Startup Works on Ultralow-k Materials for Chips, Displays

The very last presentation at the 12^th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.
After apologizing for his lack of expertise in chip packaging, Pakbaz laid out the case for using his Silicon Valley startup’s patented Liquid Phase Self Assembly technology for designing siloxane-based materials.
Based in San Jose, Calif., with an office in Albuquerque, N.M., SBA Materials has an impressive roster of investors – Intel Capital (through three rounds in two years), Samsung Venture Investment Corporation, Air Liquide Venture Capital, Tokyo Electron Venture Capital, Rock Hankin, William Cook (a co-founder and former CEO of the startup), Southern Cross Venture Partners, and Sun Mountain Capital. SBA Materials has not disclosed its total amount of venture funding, which extends over four rounds.
Materials with a low dielectric constant were first introduced more than a decade ago, and the semiconductor industry migration to making chips with 7-nanometer features will involve the integration of low-k materials, Pakbaz said at the 3D ASIP conference.
SBA’s goals are to “maintain existing composition” and “avoid random porosity,” Pakbaz said. With the LPSA technology, the company can offer low-k materials that are “not ordered and not random,” he added.
The films are spin-coated on a substrate, then subjected to a soft bake at 150 degrees C, according to Pakbaz. The resulting films can vary in thickness from 60 nanometers to 2 microns, he said.
“Our material is nice and sharp,” Pakbaz asserted. “Our material is quite stable.”
While SBA’s uLK advanced electronic materials are aimed at back-end-of-line and packaging applications in chip making, there are “applications beyond BEOL,” Pakbaz said at the conference.
“We see great promise for the LPSA material platform, not just in semiconductors, but also in various applications, including displays,” Dong-Su Kim, a vice president of Samsung Ventures America, said in a statement. He joined the SBA board of directors last year.
SBA has its material manufactured is Japan, Pakbaz noted, and it is working with imec in Belgium and Fraunhofer IPMS-CNT in Germany on development of its ultralow-k material.


http://semimd.com/blog/2015/12/21/startup-works-on-ultralow-k-materials-for-chips-displays/

Semiconductor imaging technique improves cancer detection - See more at: http://www.newelectronics.co.uk/electronics-news/semiconductor-imaging-technique-improves-cancer-detection/111826/#sthash.fz9XTlwo.dpuf

Researchers from the University of Glasgow have found a way to make swallowable cameras more effective at detecting cancers of the throat and gut. These tiny sensing systems have proven to be a valuable clinical alternative to more intrusive imaging methods such as endoscopes.

Until now, the systems, often known as video-pill, have relied on illuminating patients’ innards using a small light source, restricting clinicians to conclusions based on what they can see in the spectrum of visible light.
The researchers from the University’s School of Engineering have used an advanced semiconductor single-pixel imaging technique to create fluorescent light for the first time to expand the diagnostic capabilities of the video-pill.
Flurorescence imaging is already a powerful diagnostic tool in medicine, capable of clearly identifying in patients the rich blood supplies which support cancers and help them to grow, but which can be missed by examination under visible light. However, past fluorescence imaging technologies have been expensive, bulky and consume substantial power, confining the technique to laboratories and hospital examination rooms.
Research associate, Dr Mohammed Al-Rawhani said: “We’ve confirmed in the lab the ability of the system to image fluorescence ‘phantoms’ – mixtures of flavins and haemoglobins which mimic closely how cancers are affected by fluorescence in parts of the body like the intestines, the bowel and the oesophagus.
“It’s a valuable new technique which could help clinicians make fewer false positives and negatives in cancer diagnosis, which could lead to more effective treatment in the future.”
Professor David Cumming, the University of Glasgow’s chair of Electronic Systems, said: “There’s still some way to go before it will be ready for commercial production and clinical use, but we’re in early talks with industry to bring a product to market. We’re also interested in expanding the imaging capabilities of video-pill systems to new areas such as ultrasound in the near future.”
- See more at: http://www.newelectronics.co.uk/electronics-news/semiconductor-imaging-technique-improves-cancer-detection/111826/#sthash.fz9XTlwo.dpuf

Researchers from the University of Glasgow have found a way to make swallowable cameras more effective at detecting cancers of the throat and gut. These tiny sensing systems have proven to be a valuable clinical alternative to more intrusive imaging methods such as endoscopes.

