuesday, September 29, 2015

PCs, Not Profits, Drive Chip Companies

SAN FRANCISCO—A worldwide decline in PC market revenue and shipments is not news—Gartner and IDC reported approximately 10% decrease in PC shipments in the second quarter of 2015—and the forecast isn’t bright. 2016 shipments are expected to be flat, while growth in 2017 will be minimal.
Despite a less-than-stellar forecast for a matured market, major chipmakers keep driving on with new products for this segment. Advanced Micro Devices (AMD) hopes to turn around a series of poor performing quarters with its Carrizo processor for PCs, while Intel expects its Skylake SoC architecture to increase PC shipments. Several analysts questioned whether the PC market will pick up steam again.
“We’ve been sort of stuck in a mold where there’s a lot of legacy and a certain model of how you build a PC. It’s gotten more integrated and lower power but…the little additions haven’t made as big of a difference,” said Kevin Krewell, a principal analyst with Tirias Research. “A lot of the more interesting stuff we can do is with either tablets or smartphones because we can carry them everywhere.”
Skylake has received mixed reviews—the new architecture has security enhancements and an integrated processor and sensor hub, but few updated performance metrics—and AMD is hoping for a big design win with its Carrizo Pro processor inside HP’s EliteBook 705 G3 series for enterprise. Carrizo Pro has “excavator” cores running up to 3.4 GHz, a Radion R7 GPU, and ARM Trust Zone technology for hardware level security.
A design win with HP is essential to AMD’s success, because while Carrizo may have performance advantages with embedded security and a smaller footprint that would allow for more DRAM, AMD does not have “the thick margins of Intel,” Krewell noted. Until recently, the PC market accounted for 90% of AMD’s sales.
“AMD needs a more stable business and they’re not in a position where they can compete on a low price point. Intel’s Atom is very competitive, and AMD’s parts perform much better than Atom, but that’s not where AMD can afford to go,” he said.
As a result, AMD is banking on enterprise sales and laptop refreshes to drive revenue. Poor-performing corporate desktops and laptops will be replaced, while workers in developing nations will continue to come online. The bring-your-own-device (BYOD) trend could also increase sales as employees require their personal devices to have more productivity.
“No one thing will turn the pie for AMD. They need to grab some more share of the graphics market; they need a rebound in some commercial PCs with [Carrizo] Pro,” Krewell said, adding that he hopes to see Zen (an x86 CPU microarchitecture)-based servers in late 2016.
“Intel is very in tune with efficiency and low power, but it would take some major change to that to put Intel behind the curve,” Krewell continued, noting that Intel has more than 90% share of the PC market. “The biggest thing AMD could do is catch IP and become a more competitive alternative supplier with performance and lower power.”
Although AMD has relied heavily on PCs shipments and is acutely feeling the after effects of the market slowdown, Krewell isn’t concerned for the future of the company.
“AMD’s had quite a few near death experiences throughout the years and always found some way of getting out of it. They’re sort of a Houdini of fiscal crises,” he said.

http://www.eetimes.com/document.asp?doc_id=1327833

Monday, September 28, 2015

Cypress to challenge Dialog with bid for Atmel - sources


There is no certainty that Cypress will manage to put together an offer that Atmel will deem as more attractive than its deal with Dialog, the people cautioned, asking not to be identified because the deliberations are confidential.
Cypress, Atmel and Dialog representatives did not immediately respond to requests for comment.
Dialog, an Anglo-German company which is heavily exposed to Apple Inc (AAPL.O) and Samsung Electronics Co (005930.KS) for its sales, agreed to acquire Atmel to diversify its client base in automotive markets, as well as network-connected chips used in industrial gear, also known as the "Internet of Things".
Based in San Jose, California, Atmel manufactures small processors called microcontrollers that are used in a variety of electronics and other hardware in this connected device area.
Cypress, based in San Jose, California, makes flash memory chips and microcontrollers. It is also looking to boost its "Internet of Things" portfolio.
Last summer, Cypress attempted to acquire chipmaker Integrated Silicon Solution Inc (ISSI.O), but lost out to Uphill Investment Co, which clinched a deal for the company for more than $700 million.
Were Cypress to prevail in its bid for Atmel, the latter would have to pay Dialog a termination fee of $137.3 million, according to their merger agreement.
Dialog's shares have dropped 21 percent since the deal with Atmel was announced, as investors grew skeptical of the potential combination. Atmel shares ended trading on Friday at $8.02, down from the $10.42 that the merger agreement with Dialog valued them at the point of signing.


http://uk.reuters.com/article/2015/09/27/us-atmel-m-a-cypresssemiconductor-idUKKCN0RR13T20150927

