Thursday, April 30, 2015

Broadcom pitches new chipsets to clear Wi-Fi network bottlenecks


Most of us have had the experience of being unable to connect to a Wi-Fi network in a location with lots of people. A technology that promises to alleviate that problem is, however, slowly but surely making headway.
Upcoming 802.11ac wireless access points will able to handle more users and come in increasingly smaller packages, with the help of new transmission technology included in two chipsets from Broadcom.
MU-MIMO (multi user-multiple-input multiple-output) technology helps by alleviate bottlenecks allowing networks to transmit data to many users simultaneously instead of just one at a time.
On Wednesday, Broadcom launched the BCM43465 chipset, which is meant for access points that enterprises and carriers use to build Wi-Fi networks and hotspots. It can transmit data to four users at the same time or two at a higher speed using four antennas simultaneously.
CIOs are more interested in average throughput per user, not the maximum speed one user can get, said Mike Powell, director of marketing for Broadcom’s enterprise wireless segment.
The drawback with MU-MIMO is that smartphones, tablets and laptops also have to be upgraded for the technology to work. But more and more products are becoming compatible with the technology. For example, just last week Acer announced new Aspire E laptops with MU-MIMO and Xiaomi launched the US$200 Mi 4i smartphone, which also has the technology built in.
The BCM43465 chipset is based on the so-called Wave 2 of the 802.11ac standard. Improvements include the use of up to 160MHz of spectrum to increase speeds.
For now, there are no publicly available clients that can handle that much spectrum, according to Powell. Broadcom believes that networks and devices will be upgraded to support MU-MIMO and other Wave 2 features over the next few years. New features may be added to client devices over time, but for enterprises and carriers it makes sense to move more quickly, buying network equipment that will not become obsolete.
Broadcom has also added the BCM47452 to its portfolio of chipsets for enterprise equipment. The goal with this product is to help cut the cost of basic 802.11ac access points and also decrease the size of them.
“We have actually seen a customer develop a board that I would say is approximately three inches by thee inches. That’s extremely compact,” Powell said.
The key to these improvements is more integration. The BCM47452, a SoC (system-on-a-chip), is the first to integrate 2.4GHz and 5GHz radios with power amplifiers and a CPU on a single device, according to Broadcom.
The first products powered by the chipsets are expected to arrive during the second half of the year.


http://www.pcworld.com/article/2916732/broadcom-pitches-new-chipsets-to-clear-wifi-network-bottlenecks.html

Monday, April 27, 2015

TI P/N TPS54372PWPR - 5995 pcs in stock

TI P/N TPS54372PWPR - 5995 pcs in stock

1019+  DC

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TI P/N OPA2694ID - 2200 pcs in stock

TI P/N OPA2694ID - 2200 pcs in stock

06+  DC

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TI P/N SN74ALS574BNSR - 4000 pcs in stock

TI P/N SN74ALS574BNSR - 4000 pcs in stock

9940 / 9930 DC

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TI P/N SN74LS373NSR - 4000 pcs in stock

TI P/N SN74LS373NSR - 4000 pcs in stock

9920 / 9949 DC

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Friday, April 24, 2015

Xilinx P/N XC2S200E-6FT256C - 275 pcs in stock

Xilinx P/N XC2S200E-6FT256C - 275 pcs in stock

1229 DC

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Vectron P/N VCC1-FIB3-106M25 - 995 pcs in stock

Vectron P/N VCC1-FIB3-106M25 - 995 pcs in stock

05+DC

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Panasonic P/N RK1-L2-5V-H31 - 3675 pcs in stock

Panasonic P/N RK1-L2-5V-H31 - 3675 pcs in stock

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NEC P/N NE76184A-T1 - 242 pcs in stock

NEC P/N NE76184A-T1 - 242 pcs in stock

0426 DC

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Fairchild P/N FDS6912A - 125,000 pcs in stock

Fairchild  P/N FDS6912A - 125,000 pcs in stock

04+ DC

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Monolithic Power Systems P/N MP1410ES-LF-Z - 10827 pcs in stock

Monolithic Power Systems P/N MP1410ES-LF-Z - 10827 pcs in stock

1042  DC

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Tyco P/N 1717379-1 - 12650 pcs in stock

Tyco P/N 1717379-1 - 12650 pcs in stock

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Conexant P/N CX06832-31 - 2689 pcs in stock

Conexant P/N CX06832-31 - 2689 pcs in stock

0520 / 0538 DC

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Vishay P/N 293D106X9016B - 36,000 pcs in stock

Vishay P/N 293D106X9016B - 36,000 pcs in stock

0009+ DC

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Broadcom P/N BCM5228BA4KPBG - 741 pcs in stock

Broadcom P/N BCM5228BA4KPBG - 741 pcs in stock

0911 DC

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National Semi P/N LM3485MMX - 1806 pcs in stock

National Semi P/N LM3485MMX - 1806 pcs in stock

0406 DC

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AVX P/N TPSD477M004R0045 - 30,000 pcs in stock

AVX P/N TPSD477M004R0045 - 30,000 pcs in stock

04+ DC

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National Semi P/N LMX2315TMX- 20,000 pcs in stock

National Semi P/N LMX2315TMX- 20,000 pcs in stock

99+ DC

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Murata P/N DFCB35G80LBHAA - 14,700 pcs in stock

Murata P/N DFCB35G80LBHAA - 14,700 pcs in stock

06+ DC

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IR P/N IRG4PH50SPBF - 1600 pcs in stock