Until now, the systems, often known as video-pill, have relied on illuminating patients’ innards using a small light source, restricting clinicians to conclusions based on what they can see in the spectrum of visible light.
The researchers from the University’s School of Engineering have used an advanced semiconductor single-pixel imaging technique to create fluorescent light for the first time to expand the diagnostic capabilities of the video-pill.
Flurorescence imaging is already a powerful diagnostic tool in medicine, capable of clearly identifying in patients the rich blood supplies which support cancers and help them to grow, but which can be missed by examination under visible light. However, past fluorescence imaging technologies have been expensive, bulky and consume substantial power, confining the technique to laboratories and hospital examination rooms.
Research associate, Dr Mohammed Al-Rawhani said: “We’ve confirmed in the lab the ability of the system to image fluorescence ‘phantoms’ – mixtures of flavins and haemoglobins which mimic closely how cancers are affected by fluorescence in parts of the body like the intestines, the bowel and the oesophagus.
“It’s a valuable new technique which could help clinicians make fewer false positives and negatives in cancer diagnosis, which could lead to more effective treatment in the future.”
Professor David Cumming, the University of Glasgow’s chair of Electronic Systems, said: “There’s still some way to go before it will be ready for commercial production and clinical use, but we’re in early talks with industry to bring a product to market. We’re also interested in expanding the imaging capabilities of video-pill systems to new areas such as ultrasound in the near future.”
- See more at: http://www.newelectronics.co.uk/electronics-news/semiconductor-imaging-technique-improves-cancer-detection/111826/#sthash.fz9XTlwo.dpuf

Researchers from the University of Glasgow have found a way to make swallowable cameras more effective at detecting cancers of the throat and gut. These tiny sensing systems have proven to be a valuable clinical alternative to more intrusive imaging methods such as endoscopes.

Until now, the systems, often known as video-pill, have relied on illuminating patients’ innards using a small light source, restricting clinicians to conclusions based on what they can see in the spectrum of visible light.

The researchers from the University’s School of Engineering have used an advanced semiconductor single-pixel imaging technique to create fluorescent light for the first time to expand the diagnostic capabilities of the video-pill.
Flurorescence imaging is already a powerful diagnostic tool in medicine, capable of clearly identifying in patients the rich blood supplies which support cancers and help them to grow, but which can be missed by examination under visible light. However, past fluorescence imaging technologies have been expensive, bulky and consume substantial power, confining the technique to laboratories and hospital examination rooms.
Research associate, Dr Mohammed Al-Rawhani said: “We’ve confirmed in the lab the ability of the system to image fluorescence ‘phantoms’ – mixtures of flavins and haemoglobins which mimic closely how cancers are affected by fluorescence in parts of the body like the intestines, the bowel and the oesophagus.
“It’s a valuable new technique which could help clinicians make fewer false positives and negatives in cancer diagnosis, which could lead to more effective treatment in the future.”
Professor David Cumming, the University of Glasgow’s chair of Electronic Systems, said: “There’s still some way to go before it will be ready for commercial production and clinical use, but we’re in early talks with industry to bring a product to market. We’re also interested in expanding the imaging capabilities of video-pill systems to new areas such as ultrasound in the near future.”

- See more at: http://www.newelectronics.co.uk/electronics-news/semiconductor-imaging-technique-improves-cancer-detection/111826/#sthash.fz9XTlwo.dpuf

http://www.newelectronics.co.uk/electronics-news/semiconductor-imaging-technique-improves-cancer-detection/111826/