Friday, September 25, 2015

TSMC’s 2015 Forecast May Be Warning for Supply Chain

AIPEI — A forecast of 2015 revenue yesterday by Taiwan Semiconductor Manufacturing Co., (TSMC), may have sounded a warning for other companies in the electronics supply chain.
The world’s largest foundry said yesterday in a press statement that it “expects its full-year revenue growth rate will still be close to double digits” compared with its sales in 2014. The announcement marks the third time this year that the company has pared expectations for 2015.
“We find 2015 revenue will be NT$840.5 billion ($25.5 billion), 10.2% over 2014, barely meeting the double-digit target,” said Bernstein analyst Mark Li, in a Sept. 23 report following the TSMC announcement. In January this year, TSMC said its sales revenue in 2015 would likely rise by "several percentage points" more than the estimated industry average of 12%.
The dimmed forecast may indicate difficulty for other companies in the supply chain, according to some analysts.
“According to our industry surveys, we assume all of Taiwan’s main foundries, including United Microelectronics Corp. (UMC) and Vanguard International, would deliver a below-consensus fourth-quarter outlook to further impact the backend companies as well as downstream supply chain.,” said Fubon Research analyst Carlos Peng, in a Sept. 23 report. “We project UMCˇs fourth quarter 2015 revenue will drop more than (that of ) TSMC and Vanguard.”
TSMC may need to trim its capital expansion plans for this year and in 2016, according to Maybank Kim Eng analyst Warren Lau. For the first time ever, TSMC in January led the semiconductor industry with a capex budget for 2015 of US$11.5-12.0 billion, an increase of 11.5-20.0% compared with 2014.
Inventory correctionWeaker-than-expected demand for smartphones and the chips inside has caused an inventory correction that’s impacting TSMC and UMC, the world’s largest foundries. The current inventory digestion may end in the fourth quarter this year, but a recovery in 2016 may not materialize as demand remains uncertain, according to Maybank’s Warren Lau, in a report sent out yesterday.
Other analysts were more optimistic. TSMC is likely to see 10% revenue growth this year and next, according to HSBC analyst Steven Pelayo, in a report yesterday.
Still others said longer-term problems may weigh on TSMC.
“Our structural concerns on TSMC persist,” Bernstein analyst Li said. “Moore’s Law is challenged with mounting cost barriers. The slowing smartphone growth also challenges TSMC’s target of 10% compound annual growth rate (CAGR) in revenue and net profits in the next five years. Competitive pressure from Samsung will stay elevated, in 14nm, 10nm and beyond.”
TSMC’s loss of business from Qualcomm to Samsung earlier this year may be offset by an increase of orders from Apple to TSMC as the foundry ramps up its 16nm FinFET manufacturing during the fourth quarter, according to three analysts surveyed by EE Times.
TSMC’s trimmed expectations cap off a strong run for the company in 2014, when TSMC recorded record profit figures.

http://www.eetimes.com/document.asp?doc_id=1327798

Thursday, September 24, 2015

Defense Federal Acquisition Regulation Supplement: Detection and Avoidance of Counterfeit Electronic Parts-Further Implementation (DFARS Case 2014-D005)

https://www.federalregister.gov/articles/2015/09/21/2015-23516/defense-federal-acquisition-regulation-supplement-detection-and-avoidance-of-counterfeit-electronic

Action

Proposed Rule.

Summary

DoD is proposing to amend the Defense Federal Acquisition Regulation Supplement (DFARS) to further implement a requirement of the National Defense Authorization Act for Fiscal Year 2012, as modified by a section of the National Defense Authorization Act for Fiscal Year 2015, that addresses required sources of electronic parts for defense contractors and subcontractors.
 

Table of Contents Back to Top

DATES: Back to Top

Comments on the proposed rule should be submitted in writing to the address shown below on or before November 20, 2015, to be considered in the formation of a final rule.

ADDRESSES: Back to Top

Submit comments identified by DFARS Case 2014-D005, using any of the following methods:
Regulations.gov: http://www.regulations.gov. Submit comments via the Federal eRulemaking portal by entering “DFARS Case 2014-D005” under the heading “Enter keyword or ID” and selecting “Search.” Select the link “Submit a Comment” that corresponds with “DFARS Case 2014-D005.” Follow the instructions provided at the “Submit a Comment” screen. Please include your name, company name (if any), and “DFARS Case 2014-D005” on your attached document.
Email: osd.dfars@mail.mil. Include DFARS Case 2014-D005 in the subject line of the message.
Fax: 571-372-6094.
Mail: Defense Acquisition Regulations System, Attn: Ms. Amy G. Williams, OUSD(AT&L)DPAP/DARS, Room 3B941, 3060 Defense Pentagon, Washington, DC 20301-3060.
Comments received generally will be posted without change to http://www.regulations.gov, including any personal information provided. To confirm receipt of your comment(s), please check www.regulations.gov, approximately two to three days after submission to verify posting (except allow 30 days for posting of comments submitted by mail).

FOR FURTHER INFORMATION CONTACT: Back to Top

Ms. Amy G. Williams, telephone 571-372-6106.

SUPPLEMENTARY INFORMATION: Back to Top

I. Background Back to Top

DoD is proposing to revise the DFARS to further implement section 818 of the National Defense Authorization Act (NDAA) for Fiscal Year (FY) 2012 (Pub. L. 112-81), as modified by section 817 of the NDAA for FY 2015 (Pub. L. 113-291). On May 6, 2014, DoD published a final rule under DFARS Case 2012-D055, entitled “Detection and Avoidance of Counterfeit Electronic Parts” (78 FR 26092). That final rule constituted the initial partial implementation of section 818.
After publication of the final rule under FAR Case 2012-D055, DoD published on May 9, 2014, a notice of a public meeting, which was held on June 16, 2014, to address further implementation of detections and avoidance of counterfeit electronic parts. There were 79 registered attendees and eight presenters at the public meeting, as well as robust discussion. Some of the issues raised at the public meeting are addressed in this proposed rule, such as—
  • Removal of embedded software or firmware from the definition of “electronic part”;
  • Clarification of traceability expectations; and
  • Additional guidance on determination of risk.