IR P/N IRG4PH50SPBF  - 1600 pcs in stock

1045 DC

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National Semi P/N LM3525MX-H - 52,500 pcs in stock

National Semi P/N LM3525MX-H  - 52,500 pcs in stock

04+ DC

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Renesas P/N MKM37451SFP - 30,000 pcs in stock

Renesas P/N MKM37451SFP  - 30,000 pcs  in stock

05+ DC

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ICS P/N MK1491-09FTR - 30,000 pcs in stock

ICS P/N MK1491-09FTR  - 30,000 pcs  in stock

0433 DC

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Tyco P/N 171825-4 - 100,000 pcs in stock

Tyco P/N 171825-4  - 100,000 pcs  in stock

04+ DC

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M Systems P/N MD3331-D64-V3-X - 5293 pcs in stock

M Systems P/N MD3331-D64-V3-X  - 5293 pcs  in stock

04+ DC

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Hamamatsu P/N S2382-02 - 3134 pcs in stock

Hamamatsu P/N S2382-02  - 3134 pcs  in stock

04+ DC

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Philips P/N CE1619D-T - 19000 pcs in stock

Philips P/N CE1619D-T  - 19000 pcs  in stock

04+ DC

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Agere Systems P/N CSP1034S-V11-D - 50,000 pcs in stock

Agere Systems P/N CSP1034S-V11-D  - 50,000 pcs  in stock

04+ DC

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Sharp P/N LH28F008SCHT-TE - 15,600 pcs in stock

Sharp P/N LH28F008SCHT-TE  - 15,600 pcs  in stock

06+ DC

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Vishay P/N LH1546AEFTR - 30000 pcs in stock

Vishay P/N LH1546AEFTR  - 30000 pcs  in stock

04+ DC

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Hamamatsu P/N S2382-1 - 2259 pcs in stock

Hamamatsu P/N S2382-1  - 2259 pcs  in stock

06+ DC

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Intel P/N RG82852GM SL6ZK - 7000 pcs in stock

Intel P/N RG82852GM SL6ZK  - 7000 pcs  in stock

0512 DC

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Broadcom P/N BCM8073BIFBG - 28 pcs in stock

Broadcom P/N BCM8073BIFBG  - 28 pcs  in stock

0947 DC

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Sandisk P/N SDP3B-128-201-80 - 2 pcs in stock

Sandisk P/N SDP3B-128-201-80 - 2 pcs  in stock

0418 DC

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Broadcom P/N SNP-Z20T - 35 pcs in stock

Broadcom P/N SNP-Z20T - 35 pcs  in stock

0936 DC

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Skynet P/N SNP-Z20T - 282 pcs in stock

Skynet P/N SNP-Z20T - 282 pcs  in stock

06+ DC

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Iscocom P/N H11AA1 - 10 pcs in stock

Iscocom P/N H11AA1 - 10 pcs  in stock

0623 DC

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Mil Spec P/N MS27467T21A35P - 10 pcs in stock

Mil Spec P/N MS27467T21A35P - 10 pcs  in stock

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Cavium P/N CN505-183LQ128-G - 12 pcs in stock

Cavium  P/N CN505-183LQ128-G - 12 pcs  in stock

1013 DC

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Micro Semi P/N JANTX1N753D-1 - 17 pcs in stock

Micro Semi P/N JANTX1N753D-1 - 17 pcs  in stock

0522 / 0610 DC

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Wall P/N MD24S33-5000 - 20 pcs in stock in stock

Wall P/N MD24S33-5000 - 20 pcs  in stock  in stock

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Broadcom P/N BCM1125HB0K600G - 20 pcs in stock

Broadcom P/N BCM1125HB0K600G - 20 pcs  in stock

0825 DC

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Texas Instruments P/N PT7777A - 7 pcs in stock

Texas Instruments P/N PT7777A - 7 pcs  in stock

0635 DC

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Seagate P/N ST9300603SS - 30 pcs in stock

Seagate P/N ST9300603SS - 30 pcs  in stock

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Digi Int'l P/N Net+50-QIT-3 - 6 pcs in stock

Digi Int'l P/N Net+50-QIT-3 - 6 pcs  in stock

0709 DC

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Xilinx P/N XC4013E-3PQ208C - 119 pcs in stock

Xilinx P/N XC4013E-3PQ208C - 119 pcs  in stock

98+ DC

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Xilinx P/N XC4028XL-1HQ304C - 5 pcs in stock

Xilinx P/N XC4028XL-1HQ304C - 5 pcs  in stock

9737 DC

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Emulex P/N LP1050-F2 - 5 pcs in stock

Emulex P/N LP1050-F2 - 5 pcs  in stock


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Broadcom P/N SK3102000 - 33 pcs in stock

Broadcom P/N SK3102000 - 33 pcs  in stock

0944 DC

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Rittal P/N SK3102000 - 2 pcs in stock

Rittal P/N SK3102000 - 2 pcs  in stock

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HP P/N 249632-B21 - 1 pc in stock

HP P/N 249632-B21 - 1 pc  in stock

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Cavium P/N CN1230-S-NPB - 10 pcs in stock

Cavium P/N CN1230-S-NPB - 10 pcs  in stock

0403 DC

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APC P/N SUA3000RMXLI - 1 pc in stock

APC P/N SUA3000RMXLI - 1 pc  in stock

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Xilinx P/N XCV2000E-7FG680C - 8 pcs in stock