Fab Tool Biz Looks Cloudy

Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016.
In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam.
In 2015, though, the big story was fairly apparent. In April, Applied Materials’ proposed acquisition of Tokyo Electron Ltd. was scrapped due to regulatory issues. Then, in October, Lam Research grabbed the headlines by entering into a definitive agreement to acquire KLA-Tencor for $10.6 billion.
Going forward, 2016 could be another big year on the acquisition front. But it could also be a relatively sluggish year for the equipment industry. “In general, our estimate is for wafer fab equipment spending in 2016 to remain flat relative to 2015, with some potential upsides,” said Arthur Sherman, vice president of marketing and business development at Applied Materials.
One area of concern is the foundry segment. Equipment vendors are banking on new tool orders from foundries for the 10nm node in 2016, but the ramp could take longer than expected. “We believe concerns over customer demand at 16nm/14nm and inventory will lead to a slower ramp of 10nm,” said Patrick Ho, an analyst with Stifel, Nicolaus & Co. “We believe 10nm projects have pushed out somewhat into 2017.”
In addition, capital spending for memory is a mixed bag. Advanced packaging is a bright spot. And the used/mature equipment segment continues to pick up steam. “Demand for power management, RF, MEMS, CIS and sensors will continue to grow in 2016,” said Joanne Itow, an analyst with Semico Research. “This will drive the demand for more mature technology capacity.”
To get a grasp on the trends for the equipment business in 2016, Semiconductor Engineering has taken a look at several markets, such as photomasks, foundry, memory, and used gear.
The numbers and consolidation
To be sure, 2016 appears to be a mixed bag. David Jensen, vice president of strategic marketing at GlobalFoundries, projects that the overall IC market will decline by more than 1% in 2015, but the chip business could rebound and grow by around 3% in 2016. In addition, the foundry business will grow by 6% to 6.5% in 2015, with another 5% to 7% growth projected for 2016, Jensen said. “Generally speaking, across the board, there is a little bit more bullishness about 2016,” he said.
In 2015, the wafer fab equipment (WFE) market is projected to reach between $31.5 billion to $32 billion, or flat to slightly down from 2014, according to Ho from Stifel, Nicolaus, who attributed the lackluster figures on a reduction in foundry spending.
Citing another sluggish year for foundry spending, Ho recently cut its overall WFE forecast in 2016, from $34 billion to $32 billion. “The biggest variables heading into 2016 are foundry spending, which is on the downside, and NAND flash spending, which is on the upside,” he said.
Besides a flat year for capital spending, Ho also sees more consolidation in the equipment business. In reality, the shakeout in the equipment market started in the 1980s. In those days, a multitude of chipmakers had what was then considered advanced fabs.
Then, at 90nm, fab and tool costs soared. Fewer chipmakers could afford to build advanced fabs. Many IDMs, or chipmakers with fabs, ditched their plants and embraced the foundry model. And over time, a select few, leading-edge chipmakers with deep pockets emerged. But even those vendors face some challenges today. Chip scaling is becoming more expensive and difficult at each node. On top of that, the node transitions are slowing.
In any case, the dwindling base of IDMs translated into fewer companies that could afford to buy leading-edge semiconductor gear. This, in part, fueled the shakeout in the equipment industry.
More recently, there are other factors at play. Generally, the smaller equipment vendors lack the resources to advance their product roadmaps. And so, the larger tool vendors are gobbling up the smaller firms to expand their portfolios.
All told, the fab tool shakeout is far from over. “There should be more M&A in the group, particularly among the small cap companies,” said Ho from Stifel, Nicolaus. “We have noted for a long period of time that the process control marketplace needs to consolidate with many small niche players, like Nanometrics, Nova Measuring Instruments and Rudolph Technologies, all at similar revenue levels. We also believe other niche players like Ultratech and Axcelis also need to find potential partners that can better position their growth going forward.
“While there is always the sentiment of hoping for a larger player to take one of these companies out, we believe the better interim story is to partner with one another, and we mean where the synergies fit, to create a larger scale company that can compete more effectively in today’s market environment,” Ho said.
Mask shop trends
To be sure, the IC equipment and materials sectors are tough businesses, especially one critical part of the supply chain—photomasks. In total, the photomask industry is expected to reach $3.4 billion in 2016, up from $3.3 billion in 2015, according to SEMI.
As before, photomask makers continue to migrate to the next nodes. But mask production is becoming more complex and expensive at each stop. In addition, mask complexity is also increasing.
For example, foundries are ramping up their 16nm/14nm processes, with 10nm just around the corner. “2016 will see a growing number of 10nm design starts, which will bring a number of issues to the mask industry,” said Aki Fujimura, chief executive of D2S. “Tighter process windows, increasingly complex mask shapes, smaller assist features and curvilinear mask features will drive new requirements for mask making, inspection and repair.”