II. Discussion and Analysis Back to Top

The rule proposes amendments to DFARS 246.870 and a new clause at DFARS 252.246-70XX, Sources of Electronic Parts, to further implement paragraph (c)(3) of section 818 of the NDAA for FY 2012, as modified by section 817 of the NDAA for FY 2015, which requires DoD to issue regulations establishing requirements that DoD and DoD contractors and subcontractors, except in limited circumstances, shall acquire electronic parts from trusted suppliers in order to further address the avoidance of counterfeit electronic parts.
Because of the complexities relating to use of trusted suppliers by DoD and the requirement of section 818, paragraph (c)(3)(C), to establish qualification requirements consistent with 10 U.S.C. 2319, those aspects of section 818 will be addressed in a separate DFARS Case 2015-D020, DoD Use of Trusted Suppliers for Electronic Parts.
This proposed rule addresses requirements for DoD contractors and subcontractors at all tiers, as set forth in paragraphs (c)(3)(A), (B), and (D). Although some paragraphs of section 818 only apply to contractors subject to the Cost Accounting Standards (CAS), paragraph (c)(3) applies to all DoD contractors and subcontractors, when obtaining electronic parts to be provided to DoD under a DoD contract.
DoD proposes to include the new clause at DFARS 252.246-70XX, Sources of Electronic Parts, as prescribed at 246.870-3(b), whenever procuring—
(1) Electronic parts;
(2) End items, components, parts, or assemblies containing electronic parts; or
(3) Services, if the contractor will supply electronic parts or components, parts, or assemblies containing electronic parts as part of the service.
Unlike the clause at 252.246-7007, Contractor Counterfeit Electronic Part Detection and Avoidance System, this new clause is not limited to contractors subject to CAS and will apply to small business set-asides, since paragraph (c)(3) of section 818 applies to all DoD-contractors and subcontractors at all tiers that are providing electronic parts or assemblies containing electronic parts. Therefore, the clause includes flowdown to subcontracts, including subcontracts for commercial items.
DoD does not propose to expand the requirements of DFARS 252.246-7007, or the associated clause DFARS 252.244-7001, Contractor Purchasing System Administration, Alternate I, to non-CAS covered prime contractors, because paragraph (e)(1) of section 818 specifically applies the requirements for a system for avoidance and detection of counterfeit parts to “covered contractors.” However, the DFARS flows down the system requirements to subcontractors regardless of CAS coverage.
The clause DFARS 252.246-70XX includes new proposed definitions of “authorized dealer” and “trusted supplier.”
  • DoD notes that “authorized dealer” does not equate to “authorized reseller.” An authorized reseller is not bound to obtain parts from the original manufacturer. The reseller can obtain parts from an authorized dealer, an aftermarket manufacturer, or independent distributor, for example. An “authorized dealer,” however, has a contractual arrangement with the original manufacturer or current design activity, including an authorized aftermarket manufacturer, to buy, stock, repackage, sell, and distribute its product lines.
  • The term “trusted supplier” includes not only the original manufacturer, an authorized dealer for the part, or a supplier that obtains the part exclusively from the original component manufacturer of the part or an authorized dealer, but also includes a supplier that a contractor or subcontractor has identified as a trustworthy supplier, using DoD-adopted counterfeit prevention industry standards and processes, including testing, in accordance with section 818(c)(3)(A)(iii) and (D) of the NDAA for FY 2012, as modified by section 817 of the NDAA for FY 2015.
In addition to the requirements to acquire electronic components from trusted suppliers, contractors and subcontractors that are not the original manufacturer are required to have a risk-based system to trace electronic parts from the original manufacturer to product acceptance by the Government. If such traceability is not feasible for a particular part, the contractor system must provide for the consideration of an alternative part or utilization of tests and inspections in order to avoid counterfeit electronic parts. If it is not possible to obtain an electronic part from a trusted supplier, the contractor is required to notify the contracting officer. The contractor is then responsible for inspection, testing, and authentication, in accordance with existing applicable industry standards, of electronic parts obtained from sources other than a trusted supplier.
The rule also proposes a definition in DFARS 202.101 of “original manufacturer” to include the “contract electronics manufacturer,” the “original component manufacturer,” or the “original equipment manufacturer,” which are also defined. The term “contract electronics manufacturer” includes manufacturers that produce goods, using electronic parts, for other companies on a contract basis under the label or brand of the other organizations, or fabricate an electronic part under a contract with, or with the express written authority of, the original component manufacturer, based on the original components manufacturer's designs.
In addition, the rule proposes to delete the sentence “The term ‘electronic part’ includes any embedded software or firmware” from the definition of “electronic part.” Although electronic parts may include embedded software or firmware, the requirements of this rule are more applicable to hardware. Further industry standards are still under development to address testing of embedded software or firmware in electronic parts.
There are conforming changes to DFARS clause 252.246-7007, Contractor Counterfeit Electronic Part Detection and Avoidance System, in the definitions and processes for traceability.
This rule is part of DoD's retrospective plan, completed in August 2011, under Executive Order 13563, “Improving Regulation and Regulatory Review.” DoD's full plan and updates can be accessed at: http://www.regulations.gov/#!docketDetail;D=DOD-2011-OS-0036.