Xilinx P/N XCV2000E-7FG680C - 8 pcs  in stock

0225 / 0601 DC

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Atmel P/N AT91FR40162SB-CI / AT91FR40162SB-CU - 2400 pcs

Atmel P/N AT91FR40162SB-CI / AT91FR40162SB-CU - 2400 pcs

2010+ DC

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Xilinx P/N XC3S1500-4FG320I - 718 pcs in stock

Xilinx P/N XC3S1500-4FG320I - 718 pcs in stock

0549 DC

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Xilinx P/N XC1765EPD8C - 238 pcs in stock

Xilinx P/N XC1765EPD8C - 238 pcs in stock

1037 DC

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Vitesse P/N VSC8601XKN - 1600 pcs in stock

Vitesse P/N VSC8601XKN - 1600 pcs in stock

2010+ DC

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Texas Instruments P/N TPS54140DGQR - 3748 pcs in stock

Texas Instruments P/N TPS54140DGQR - 3748 pcs in stock

2012+ DC

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NAIS P/N TN2-24V - 836 pcs in stock

NAIS  P/N TN2-24V - 836 pcs in stock

2030+ DC

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San Disk P/N SDSDB-1024 - 1561 pcs in stock

San Disk P/N SDSDB-1024 - 1561 pcs in stock


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Sierra Wireless P/N MC7750 - 35 pcs in stock

Sierra Wireless P/N MC7750 - 35 pcs in stock

2013+ DC

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Linear Tech P/N LT1963AEST-2.5#TRPBF - 2000 pcs in stock

Linear Tech P/N LT1963AEST-2.5#TRPBF - 2000 pcs in stock

2000+ DC

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IC Designs / Cypress P/N ICD2051SC1 - 103 pcs in stock

IC Designs / Cypress P/N ICD2051SC1 - 103 pcs in stock

0232 DC

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Cypress P/N ICD2053BSC-1 / ICD2053BSC1 - 200 pcs in stock

Cypress P/N ICD2053BSC-1 / ICD2053BSC1 - 200 pcs in stock

2002+ DC

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Opnext P/N HE8812SG - 558 pcs in stock

Opnext P/N HE8812SG - 558 pcs in stock

2005+ DC

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Hynix P/N H5PS5162FFR-Y5C - 5000 pcs in stock

Hynix P/N H5PS5162FFR-Y5C - 5000 pcs in stock

2011+ DC

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Lattice P/N GAL16V8D-25LJI / GAL16V8D25LJI - 8805 pcs in stock

Lattice P/N GAL16V8D-25LJI / GAL16V8D25LJI - 8805 pcs in stock

2011+ DC

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Maxim Logic P/N DS2154L - 1094 pcs in stock

Maxim Logic P/N DS2154L - 1094 pcs in stock

0225 and 05+ DC

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Cirrus Logic P/N CS61535A-IL1Z - 393 pcs in stock

Cirrus Logic P/N CS61535A-IL1Z - 393 pcs in stock

0622 DC

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Broadcom P/N BCM84752A1IFSBG - 110 pcs in stock

Broadcom P/N BCM84752A1IFSBG - 110 pcs in stock

1109 DC

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Broadcom P/N BCM56846A1KFRBG - 6 pcs in stock

Broadcom P/N BCM56846A1KFRBG - 6 pcs in stock

1231 DC

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AMD P/N AU1000-266MCC - 726 pcs in stock

AMD P/N AU1000-266MCC - 726 pcs in stock

0237 DC

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Atmel P/N ATMEGA169PA-MU - 8813 pcs in stock

Atmel P/N ATMEGA169PA-MU - 8813 pcs in stock

1046 DC

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Atheros P/N AR7240-AH1A - 4000 pcs in stock

Atheros P/N AR7240-AH1A - 4000 pcs in stock

2013+ DC

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Realtek P/N ALC203 - 20000 pcs in stock

Realtek P/N ALC203 - 20000 pcs in stock 2004+ DC

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Analog Device P/N AD7685CRMZRL7 - 12000 pcs in stock



Analog Device P/N AD7685CRMZRL7 - 12000 pcs in stock 2010+ DC

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Teridan P/N 78Q8392LA03-28CH/F - 500 pcs in stock


Teridan P/N
78Q8392LA03-28CH/F
- 500 pcs in stock 0616 DC - 0616
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Teridan P/N 78Q8392L-28CH/F - 4000 pcs in stock



Teridan P/N 78Q8392L-28CH/F - 4000 pcs in stock 0616 DC - call 1-949-421-1144 or email pmeyers@gictg.com for more info.

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PLX PEX8525-AA25BI G / PEX8525AA25BIG - 642 pcs in stock

PLX P/N PEX8525-AA25BI G - 642 pcs in stock 0818 DC - call 1-949-421-1144 or email pmeyers@gictg.com for more info.