Fujimura also sees other mask-related developments in 2016. “For example, increasingly complex masks will lead to the need for inverse lithography technology (ILT). Mask write times will continue to increase, and we’ll also see slower and more accurate resists,” he said.
For years, the biggest problem in the mask shop is write times, which are increasing at each node. The problem? Single-beam e-beam tools are unable to keep pace with complex masks.
The solution: multi-beam e-beam mask writers. In fact, the IMS-JEOL duo and NuFlare could separately ship the industry’s first multi-beam mask writers in 2016.
In addition, the photomask industry could see the long-awaited insertion of ILT. ILT introduces new sub-resolution auxiliary features on the mask, which boosts pattern fidelity.
“2016 looks to be a strong year for captive mask houses as they ramp for 10nm. A significant number of masks are (also) moving to an inverse lithography format,” said Takuji Tada, senior manager of corporate strategy and marketing at KLA-Tencor. “The move to inverse lithography masks has created a new demand for more stringent inspection and metrology in the mask shop.”
Foundry spending falls
On the fab side, equipment makers hope for a rebound in the logic and foundry sectors in 2016. Led by Intel, the WFE market for logic is projected to increase by 10% to 15% in 2016, according to Stifel, Nicolaus. But on the downside, the WFE market for foundries is expected to decline 5% to 10% in 2016, according to the firm.
“We believe foundry will experience modest growth next year, primarily characterized by some 28nm investment, some trailing edge, some capacity additions for 14nm and 16nm, and the beginning of 10nm investment,” said Satya Kumar, vice president of corporate marketing at Lam Research. “We believe our customers are on track to ramp 10nm investments in the second half of 2016.”
Others agree. “Calendar year 2015 saw the lowest foundry spending levels in the past four years,” Applied’s Sherman said. “We anticipate investment levels will be slightly higher for 2016, with most of the spending happening in the second half of the year. More than 50% of this investment will be focused on ramping 10nm technology. For foundries, 10nm differs from the 16nm node, as significant changes are being made with respect to the finFET and interconnect to improve device performance and power consumption.”
There are other bright spots. Chipmakers will extend 193nm immersion and multi-patterning to 10nm. This will fuel the growth for deposition and etch.
Process control also could see a boost in 2016. “The increased need for process control is driven by higher process complexity of multi-patterning and vertical structures used in logic and memory,” KLA-Tencor’s Tada said.
Meanwhile, behind the scenes, foundries are also developing 7nm. At 7nm, vendors hope to insert extreme ultraviolet (EUV) lithography. This, of course, depends on the status of the power source, resists and EUV mask infrastructure. “While EUV will not be arriving in 2016, the industry has a lot of work ahead to make sure the infrastructure is ready for it when it does arrive,” D2S’ Fujimura said.
Memory Lane
Like the foundry/logic sectors, it’s a mixed bag for memory. “Overall, we support the opinion of flat to slightly down WFE in 2016,” Lam’s Kumar said. “Taking a look at the segments, we expect the memory market to be down, which is mostly a result of DRAM. However, within DRAM, we expect to see 20nm conversion spending and some initial 1xnm spending. We think that the weaker overall DRAM will be offset by growth in NAND, primarily relating to 3D NAND.”
The WFE market for DRAM is projected to fall by 10% to 20% in 2016, according to Stifel, Nicolaus. But thanks to strong SSD demand, the WFE market for NAND is expected to grow by 10% to 20% in 2016, according to the firm.
While planar NAND remains robust, 3D NAND continues to generate steam. In total, the installed capacity of 3D NAND is projected to grow from about 150,000 wafer starts per month in 2015, to 300,000 by the end of 2016, according to Stifel, Nicolaus.
“We believe that 3D NAND has a long technology roadmap and we are still in the early innings,” Lam’s Kumar said. “We expect about a quarter of the industry capacity converted to 3D NAND by the end of 2016.”
Used tool demand
Amazingly, the used/mature equipment market remains robust in select businesses. “We have been experiencing strong demand growth for our equipment for larger design rules to support automotive, industrial, sensors, and various IoT applications,” KLA-Tencor’s Tada said.
For these applications, chipmakers use both 200mm and 300mm tools, many of which are used and/or refurbished.
In either case, buyers of used equipment will need to keep a close eye on the market. “A few used equipment vendors stocked up on tools at the end of 2014 and managed to have a very good year selling that stock throughout 2015,” Semico’s Itow said. “Transactions are slow now. It could be a seasonal slowdown.”
What about 2016? “Some vendors are already taking orders for next year and used equipment vendors are stocking up as the ‘More than Moore’ IDMs continue to plan their expansions and transitions,” Itow said. “There isn’t much 200mm equipment inventory just sitting around (today). So it is slightly more difficult to get some tools. If the market picks up in early 2016, things could get tight leading to slightly higher prices. Used equipment vendors are still not seeing much activity in 300mm tools. That is because 300mm tools are being sold directly, such as IDM to IDM, or IDM to a foundry.”