III. Determinations of Applicability Back to Top

DoD intends to apply the requirements of section 818(c)(3) to contracts at or below the simplified acquisition threshold (SAT) and contracts for the acquisition of commercial items, including commercial-off-the-shelf (COTS) items.

A. Applicability to Contracts at or Below the SAT

41 U.S.C. 1905 governs the applicability of laws to contracts or subcontracts in amounts not greater than the SAT. It is intended to limit the applicability of laws to such contracts or subcontracts. 41 U.S.C. 1905 provides that if a provision of law contains criminal or civil penalties, or if the FAR Council makes a written determination that it is not in the best interest of the Federal Government to exempt contracts or subcontracts at or below the SAT, the law will apply to them. The Director, DPAP, is the appropriate authority to make comparable determinations for regulations to be published in the DFARS, which is part of the FAR system of regulations.
DoD intends to determine that it is in the best interest of the Federal Government to apply the rule to contracts at or below the SAT, because a substantial percentage of electronic parts are valued below the SAT. An exception for contracts at or below the SAT would severely decrease the intended effect of the statute and increase the risk of receiving counterfeit parts, which may present a significant mission, security, or safety hazard.

B. Applicability to Contracts for the Acquisition of Commercial Items, Including COTS Items

41 U.S.C. 1906 governs the applicability of laws to contracts for the acquisition of commercial items, and is intended to limit the applicability of laws to contracts for the acquisition of commercial items. 41 U.S.C. 1906 provides that if a provision of law contains criminal or civil penalties, or if the FAR Council makes a written determination that it is not in the best interest of the Federal Government to exempt commercial item contracts, the provision of law will apply to contracts for the acquisition of commercial items. Likewise, 41 U.S.C. governs the applicability of laws to COTS items, with the Administrator for Federal Procurement Policy the decision authority to determine that it is in the best interest of the Government to apply a provision of law to acquisitions of COTS items in the FAR. The Director, DPAP, is the appropriate authority to make comparable determinations for regulations to be published in the DFARS, which is part of the FAR system of regulations.
Since electronic parts are generally COTS items, and studies have shown that a large proportion of proven counterfeit parts were purchased as commercial items, including COTS items, DoD intends to determine that it is in the best interest of the Federal Government to apply the rule to contracts for the acquisition of commercial items, including COTS items, as defined at FAR 2.101. An exception for contracts for the acquisition of commercial items, including COTS items, would severely decrease the intended effect of the statute and increase the risk of receiving counterfeit parts, which may present a significant mission, security, or safety hazard.

IV. Executive Orders 12866 and 13563 Back to Top

Executive Orders (E.O.s) 12866 and 13563 direct agencies to assess all costs and benefits of available regulatory alternatives and, if regulation is necessary, to select regulatory approaches that maximize net benefits (including potential economic, environmental, public health and safety effects, distributive impacts, and equity). E.O. 13563 emphasizes the importance of quantifying both costs and benefits, of reducing costs, of harmonizing rules, and of promoting flexibility. This is a significant regulatory action and, therefore, was subject to review under section 6(b) of E.O. 12866, Regulatory Planning and Review, dated September 30, 1993. This rule is not a major rule under 5 U.S.C. 804.

V. Regulatory Flexibility Act Back to Top

DoD expects that this proposed rule may have a significant economic impact on a substantial number of small entities within the meaning of the Regulatory Flexibility Act 5 U.S.C. 601, et seq. Therefore, an initial regulatory flexibility analysis has been prepared and is summarized as follows:
This proposed rule further implements section 818 of the National Defense Authorization Act (NDAA) for Fiscal Year (FY) 2012 (Pub. L. 112-81), as modified by section 817 of the NDAA for FY 2015.
The objective of this rule is to avoid acquisition of counterfeit electronic parts by requiring DoD contractors and subcontractors, except in limited circumstances, to buy electronic parts from trusted suppliers, in accordance with section 818(c)(3) of the NDAA for FY 2012.
Based on Federal Procurement Data System data for FY 2013 and 2014, DoD estimates that this rule will apply to approximately 33,000 small entities that have DoD prime contracts or subcontracts for electronic parts; end items, components, parts, or assemblies containing electronic parts; or services, if the contractor will supply electronic parts or components, parts, or assemblies containing electronic parts as part of the service.
In addition to the requirements to acquire electronic components from trusted suppliers, contractors and subcontractors that are not the original manufacturer or authorized dealer are required have a risk-based process to trace electronic parts from the original manufacturer to product acceptance by the Government. If that is not feasible, the Contractor shall have a process to complete an evaluation that includes consideration of alternative parts or utilization of tests and inspections commensurate with the risk. If it is not possible to obtain an electronic part from a trusted supplier, the contractor is required to notify the contracting officer. The contractor is responsible for inspection, testing, and authentication, in accordance with existing applicable industry standards, of electronic parts obtained from sources other than a trusted supplier. Notifying the contracting officer if it is not possible to obtain an electronic part from a trusted supplier would probably involve a mid-level of executive involvement.
No relevant Federal rules duplicate, overlap, or conflict with the proposed rule.
The rule does not duplicate, overlap, or conflict with any other Federal rules.
DoD was unable to identify any significant alternatives that would reduce the economic impact on small entities and still fulfill the requirements of the statute.
DoD invites comments from small business concerns and other interested parties on the expected impact of this rule on small entities.
DoD will also consider comments from small entities concerning the existing regulations in subparts affected by this rule in accordance with 5 U.S.C. 610. Interested parties must submit such comments separately and should cite 5 U.S.C. 610 (DFARS Case 2014-D005), in correspondence.