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Thursday, April 23, 2015

Samsung to plough $9 billion more into South Korea chip plant: MoneyToday


(Reuters) - Samsung Electronics Co Ltd is set to spend at least another 10 trillion won ($9.2 billion) to boost capacity at a new South Korean chip plant, a 64 percent increase over announced investment plans, domestic online news service MoneyToday reported.
The world's top memory chip maker said late last year it would invest 15.6 trillion won to build the plant, its biggest ever commitment to a single production facility, as it ramps up its semiconductor business to offset slowing smartphone earnings.
The plant is scheduled to begin production in 2017, but MoneyToday, which did not cite sources, did not specify when the additional investment would take place.
The report also said the new plant will produce DRAM memory chips at its South Korean chip complex but could also make mobile processors depending on market conditions.
A Samsung spokeswoman said the firm has not decided on any additional investments or what products the new plant would make.
The plans for the new plant, which will be located in Pyeongtaek south of Seoul, has led to some worries about the industry's medium-term outlook.
Samsung and rival SK Hynix Inc have reported robust memory chip earnings in recent quarters, partly because careful capacity management across the industry has supported prices of DRAM and NAND chips.
Samsung has said it will seek sustainable memory chip profit growth, suggesting that it will not initiate a price war.
The firm had 14.3 trillion won in capital expenditure for its chip business in 2014, and analysts have said the announced investment for the new plant would be in line with Samsung's typical spending because it would spread out over several years.


http://www.reuters.com/article/2015/04/23/us-samsung-elec-investment-chips-idUSKBN0ND2SB20150423

SK Hynix Profit Beats Estimates on Apple Devices, Weaker Won

SK Hynix Inc. first-quarter profit beat analyst estimates as a weaker South Korean won boosted sales at the supplier of memory chips to Apple Inc.
Net income, excluding minority interest, rose to 1.3 trillion won ($1.2 billion), the Icheon, South Korea-based company said Thursday. That compares with the 1.15 trillion-won average of 25 analysts’ estimates compiled by Bloomberg. The shares rose.
Demand for Apple’s iPhone 6 models with larger screens helped boost orders, offsetting a decline in semiconductor prices and seasonal weakness. A stronger dollar benefits the chipmaker as more than 90 percent of its revenue is settled in the U.S. currency, according to Lee Min Hee, an analyst at I’m Investment & Securities Co.
“Earnings will be even better in the second half as new iPhones are expected to use more advanced chips that will lead to higher margins,” Lee, who has a buy rating on SK Hynix, said before the earnings announcement.
Operating profit was 1.59 trillion won compared with the 1.45 trillion won average of analyst estimates compiled by Bloomberg.
Shares of SK Hynix rose 1.2 percent to 45,800 won at the close of trade in Seoul. The stock has fallen 4.1 percent this year, compared with a 13 percent gain in the benchmark Kospi index.

Price Recovery

Capital spending for this year will be about 5.5 trillion won, up from a previous estimate of about 5.2 trillion won, because of weaker Korean currency against the dollar, Lee Myoung Young, head of finance division said at a conference call Thursday.
The world’s fourth-largest semiconductor maker expects prices for personal computer chips to recover in the second half due to supply constraints. Demand for mobile chips is expected to increase in the current quarter as suppliers shift more production to chips for smart devices rather than PCs.
Apple is SK Hynix’s second-largest customer, after Samsung Electronics Co., providing about 9 percent of its sales, according to data compiled by Bloomberg.
Apple, which sold 74.5 million iPhones in the fourth quarter, may have sold about 55 million units in the first quarter, according to Lee.

http://www.bloomberg.com/news/articles/2015-04-22/sk-hynix-profit-beats-estimates-on-apple-devices-weaker-won

Tuesday, April 21, 2015

Intel's success in China hinges on budget phones and tablets


"China is the number one market with connected products."
That was how Intel's Senior Vice President Kirk Skaugen kicked off his keynote at IDF in Shenzhen, citing China's staggering 30 percent share of worldwide connected-device purchases in 2014. The country gobbled up 40 percent of the 46 million Intel-powered tablets shipped globally. Not bad, but 46 million is hardly anything compared to the 420.7 million smartphones shipped in China alone in the same year -- only a tiny percentage of which packed an Intel chip. Most others relied on Qualcomm, MediaTek and Samsung. Intel's smartphone market share is so small that it never dared to share the stats; it could be as low as 2.81 percent in the Android space, according to benchmark specialist AnTuTu.
This isn't something that Intel can fix overnight, but with the launch of its Atom x3 "SoFIA" chips, it's hoping to narrow the gap this year. Atom x3 is actually Intel's first family of chips with an integrated modem, which offers the advantage of improved power efficiency as well as reduced space and costs. It's still going to be a hard sell, though, especially given that the LTE flavor of Atom x3 won't ship until the second half of this year. But at least Intel's found a cunning strategy to stay relevant: partnering with Chinese chip designers Rockchip and Spreadtrum to leverage their connections with local device manufacturers. In other words, these two companies get to offer Intel-powered designs to their clients.
A selection of budget tablets in a Hong Kong mall, many of which are powered by Intel's Bay Trail processor.

We won't judge you if you're not familiar with Rockchip and Spreadtrum. Both firms only dabble in the lowest-end smartphone, tablet and TV stick markets. The places that are packed with KIRFs and brands you've never heard of. On the Chinese retail site Taobao, we managed to find a Rockchip-powered 9.7-inch Android tablet that cost just 390 yuan, or about $63.
There's plenty of reason to worry that these cheap devices will tarnish Intel's brand.
Now, this is obviously a case of "you get what you pay for." Ugly or copycat designs, rough seams, scratched metal parts, laggy software, you name it. Not to mention the lack of Google services. Nicole Scott from Mobile Geeks said what many of us were thinking in her post-IDF piece: "I have never seen a Rockchip product that I thought was of good quality." There's plenty of reason to worry that these cheap devices will tarnish Intel's brand.
An Intel Atom x3-powered Samsung Galaxy S5 clone.