http://semiengineering.com/fab-tool-biz-looks-cloudy/

Korean chipmakers' share in global DRAM market hits record high

SEOUL, Dec. 15 (Yonhap) -- South Korean chipmakers garnered a record-high share in the global market for dynamic random access memory (DRAM) chips in the third quarter, data showed Tuesday, further widening the gap with other global rivals.
Samsung Electronics Co. took up 45.9 percent of the global DRAM market in the July-September period, up 3.6 percentage points from a year earlier, the data compiled by industry tracker IHS showed.
With Samsung's local rival SK hynix Inc. also taking up 27.6 percent of the market in the third quarter, the combined share held by the two South Korean firms came to 73.5 percent, up 5.2 percentage points from the previous year.
It marked the fifth consecutive quarter for the two South Korean firms to expand their combined presence in the global market.
U.S.-based Mircon Technology Inc., on the other hand, posted the lowest share since its acquisition of Japan's Elpida Memory in 2013. Micron took up 19.8 percent of the DRAM market in the third quarter, down 4.2 percentage points from a year earlier.
Two Taiwanese players followed, with Nanya Technology Corp. holding 2.8 percent and Winbond Electronics Corp. 1.3 percent.

http://english.yonhapnews.co.kr/business/2015/12/15/56/0501000000AEN20151215001200320F.html

Apple just paid $18 million to buy a small chipmaking factory

Apple paid $18.2 million to buy a small chipmaking factory in San Jose that could help the company test new chips to power its products, according to a report in the Silicon Valley Business Journal. 

Apple purchased the 70,000-square foot facility from chipmaker Maxim Integrated Products last week, the Business Journal said, citing public records. The facility includes chip manufacturing tools and is located near Samsung Semiconductor, one of the main manufacturers for Apple's A9 processor, the chip at the heart of the iPhone. 

Apple currently designs the main processor used in its iPhones, iPads and Apple Watch devices, while Samsung and and TSMC manufacture the actual chips.

The real estate deal suggests that Apple may want to take a more hands-on role creating its chips, but does not necessarily mean the company will start manufacturing its own chips. 

For one thing, the facility is small. As the marketing material for the property says, the facility is well suited for "prototype, pilot and low-volume manufacturing."

It's not unusual for chip companies to operate special, small-scale "fabs" where new chip designs are tested and tweaked, with volume production handled at significantly larger facilities. 

The equipment in the fab is also geared for the analog and mixed-signal chips that Maxim develops, and is not cutting-edge enough to produce Apple's A9 processors. The A9 processors feature tiny transistors measuring 14 nanometers and 16 nanometers, which is pretty much the most advanced technology available today. The equipment at the Maxim facility, by contrast, is capable of building chips with much less advanced transistors that measure anywhere from 600 nanometers to 90 nanometers.