VI. Paperwork Reduction Act Back to Top

The rule contains information collection requirements that require the approval of the Office of Management and Budget under the Paperwork Reduction Act (44 U.S.C. chapter 35). Accordingly, DoD has submitted a request for approval of a new information collection requirement concerning “Detection and Avoidance of Counterfeit Electronic Parts—Further Implementation” to the Office of Management and Budget.
A. Public reporting burden for this collection of information is estimated to average one hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information.
The annual reporting burden estimated as follows:
Respondents: 1,000.
Responses per Respondent: 1.
Total Annual Responses: 1,000.
Preparation Hours per Response: 1 hour.
Total Response Burden Hours: 1,000.
B. Request for Comments Regarding Paperwork Burden.
Written comments and recommendations on the proposed information collection, including suggestions for reducing this burden, should be sent to Ms. Jasmeet Seehra at the Office of Management and Budget, Desk Officer for DoD, Room 10236, New Executive Office Building, Washington, DC 20503, or email Jasmeet_K._Seehra@omb.eop.gov, with a copy to the Defense Acquisition Regulations System, Attn: Ms. Amy G. Williams, OUSD(AT&L)DPAP/DARS, Room 3B941, 3060 Defense Pentagon, Washington, DC 20301-3060. Comments can be received up to 60 days after the date of this notice, but comments to OMB will be most useful if received by OMB within 30 days after the date of this notice.
Public comments are particularly invited on: Whether this collection of information is necessary for the proper performance of functions of the DFARS, and will have practical utility; whether our estimate of the public burden of this collection of information is accurate, and based on valid assumptions and methodology; ways to enhance the quality, utility, and clarity of the information to be collected; and ways in which we can minimize the burden of the collection of information on those who are to respond, through the use of appropriate technological collection techniques or other forms of information technology.
To request more information on this proposed information collection or to obtain a copy of the proposal and associated collection instruments, please write to the Defense Acquisition Regulations System, Attn: Ms. Amy G. Williams, OUSD(AT&L)DPAP/DARS, Room 3B941, 3060 Defense Pentagon, Washington, DC 20301-3060, or email osd.dfars@mail.mil. Include DFARS Case 2014-D005 in the subject line of the message.

Wednesday, September 23, 2015

HomeBusinessStory Atmel to be acquired by UK's Dialog Semiconductor in $4.6 billion deal


A British semiconductor company that supplies chips to Apple said Monday it is acquiring Silicon Valley's Atmel in a $4.6 billion deal that strengthens both companies to compete for business in the coming Internet of Things.
The acquisition has a smaller Dialog Semiconductor, based in the United Kingdom with 1,500 worldwide employees, buying Atmel, based in San Jose with 5,200 global employees, for more than Dialog's market value. Dialog is issuing new shares and borrowing to finance the purchase.
The deal is something of a surprise, said Mark Hung of Gartner. Atmel was known to be for sale, but either a Chinese company or a larger American chip maker was expected to be the buyer.
Chipmaker Dialog Semiconductor is buying San Jose-based Atmel for about $4.6 billion. (Atmel photo)
Chipmaker Dialog Semiconductor is buying San Jose-based Atmel for about $4.6 billion. (Atmel photo)
But "both companies are in some of the more industrial and automotive applications, and there they compliment each other very well," he said.
The deal doubles Dialog's revenue base and helps it diversify its offerings, said Stacy Rasgon of Sanford Bernstein. "You could argue there's a fit. It's a smaller European company buying a bigger U.S. company. We'll see how it works out."
Making chips for iPhones and iPads is a major source of revenue for Dialog.
Atmel investors were relatively happy with a cash and stock deal that gives them a 43 percent premium on their shares, but Dialog shares were down 18 percent on the Frankfurt exchange. Atmel closed at $8.19, up 12.65 percent.
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"If this is approved by both sides, it is a win-win," said Christopher Rolland of FBR Capital Markets. "For Atmel, it gives shareholders an exit at a fair and reasonable price, and for Dialog, it gives shareholders diversification, scale" and growth in assets.Mergers among semiconductor companies have reached record levels in the past year as smaller companies combine forces to cope with the rising cost of making chips.
"It's a pretty broad competitive landscape that's pretty challenging" for companies like Atmel, said Betsy Van Hees of Wedbush Securities. "They need to continue to invest, which is expensive, and they need new products, which is expensive."
Other chip companies that have combined forces recently include Cypress Semiconductor, which acquired Spansion; Avago Technologies, which acquired Broadcom and LSI, and Intel, which recently announced it is acquiring Altera in a deal aimed at strengthening its cloud offerings.
Dialog said the acquisition will create a company with $2.7 billion in revenue from products for mobile power, the Internet of Things, the automotive and other industries. Cost "synergies" of $150 million a year are hoped for within two years.
Steve Laub, president and CEO of Atmel, said in a letter to customers that the combination of Dialog, a fabless semiconductor maker mainly in power management, with Atmel, which makes micro controllers, will "create a semiconductor franchise with the requisite scale, technology, products and worldwide team with a greater ability to scale with our customers, innovate and drive growth."
In May, Laub announced his intention to retire at the end of August, but he has remained on hand for the acquisition.
The combined company will have "a strong presence" in mobile, industrial and automotive markets and give it a "leading position" in the Internet of Things, he said.
The transaction is for $2.5 billion in equity and $2 billion in cash and is expected to close in the first quarter of 2016.


http://www.mercurynews.com/business/ci_28853187/atmel-be-acquired-by-uks-dialog-semiconductor-4

Monday, September 21, 2015

IBM CEO Ginni Rometty's secret to a successful career

Bet big and don’t look back.