Skaugen isn't terribly concerned, however. "In the last year, we've seen a dramatic improvement in the overall quality in craftsmanship that's come out of Shenzhen," the exec defended. He also points out how the likes of General Motors and Volkswagen have prospered by engaging in China early with local partners.
"When you're here early and you're helping," he said, "I think you would rather be in the position that those companies are in. And quality does get better over time, but you do have to transfer some of your knowledge on how to build even higher-quality products."
In this case, "transfer" is just a pretty way of saying "selling reference designs." Intel does so through its turnkey program, in which vendors can either buy some parts from a list of recommended suppliers, or simply slap their own brand onto Intel's complete reference devices. Going the latter route can get them to market in just six to eight weeks. Such speed is critical in the super competitive entry-level market. According to Intel, last year 30 ODMs made 350 devices based on its reference designs, and those shipped to 50 countries.
Bluebank president Tao He shows off his $50 5-inch smartphone powered by Intel's Atom x3.

"Intel's turnkey solution has greatly lowered the entry barrier."
Rockchip, Spreadtrum, MediaTek and Qualcomm also have their own turnkey solutions, with MediaTek pretty much pioneering this business model in its copycat feature phone days. Intel's clear advantage over the competition lies within its x86-64 architecture (so both Android and full-on Windows are compatible), RealSense depth camera technology and wireless power know-how. The chip giant also claims to offer higher reliability, with customers seeing a 20 percent lower return rate with devices based on its reference designs. At IDF, Skaugen even got Tao He, the president of Chinese device maker Bluebank, to openly praise how much better Intel's reference designs and tech support are.
"If I must complain, Intel's turnkey solution has greatly lowered the entry barrier, making it very easy to design devices," He joked in front of the already amused crowd.
Bluebank is just one of the many Chinese ODMs that are already offering Atom x3-powered devices to potential clients. On the stage, He showed off a 4.5-inch smartphone that will retail for less than $40 (He also mentioned a 4-inch version for about $30), a 5-inch phone with a metallic frame for around $50 and a 7-inch (8mm-thick) tablet with voice calling for just $55. The audience wowed at the tablet.
In addition to Bluebank and its four aforementioned devices, Intel has enlisted 13 other ODMs to commit to 44 more Atom x3 designs this year. And that's on top of Rockchip's 10 ODMs that will use the 3G-R variant (3G, quad-core) of the chip. While this doesn't necessarily reflect the eventual number of consumer models (and some of those designs could have already been sold with other chipsets), it's still a good start; though the 4G-enabled Atom x3 needs to arrive as soon as possible.
Atom x3-based tablets at an electronics expo in Hong Kong.

Both Intel and Rockchip desperately need more quality "hero" devices.
It's all good and well that Intel sees great potential in the entry-level market, but for its new mobile chip to succeed, it must teach its partners -- especially on Rockchip's side -- to respect intellectual property. Both Intel and Rockchip desperately need more quality "hero" devices to boost brand perception. But with Intel-powered knockoffs floating around, it'll be hard to convince other big names to join the party. In the mainstream mobile market, Intel's only got ASUS and occasionally Lenovo on its side.
Even with the potential for intellectual property scuffles, Intel has clearly made the right move by partnering with Rockchip. After all, we are talking about a Chinese company that's working with Google on a system-on-chip module for Project Ara. The company obviously has growing global clout. Intel may be late to the integrated-modem game, but with Rockchip's connections plus growing street cred, it could be on track to catch up with the competition, especially in China where even Qualcomm stumbled recently.
"We want to build long-term partnerships with China," Skaugen said. "This is our 30th anniversary in China. I think some of these partners are the people that will build Intel's brand for the next 30 years. And if you look at companies like Apple or HP that started in the garage, let's not forget what the first PCs looked like. And decades later, I'm glad I have those partnerships."
http://www.engadget.com/2015/04/20/intels-success-in-china-hinges-on-budget-phones-and-tablets/

Monday, April 20, 2015

Samsung leads SSD market

South Korean tech giant Samsung Electronics Co. held a market share in the global solid state drive market that was twice as big as the one held by its U.S. rival Intel Corp. in 2014, data showed Monday.

Samsung Electronics saw its share in the SSD market reach a whopping 34 percent last year with its revenue from the segment coming to US$3.99 billion, according to the data compiled by industry tracker IHS. Intel took up 17 percent of the market over the cited period at $1.99 billion.

The researcher said Samsung will widen its gap with Intel in 2015 by garnering a 35 percent share, while the U.S. firm will maintain its 17 percent presence.

A SSD is a data storage device made with a NAND flash memory chip that saves data without power present and is more durable and faster than a hard disk drive.

U.S. SanDisk Corp., Micron Technology Inc. and Japan's Toshiba Corp. held 17 percent, 8 percent and 7 percent market shares, respectively, in 2014, the data also showed.

Samsung has been tapping deeper into the global SSD market, introducing the portable T1 lineup earlier this year. While the company has been leading the SSD market by mainly targeting business clients, it also began to produce lighter SSDs for mass consumers on growing demand.