Apple could upgrade the facility by purchasing and installing more cutting-edge equipment. Or it's possible that Apple wants to use the facility to test other types of chips besides its line of processors
http://www.businessinsider.com/apple-buys-small-chip-fab-2015-12

Atmel Receives Buyout Offer That May Top Dialog's Merger Bid

Atmel Corp., which agreed in September to be acquired by Dialog Semiconductor Plc, said it received an unsolicited bid of $9 a share in cash that may top the Dialog deal.
The San Jose, California-based chipmaker said it determined the new offer “would reasonably be expected to result” in a deal superior to Dialog’s proposal under the merger agreement. Dialog had agreed to pay $4.65 in cash and 0.112 of a Dialog American depository receipt for each share of stock, making its offer about $8.81 a share, based on current prices. As a result of the new bid, Atmel’s directors will engage in buyout talks with the potential acquirer, the company said in a statement Friday.
Dialog last month received approvals from German and U.S. authorities for the Atmel acquisition. Activist hedge fund Elliott Management Co. has been fighting the deal, saying it would destroy Dialog’s shareholder value. Dialog’s stock has declined 27 percent since the merger with Atmel was announced Sept. 20.

Board Backs Dialog

Atmel’s board said it was advising against the unsolicited new offer and there was no assurance the bid would result in a deal. The directors continued to recommend shareholders back the merger with Dialog, which remains in effect. Atmel’s shares gained as much as 8.7 percent to $9.20 in extended trading in New York after Friday’s announcement.
Dialog, based in Reading, England, makes chips used in Apple Inc.’s iPhone and iPad. It sought Atmel to reduce its reliance on mobile phones and gain complementary products for the automotive industry and that power the Internet of Things. The announced deal was part of a record year for semiconductor acquisitions, as chipmakers seek to counter slowing growth and increasing costs. The mergers also reflect the increasing technology being used to connect homes, cars and appliances to the Web.
Atmel said in August it was considering strategic options. Dialog Chief Executive Officer Jalal Bagherli said the company had to compete with other bidders to win Atmel.
Qatalyst Partners is acting as financial adviser to Atmel, and Jones Day is acting as the company’s external legal adviser, the company said.

http://www.bloomberg.com/news/articles/2015-12-11/atmel-receives-buyout-offer-that-may-top-dialog-s-merger-bid