MPW Insider is an online community where the biggest names in business and beyond answer timely career and leadership questions. Today’s answer for:What is the biggest leadership lesson you’ve learned in the past year? is written by Ginni Rometty, CEO, chairman and president of IBM.
I’d say the biggest lesson – or reminder – was the importance of moving to the future, making decisions for the long term and betting big. That’s something everyone says, but it’s easier said than done. When it comes to managing for the long term, we sold our semiconductor manufacturing operations last year. We did it in order to move to higher value. We actually shrank the company while many voices were calling out for top-line growth. And it’s doubly hard with something that has been part of your company for more than half a century. While chip research and development are critical, chip manufacturing was no longer core to IBM’s future. We’ve done this before — with PCs and commodity servers — and no doubt we’ll do it again. It’s what you do when your goal isn’t just short-term results, but successfully leading your industry in the future. And when it comes to betting big, we’ve placed a very big bet on an entirely new model of computing — what we call cognitive.”
At the forefront is the system we call Watson. It includes a range of technologies, including those often grouped under “artificial intelligence.” Watson understands all types of data, and importantly — profoundly — Watson isn’t programmed. Watson learns. He is being trained by experts in healthcare and in an increasing number of industries and professions. The bet we have placed on Watson isn’t merely the size of the investment — now in the billions. The truly big bet was in opening up Watson to the world — putting him on the cloud, making Watson’s APIs open and available to the world’s developers, entrepreneurs and businesses — building an open ecosystem. We are already seeing how much faster the business is growing and scaling through this approach. And our partners are bringing their own creativity and aspirations to Watson. The innovation is stunning. And that’s what happens when you bet big, not on a product but on an era.

http://fortune.com/2015/09/17/ginni-rometty-ibm-secret-to-success/

Thursday, September 17, 2015

Intel Invests $67M Into 8 Chinese Companies, Including Segway Owner Ninebot

Fresh off a $60 million deal with Shanghai-based drone maker Yuneec, Intel is continuing to ramp up its investment in Chinese tech startups after the U.S. firm revealed it has pumped $67 million into eight companies in the country.
Each deal isn’t broken out into specific investment size, but Intel said the companies it has backed span a range of verticals, including internet-of-things, smart devices, transportation and big data. There are very obvious synergies with the Intel mothership with each one, as you’d expect.
The full list includes:
  • 99cloud — an OpenStack-based solutions and operations company
  • Bluebank — a hardware firm that creates smartphones, tablets and software for brands and other third parties
  • Hampoo — a Shenzhen-headquartered company that provides a range of components and operations required to create smart devices and other kinds of hardware
  • Ninebot — the company that acquired Segway earlier this year and raised $80 million in funding from Xiaomi and Sequoia. (Ninebot claims customer in over 100 countries and a 60 percent share of the global “personal transporters” market.)
  • Nuovo Film — the company’s “transparent conductive silver nanowire film” technology enables touch screen technology, like Apple’s Force Touch and 3D Touch features, across a range of verticals that include mobile devices, PCs, whiteboards and even coffee machines.
  • PraFly — produces robotics and control systems that are used across manufacturing, smart devices, in-vehicle systems and more
  • AWcloud — a provider of OpenStack Cloud solutions for enterprise customers
  • Telink — which develops low power radio-frequency and mixed signal system chips which power Internet of Things devices like smart bulbs
Intel, which has now reached 30 years of business in China, revealed that it has put nearly $2 billion in over 140 China-based companies to date. That figure is distorted by its $1 billion investment in chip maker Beijing UniSpreadtrum last year, but the U.S. firm said that an impressive 35 of its China portfolio have exited via a public offering or acquisition.
The deal for Yuneec, which was just days after rival EHANG landed a $42 million Series B and months after DJI raised at a reported $8 billion valuation, showed that Intel is upping the ante with its China-based funds, but today’s news shows it is still going after its bread and butter areas and not just sexy stuff like drones.
“The investments demonstrate Intel’s commitment to fostering Chinese technology innovation and accelerating China’s technology ecosystem development,” Intel said in a statement.

http://techcrunch.com/2015/09/16/intel-invests-67m-into-8-chinese-companies-including-segway-owner-ninebot/