Industry watchers expect global demand for SSD products to reach 220 million units in 2019, more than doubling from 83 million units in 2014. (Yonhap)

http://www.koreaherald.com/view.php?ud=20150420000229

Friday, April 17, 2015

Samsung Describes Road to 14nm

OAKLAND, Calif. – Just days after it was confirmed the Samsung Galaxy S6 uses an Exynos processor made in Samsung's 14nm FinFET process, a Samsung executive talked about the company's road to 14nm. The milestone was a huge one for the Korean giant, beating rival TSMC to become the second chip maker after Intel to ship a 14nm FinFET chip.
“I think competition is healthy, it pushes everyone to achieve their limits – either from a technology angle, execution, or the ability to deliver service levels,” Kelvin Low, senior director of foundry marketing for Samsung Semiconductor, told EE Times.
Low would not comment on production volumes, yields, or the number of devices using Samsung’s 14nm process. Instead, he outlined the applications using 14nm and described the foundry’s FinFET strategy.
There are multiple designs already and some have taped out, Low said. End application segments include “single hand-held mobile computing,” consumer applications, graphics, and compute/networking. “Because the technology has developed so much, the chip can fit into a lot of applications,” he noted.
The common thread between these segments is the need for long battery life and energy efficiency. FinFETs promise lower leakage and lower power, which is important in handsets such as the Galaxy S6 and for data centers that want to increase their GHz/Watt performance.
Samsung’s 14nm chips are in production in Korea and Austin, Texas, though Low would not comment where certain chips are made. EE Times recently published a blog that questioned where the company’s Exynos 7420 chips were made – a Global Foundries fab in Albany, NY was among the possible locations.
“I don’t think it really matters externally, I think it matters that this technology is in production. I think where it’s produced is kind of secondary,” Low said.
Samsung spent several years developing its 14nm technology and debating which process node it would invest in after 28nm. Low expects that 28nm will still be a popular process node for years to come because of its price.
Kelvin Low
Kelvin Low
“[Going to 14nm] wasn’t an easy decision…the decision was made probably three years back and it wasn’t clear whether 20nm or FinFET would be right decision,” he said. “What we could offer at 20nm was limited by semiconductor physics. 20nm was probably the last node that planar architecture can still be realized; even though [customers] could accept it, it wasn’t ideal.”
FinFETs, on the other hand, provided improved performance and power but were risky from a time-to-production perspective. The 3D architecture also required Samsung researchers to understand new physics around how the architecture works with parts of a SoC.
“The parasitics associated with a 3D device are totally different from the planar device. We had to rethink how to make the abstraction work together with the EDA components…and make it as design friendly as possible so designers don’t feel a huge change when transition from planar to 3D architecture,” Low added.
FinFETs are also more discrete because they are no longer based on the length and width of transistors. Samsung is developing an education system to help engineers optimize the number of fins from an IP perspective.
Samsung is also investing in 28nm FD-SOI to provide customers with a cheaper, fully depleted silicon-on-insulator architecture. The cost per transistor has increased in 14nm FinFETs and will continue to do so, Low said, so an alternative technology such as 28nm SOI is necessary.
“Large and small companies are expecting foundries to play a bigger role in providing a more complete solution. Not just process technology and PDK, but elements like having a library, standard cells, memory, IOs or even basic IPs like USB,” Low added. “Having these building blocks available for our customers early and accessible, they can focus their internal resource to develop other differentiating IPs.”
Samsung and its competitors may be more inclined to play a larger role as the manufacturing equipment needed for nodes smaller than 28nm becomes prohibitively expensive.
“Another trend is there used to be a number of second source foundries where they were trying very hard to match their technology to the primary source. Going down below 28 we see these tasks as next to impossible,” he said. “It’s only more recently that we’re comfortable to bring [FinFets] to high manufacturing volume.”
Samsung is working with IBM’s Albany Nanotech lab to develop new materials and device architectures. Low had no comment on the company’s roadmap for next-generation process nodes.

http://www.eetimes.com/document.asp?doc_id=1326369

Thursday, April 16, 2015

Wednesday, April 15, 2015

Under fire from U.S. group, Alibaba says fighting counterfeit goods


Alibaba Group Holding Ltd said it had a range of measures to fight counterfeits on its websites - remarks that come after a trade group requested U.S. government help in prodding the Chinese e-commerce giant into action against fake goods.
Concerns over fake products on Alibaba's platforms, including online marketplace Taobao, have dogged the world's largest e-commerce firm for years, although the U.S. trade office removed Taobao from its list of "notorious markets" in 2012 in recognition of progress made.
In the latest flare up over the issue, the American Apparel & Footwear Association (AAFA) said in an April 8 letter to U.S. Trade Representative Michael Froman it was convinced Alibaba was either incapable or not interested in addressing the problem.
The association added that since Taobao had been delisted as a notorious market, the problem had worsened and urged the USTR to send a clear signal that Taobao would be relisted unless more action was taken.
In response, Alibaba said on Tuesday that its measures to tackle counterfeits included data mining, working with Chinese authorities and cooperating with over 1,000 brand owners and several industry associations.
Alibaba added it had been talking with AAFA since 2012 over how best to tackle counterfeits and was committed to continuing to do so.
Prior to the AAFA letter, the USTR said last month it was keeping an eye on Alibaba for sales of counterfeit and pirated goods, but refrained from putting the site back on the piracy blacklist.
Hangzhou-based Alibaba has also caught regulators' attention in China. Last month, the country's commercial regulator said in response to a question about fakes on Alibaba's websites that the government must establish a system to record and restrict e-commerce firms that break rules on counterfeit goods.
Alibaba has seen its shares slide 19 percent for the year to date, with analysts citing concerns about counterfeits as one reason, along with lacklustre third-quarter earnings and investor excitement wearing off after the firm's record-setting $25 billion IPO last September. (Reporting by Paul Carsten; Editing by Edwina Gibbs)


http://www.reuters.com/article/2015/04/14/alibaba-fakes-idUSL4N0XB1RQ20150414

Tuesday, April 14, 2015

Altera Shareholders Cadian, TIG Said to Push Sale to Intel



http://www.bloomberg.com/news/articles/2015-04-13/altera-shareholders-cadian-tig-said-to-push-for-sale-to-intel