Power, Standards And The IoT

Semiconductor Engineering sat down to discuss power, standards and the IoT with Jerry Frenkil, director of open standards at Si2; Frank Schirrmeister, group director of product marketing of the System Development Suite at Cadence; Randy Smith, vice president of marketing at Sonics; and Vojin Zivojnovic, co-founder and CEO of Aggios. What follows are excerpts of that discussion, which was held in front of a live audience at the IEEE SA Symposium on EDA and IP Interoperability in San Jose. To view part one, click here.
SE: How much more power can we save in the future compared with what we’re doing today?
Smith: More than half.
Schirrmeister: Given that we are engineers, we sometimes getting lost in optimizing the noise. One reason we go through all this trouble is that we want to optimize the time you can go between charges. I never watch a video on my game console because it’s about 100 times more power inefficient than a dedicated device. From a global power perspective, that’s really the noise. It’s still important. You need to deal with the thermal effects. You need to use the right protocol to connect the device. Which wireless interface and which decoder to you use? That’s more important holistically.
Frenkil: It’s hard to answer with a specific number, but half sounds about right. There are a couple of examples that lead me to believe we can do better. For a systems designer and a product designer, what are you concerned about? If I’m designing an IoT device, I’m not necessarily concerned about the power consumption in a data center. I may divide my architecture into different points, depending upon what I want to hit. If I want to do a really low-power node, I might do two things. One is I might do minimal processing there. Maybe I’m shipping symbols instead of data, so the data center can interpret those symbols and do all the processing. The second thing is if I’m doing minimal processing on the node, maybe I can go to a really low voltage. Today, practically speaking, not many designs are done using near-threshold voltages. It’s too hard and the performance drops off rather rapidly. If I combine judicious partitioning of my system, which allows me to do minimal local processing so I can use a much lower-voltage design, then I can go a lot lower.
Schirrmeister: I charge my phone every day. But if you look at the power envelope of this phone versus the previous generations, it seems to run for 1 day or 1.5 days. But it does so much more now than what it did five or six years ago. The question isn’t power or energy itself. It’s the workload for a given amount of power, and there we have improved much more than half. The power envelope is only going slightly down, but the amount of stuff you can do with it is much more.
SE: If you get much more efficiency out of something designed for a specific function, do IoT devices have to be very specific in what they do? And how does that change the overall design?
Schirrmeister: Absolutely that needs to happen. My first phone didn’t have the dedicated hardware decoder for video. I was always afraid when I went to the gym whether I would be able to get through my favorite show. Now you only use 10% of the power because they’ve made it a dedicated function that has been optimized for that purpose.
Zivojnovic: In mobile devices, just on the software side you can squeeze out 40% more efficiency. On devices like set-top boxes, TVs and game consoles, it’s easy to reach 80% just by tuning the software. The key is something just built for a certain purpose. It only has to do certain jobs. You can get orders of magnitude improvement because some transistors don’t have to clock. What we’re doing with clock gating and voltage gating is simply mimicking the logic. You can look at every research book or introduction to digital design and you will see there are synchronous clocks, synchronous logic and asynchronous logic. So you can go from one day to 10 days between charges. We are playing with what we call software-defined power management.
Smith: Sometimes we get caught up with what happens in the applications process with some of the sophisticated techniques we’re talking about. Our rather informal survey of customers says the average is three or less power domains on chips because it’s just too hard to design and verify if they put in a lot more than that. That’s why we need all these models and standards to build the design, analysis and verification tools. They’re not doing it now. They’re doing it on chips where they have the volume for them, but the vast majority use three or less domains. At the same time, we’re seeing designs with 120 or more blocks. There is a lot of opportunity to get more granular with controlling power, but they’re too complex using today’s IP models and tools. That’s our challenge to solve to really bring down the power.
SE: One of the hidden taxes in the IoT is security. Security costs power and cycles somewhere. Is there a better way to do it?
Zivojnovic: Security very often is an excuse for not doing a good design. We have seen cases where people don’t want to put the additional effort into a device like a set-top box. Then, when they are forced by the manufacturer, or occasionally by the regulators, most of them give up and add the mobile processor, more efficient memory or green memory. But with security you need to be constantly in charge of the unit. It’s very important. But there are better ways, such as having hardware accelerators to engage with dedicated hardware.
Smith: There is active security, and there is designed-in security, which is passive. Active includes things like encryption. It takes more power and you have to account for that. You can design in better stuff like hardware firewalls and set up your router so this block can never talk to that block. Your fingerprint can never get a message out to your radio so you’ll never be able to transmit your fingerprints someplace. That’s a simple thing you can do in design. It does mean extra effort in design, though, because you’re stopping things you don’t want to happen from ever happening. And then those in a general-purpose system, you pay the cost for encryption or security you have to enforce. There will be costs, but we can be smart about it.
Frenkil: On the encryption side, there will be some more costs but it won’t be that high. We can have a standard for encryption for the IoT. That can be built as a piece of hard IP. It will be small and power-efficient. It will consume some power, but if it’s hard IP it can be made quite power-efficient. And it’s something you can put in almost as a no-brainer. But we do need standard protocols with standard security in those protocols to enable people to define what is that encryption, what does that security processor look like.
Schirrmeister: It depends on the design. If the requirements at the end dictate that security is more important than power or the lifetime of the battery, then you have to do it. You don’t want your health information transmitted or for someone to be able to hack into it. It’s a question of what type of device you’re looking at.

http://semiengineering.com/power-standards-and-the-iot-2/

Inotera buys equipment from Micron

DRAM maker Inotera Memories has announced the purchase of a batch of production equipment from Micron Technology for around NT$411 million (US$12.58 million).

The equipment is for 12-inch wafer testing, Inotera said.

In addition, Inotera reiterated plans to convert 80% of its total wafer start capacity to 20nm process technology by the end of 2015, and its entire capacity will be built using the newer node by the end of second-quarter 2016.

Transitioning to 20nm process technology will help lower Inotera's manufacturing costs substantially in 2016, the company added.

Inotera's bit shipments are forecast to grow by a single-digit percentage sequentially in the fourth quarter of 2015 followed by a double-digit increase in first-quarter 2016, the company said.

Inotera sells all of its manufacturing output to Micron.

http://www.digitimes.com/news/a20151201PD208.html