Wednesday, September 16, 2015

Qualcomm Quick Charge 3.0 goes from 0 to 80 percent in 35 minutes

Qualcomm's latest line of SoCs have a new charging feature, dubbed Quick Charge 3.0. The new standard, which will ship on the Snapdragon 820, 620, 618, 617, and 430 next year, promises to take a phone battery from 0 to 80 percent in about 35 minutes. Qualcomm says the new charging standard will "improve fast charging up to 27 percent or reduce power dissipation by up to 45 percent when compared to Quick Charge 2.0." provided vendors use Qualcomm's "advanced parallel charging configurations."
The new standard uses an algorithm called "Intelligent Negotiation for Optimum Voltage (INOV)" which lets the device continually request a power level from the charger, from 3.6V to 20V, in 200mV increments. Quick Charge 2.0 only offered four charging voltages, but 3.0 offers 82 different voltage "sizes," which Qualcomm says results in "minimized losses, increased efficiency, and improved thermal performance."
Quick Charge 3.0 is backward compatible with versions 1.0 and 2.0 and is connector-independent. You'll need a new phone and a new charger to take advantage of the higher speeds.
Qualcomm says to expect the speedier charging standard in new phones due out next year.

http://arstechnica.com/gadgets/2015/09/qualcomm-quick-charge-3-0-goes-from-0-to-80-percent-in-35-minutes/

Friday, September 11, 2015

Qualcomm's Snapdragon Flight Promises Lighter, Simpler, More Powerful Flying Cameras

Qualcomm, the world’s leading developer of chips for smartphones, today unveiled a platform for consumer drones that it says can make the flying vehicles lighter and less complex while supporting the camera functionality of the most sophisticated offerings on the market today.
The Qualcomm Snapdragon Flight (which gets its name from Qualcomm’s premium tier Snapdragon 801 processor) is the reference platform developed over the last six months by the San Diego-based chip giant’s research and development lab, and features support for a 4K camera for video, two cameras for depth, and a fourth camera for indoor stabilization, Fast Company has learned.
Qualcomm Snapdragon Flight
In short, Qualcomm says it has created the basis for the world’s smallest flying 4K cameras, capable of 1080p video at 60 frames per second, drones that are in their entirety lighter than the gimbals on many existing drones with 4K cameras.
The first known customer is Yuneec, a Chinese rival to drone industry giant DJI.
Qualcomm hopes the Snapdragon Flight will be adopted by both existing drone manufacturers and newcomers to the burgeoning space. Given that a January report from Radiant Insights suggested the global commercial drone market is expected to expand from $609 million in 2014 to $4.8 billion by 2021, Qualcomm is betting its new platform could bring it a substantial amount of business in the coming years.
That seems likely, said one drone industry expert.
"The integration of Qualcomm’s Snapdragon processors in drones will have the same effect that it’s had on mobile devices," said Colin Snow, founder and CEO of Drone Analyst. "Drones will get even sharper image capture and post-processing, improved performance, and better communications. Combining chips will not only improve imaging and imaging options, but will also improve precious battery power as overall weight of the drone drops."
Added Snow, "4G LTE connectivity will benefit drones since they can use that network to transfer images and eventually use it for communicating to a yet-to-be-developed unmanned traffic management system."
All that said, it is notable that the platform isn’t launching with DJI or other industry heavyweights like 3D Robotics, as customers. For Snapdragon Flight to provide a substantial financial windfall to Qualcomm, it will need to be adopted by companies that sell significant numbers of drones.
3D Robotics's IRISPhoto: 3D Robotics
"The interest level has been great from everybody including the big companies and small companies," said Raj Talluri, senior vice president of product management in Qualcomm’s Internet of Things business unit. "We are hoping that all the companies making drones will be interested in this….The goal of our launching the platform is to make it easy for everybody not to have to develop from scratch. It’s a good starting point and then [manufacturers] can differentiate."
Those that do adopt the new platform, Talluri said, should be able to start selling drones based on it by the first half of 2016, and possibly sooner.
Snapdragon Flight will support Sony IMX camera sensors for video, and Omnivision OV7251 sensors for computer vision. All the processing of the data coming in from those cameras is done on the board, said Talluri.
The board has built-in 802.11n and Bluetooth LE communications as well, and will in the "near future" offer support for 4G LTE dongles, a company spokesperson said. All told, the board is 58 millimeters by 40 millimeters and weighs less than 13 grams.
"The vast majority of a drone’s power consumption goes to the motors," Chad Sweet, the director of engineering in Qualcomm Research’s R&D Lab, told Fast Company, "and the size of the motors and the drone are dictated by the payload weight. So when you can shrink the payload size and weight, you can effectively make a smaller drone. And smaller drones are safer and much more consumer friendly."
Further, Sweet said, the Qualcomm approach should significantly simplify the electronics inside drones incorporating Snapdragon Flight. "Many of the popular [drone] platforms have between 10 and 12 [printed circuit boards]," he said. "On a platform such as ours, you would have two PCBs without a mechanical gimbal, and possibly a third PCB with a mechanical gimbal. So it drastically reduces the complexity of the system."
Qualcomm’s drone work came out of research it’s done on using its smartphone chips in robotics. The company has determined that the sensors it embeds on boards in mobile devices are perfect for integrating with one of today’s hottest consumer products.
"The most interesting area of robotics that’s kind of taken off from the market perspective," Sweet said, "are the drones….The main use case is really flying cameras. The camera’s one of the most important features of a smartphone, so as part of Snapdragon, we’ve put a huge effort into developing a high-quality image-processing pipeline."
Qualcomm Snapdragon Flight details
The new platforms also offers a wider scope for customization. Drone manufacturers can control flights on the application side and determine what kind of processing they want, Sweet said.
"Having this much processing power really opens up the differentiation substantially," he said. "They now have the compute capability to do different things. On many contemporary products, there’s not much compute capability."
Those that do have decent on-board processing power, he said, include 3D Robotics’ Solo, and DJI’s Matrice.
Lastly, the Snapdragon platform also offers support for very-low-latency first-person view that can be done in parallel while recording 4K video, Sweet said. The goal in Qualcomm’s R&D lab has been lag of less than 150 milliseconds, what he called the "video game threshold."