Cadian Capital Management and TIG Advisors are among Altera Corp. shareholders that have sent letters to the company’s management, urging them to return to the negotiating table with Intel Corp., people with knowledge of the matter said.
The letters question Altera’s ability to create enough value on its own to match Intel’s offer, said the people, who asked not to be identified because the letters are private. Several other of Altera’s largest investors also have sent letters, two of the people said. Intel bid about $54 a share for Altera, people familiar with the matter said last week.
Talks between Altera, a maker of programmable semiconductors, and the world’s largest chipmaker ended after Altera turned down Intel’s takeover proposal, people familiar with the situation told Bloomberg April 9. Altera’s stock gained in the days following the news, signaling that some investors believed a deal at that price would be attractive.
Cadian is Altera’s 11th-largest shareholder, with about 2.8 percent of outstanding shares, according to data compiled by Bloomberg. Based on Monday’s closing price of $43.86 a share, the stake is valued at about $366 million. Altera, with a market value of about $13.2 billion, is the New York-based investment firm’s largest holding, according to a year-end filing. Altera jumped as much as 6 percent in afterhours trading, to $46.49.
TIG, a New York-based investment firm, owns about 1.5 percent of Altera’s outstanding shares, one of the people said.
Analysts were projecting Altera stock would hit just $37.91 over the next 12 months. The shares were trading at about $35 a share in March, before reports that the two companies were in talks.
Chuck Mulloy, a spokesman for Intel, declined to comment. Sue Martenson, a spokeswoman for Altera, didn’t respond to requests for comment.

Monday, April 13, 2015

Taiwan Chipmakers Prepare to Transport Water as Drought Worsens

TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, and other chipmakers on the island say they are prepared to ship water supplies to their fabs here if drought conditions worsen.
TSMC, a supplier to major electronics companies including Apple, Qualcomm, Nvidia and MediaTek, said it will use as many as 180 trucks, each with a capacity of about three metric tons, for water delivery to maintain operations at fab sites in Hsinchu, Taichung and Tainan in the event that the government tightens rationing.
“It all depends on the government,” TSMC Director of Corporate Communications Elizabeth Sun said today to EE Times. If the government shuts off water supplies two days per week at TSMC’s manufacturing sites, the chipmaker will start supplementing water supplies through truck delivery, she said.
The water level at Taiwan's Shihmen Dam (above) is the lowest for the period since it opened 51 years ago, according to Taiwan Today. (Image: CNA)
The water level at Taiwan's Shihmen Dam (above) is the lowest for the period since it opened 51 years ago, according to Taiwan Today. (Image: CNA)
To be sure, TSMC has implemented recycling measures following a drought more than a decade ago that forced the company to resort to costly truck deliveries. TSMC’s fabs today operate at an 87% recycling rate for the 90,000 metric tons of water used daily at its sites in Taiwan.
United Microelectronics Corp. (UMC) says it is similarly prepared.
“If the Taiwan government elevates its restriction measures, UMC already has additional contingency measures in place to accommodate up to a 20% reduction in public water allocation, including the purchase and transport of sufficient amounts of water from third-party sources, UMC spokesman Richard Yu said in a March 20 email. “Since the beginning of the year, UMC has proactively conserved an additional 3% water on top of our existing manufacturing water recycling rate of more than 85%.”
Stage-three rationingIn more seriously affected parts of the island, the Taiwan government has already started its third stage of rationing to cut water supplies two days a week. For some companies that consume at least 1,000 metric tons of water each month, the government has reduced the water supply by up to 10%.
Taiwan’s rainfall from October through March is the lowest since 1947, when the government started keeping records. The Water Resource Agency is forecasting a “high likelihood” of drier weather in the next three months.
Taiwan accounts for about a fifth of the world’s installed fab capacity, according to IC Insights.  The island also has a number of LCD makers, including Innolux Corp. and AU Optronics.