http://www.fastcompany.com/3050210/tech-forecast/qualcomms-snapdragon-flight-promises-lighter-simpler-more-powerful-flying-came

Friday, September 4, 2015

Intel Wants to Get Inside the Factory

Makers of semiconductors spend upward of $5 billion to build and operate fabrication plants—known as “fabs”—that run 24 hours a day so they can recoup their investment before the equipment becomes obsolete in five years or so. Rows of pristine machines sit in windowless cleanrooms, which are almost as free of humans as they are of dust. Intel and Texas Instruments have spent decades perfecting this almost sci-fi form of manufacturing. Now they want to show the rest of the world how it’s done.
The chipmakers have set their sights on what researcher IHS estimates is a $185 billion global market for gear to automate industrial production. To capture a portion of that spending, they’re prodding companies to bring the Internet of Things—a term that describes a world in which physical objects are embedded with electronics and talk to each other—into factories. “It’s moving beyond hype and into engineers rolling up their sleeves,” says Doug Davis, senior vice president of the IoT division at Intel, which had more than $2 billion in sales last year. “The economic value and impact are unquestioned.”
In the assembly line of tomorrow, industrial robots now caged off to prevent them from accidentally injuring human workers will move about more freely. A machine outfitted with optical and motion sensors would be able to detect a hand that is delivering a tray of parts and adjust its movements so as not to inflict damage.
Intel is also working on technology to make humans less error-prone. Last year it showed off an “intelligent” glove that uses chips to power a simple display on the wrist. If the person wearing the glove completes an assembly task correctly, a large green check mark appears. If not, a red cross flashes on the screen. Conceived by Workaround, a German startup founded by ex-BMW employees, the glove could become a useful accessory at auto plants or electronics factories.
Autonomous robots and bionic line workers are still years if not decades away. Ethernet connections are only just making their way onto factory floors, while Wi-Fi hardly has made a dent, which means most plants don’t have a communications platform to support an Internet of Things. This is partly by design: Hackers can’t penetrate systems that aren’t connected to the outside. “The best way to protect your system is to disconnect it from the rest of the world,” says Avner Goren, who heads embedded processing for Texas Instruments. His unit contributed a fifth of the company’s $13 billion in revenue last year. “The idea of IoT is to connect it to the rest of the world.”
To allay companies’ security concerns, Goren is pushing the deployment of multiple networks. That way a wireless link that transmits information on the internal workings of a machine can’t be hijacked to take control of the machine itself. That’s pretty much what happened in a staged hack of a Jeep Cherokee in July.
Intel says it’s already demonstrated the benefits of the Internet of Things at one of its own plants. At a facility whose location the company declined to name, a combination of sensors and software correctly identified that vacuum pumps used in the manufacture of silicon wafers were about to fail. What tipped them off? Irregularities in the pumps’ normal pattern of vibrations.
Selling factory owners on the use of electronics for discrete functions, such as maintenance, will be easier than persuading them to overhaul their entire setup so that every piece of equipment is churning out a stream of data that can be parsed by computers. Some see a day when factories will be able to talk directly to warehouses, which will be in communication with stores, which will allow companies to tailor production more carefully to demand. “The big goal of smart manufacturing is to network the entire supply chain,” says Mark Watson, an analyst for IHS. “That is a fair way off.”

http://www.bloomberg.com/news/articles/2015-09-03/intel-wants-to-get-inside-the-factory


Wednesday, September 2, 2015

Intel Overhauls Chips in Bid to Revive PC Sales

Intel Corp. is overhauling its flagship line of computer chips, in a high-stakes bid to revive personal-computer sales.

Read the full article - 

http://www.wsj.com/articles/intel-overhauls-chips-in-bid-to-revive-pc-sales-1441155601?tesla=y

Tuesday, September 1, 2015

Investment firm Pleasant Lake offers to buy MagnaChip


Investment firm Pleasant Lake Partners LLC offered to buy analog chipmaker MagnaChip Semiconductor Corp in a deal valuing the South Korea-based company at about $346 million.
MagnaChip's shares were up 5 percent at $8.12 in mid-morning trade.
The $10-per-share offer of Pleasant Lake, which owns 9.9 percent of MagnaChip, is at a premium of 29 percent to MagnaChip's Friday closing price.(1.usa.gov/1fRbi5p)
MagnaChip's chips are used in smartphones, tablets and television. The company also makes chip-making equipment for analog chipmakers.
New York-based Pleasant Lake said in a letter to MagnaChip on Monday it had requested MagnaChip that it be included in any upcoming auction process, but had not received a response.
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MagnaChip established a strategic review committee in June to look for a sale of all or a substantial portion of the company.
The company engaged Barclays as its financial adviser for the process.
MagnaChip's total revenue fell 5.8 percent to $162 million in the second quarter ended June 30, from a year earlier.
Up to Friday's close, MagnaChip's stock had fallen 40.4 percent this year.


http://uk.reuters.com/article/2015/08/31/us-magnachip-m-a-pleasent-lake-idUKKCN0R01G520150831