http://www.eetimes.com/document.asp?doc_id=1326328

Thursday, April 9, 2015

Intel courts China's hardware startups to popularize its mobile, IoT chips


Erwin Liu is the CEO of a fledgling Chinese startup, and he’s been the happy recipient of free chips from Intel.
“Whenever I went to Intel’s offices, they would always give us some free samples,” he said.
Liu’s company, CEIN Biotechnology, which develops finger vein scanners, is just one among the many Chinese tech startups Intel is courting.
In the battle for chip supremacy, the U.S. tech giant has been trying to dig deep into China’s hardware industry, and ensure that not just big vendors use its technology, but small emerging players too.
On Wednesday, Intel held its annual developers conference in Shenzhen, China, at a time when rival ARM-based chips from Qualcomm and MediaTek have been all the rage.
Although Intel has dominated the PC and server markets, it has struggled to replicate that success in smartphones and tablets. ARM-based chips have long been favored in mobile devices, even as Intel tries to catch up and offer new, more battery-friendly processors with improved connectivity.
Intel isn’t giving up, and in Shenzhen it has been promoting its upcoming mobile technology. The company has also been planting the seeds in China to keep its processors relevant in the long-term, through investment and partnerships.
On Wednesday, Intel announced a “Mass Makerspace Accelerator” program that seeks to fund Chinese startups and developers, with an investment that includes 120 million yuan (US$19.6 million.)
“Makers” can refer to tech hobbyists who enjoy building their own gadgets. But many of them are also establishing hardware startups that are selling wearables and smart home products, and seeking funding on Kickstarter. In Shenzhen, developers have come up with robots that can draw pictures, handheld air purifiers, and new phone charging accessories.
This all comes at a time when the Internet of Things space is starting to take off. Intel is expecting billions of new connected devices to be sold in the coming years for health monitoring, exercise, and smart furniture, among others.
However, it won’t just be a few vendors offering these products, but a giant crowd made up of both big and small players, not all of whom are well-known.
During the PC era, Intel’s route to chip-selling was defined and straight-forward. For example, in the laptop market, the company only had to work with six or so different notebook manufacturers out of neighboring Taiwan, said Bryan Ma, an analyst with research firm IDC.
That all changed with the arrival of tablets and smartphones. An army of Chinese vendors has stepped up, selling mobile devices across the world, although under brand names few may have heard of.
“Intel is being forced to work with a completely different set of supply chain folks that’s doing things quite differently in much smaller quantities,” Ma said.
This has involved finding partners that know the Chinese industry. Last year, it struck a deal with Rockchip, a local maker of ARM-based processors, to jointly develop an Intel-based Atom chip for tablets. The Atom X3 processor goes into production this month, and over 45 tablet, smartphone designs are already being developed around it.
“Mobile, we are coming,” said Rockchip’s CEO Min Li at Intel’s developer conference.
A year ago, Intel also announced it would spend $100 million to fund Chinese product development in convertible laptops, tablets, smartphones and wearables. About $37 million of those funds have already been used, with some going to a Chinese Android ROM developer called Lewa, and iris-recognition developer EyeSmart Technology.
“We are not the only company that innovates,” said Doug Fisher, an Intel senior vice president, in a press conference. “And so it’s important for us to plant a lot of seeds, and let a thousand flowers bloom, and try and harvest the most precious of those.”
Intel’s efforts include its Edison development platform, which involves helping entrepreneurs build connected devices around its Edison chip.
Liu, the CEO of the finger vein scanner startup, became involved with the Edison platform through a competition Intel sponsored. Liu’s company is developing finger vein recognition software that can be used in banks or hospitals to identify users.
The company, however, also wanted to come out with some consumer-facing hardware, so it developed a prototype finger vein reader with Intel’s Edison chip.
“The Edison support has been timely, and fast. In two or three weeks we’ve been able to complete the concept, and move it to hardware,” Liu said. To help his startup and others, Intel has also recruited manufacturers and Chinese Internet firms to potentially assemble and distribute the products.
Liu said he could have chosen chips from Qualcomm, but said Intel’s Edison processor was better designed to run his finger-vein reading services. Intel has also been quick to answer any technical questions, through its website, over the phone and via messaging apps.
The support has helped promote Liu’s company. “We were just established, our brand awareness and product still needs work, but Intel has been there to help us compensate,” he said.


http://www.pcworld.com/article/2907712/intel-courts-chinas-hardware-startups-to-popularize-its-mobile-iot-chips.html

Wednesday, April 8, 2015

Seized counterfeits goods in US dip to $1.2bn in 2014

The latest figures from the US government indicate both the value and number of seized counterfeit goods fell in 2014 compared to the prior year.

There were 23,140 seizures last year, down 5 per cent on 2013, with the value of intercepted goods (at manufacturer’s suggested retail price [MSRP] - or the value of the goods had they been genuine) falling to $1.2bn from $1.7bn.

The latest figures from US Customs and Border Control (CBP) show enforcement actions resulted in 683 arrests and 461 convictions, roughly in line with the previous year.

In addition, 144 shipments of circumvention devices were seized for violation of the Digital Millennium Copyright Act, and CBP enforced 44 exclusion orders in fiscal year 2014.

The top ten counterfeit commodities seized by MSRP were:

Table

Notable trends last year included a 5 per cent increase in semiconductor seizures and a 64 per cent hike in intercepted counterfeit batteries, thanks to an increased enforcement focus.

China remained the source of most counterfeits - 63 per cent of the total by value and down from 68 per cent in 2013- followed by Hong Kong which once again accounted for 25 per cent.  Canada was ranked third despite being the country of origin for just 1 per cent of total seizures; it did not feature in last year's list of top source countries.

"These results are a testament to the efforts of the men and women of the Department of Homeland Security, and the increased collaboration fostered by the IPR Center,” said IImmigration and Customs Enforcement (ICE) director Sarah Saldaña.

"To be clear, intellectual property theft is not a victimless crime. The victims are American businesses, and the employees whose jobs are dependent on IP-intensive industries. Counterfeiting is a crime of global proportions, and when property rights are violated, American jobs are lost, business profits are stolen and ultimately, consumers are cheated."

http://www.securingindustry.com/clothing-and-accessories/seized-counterfeits-goods-in-us-dip-to-1-2bn-in-2014/s107/a2315/#.VSVQ8uFLVj-

Global semiconductor market hit $340 billion in 2014: Gartner

Worldwide semiconductor market revenue hit $340.3 billion in 2014, increasing by 7.9 percent over the previous year's tally of $315.4 billion, according to Gartner.
The information technology research firm's latest report shows that the world's top 25 semiconductor vendors' combined revenue increase outstripped the global total, seeing an 11.7 percent boost in revenue growth during the year.
The top 25 vendors in the industry, including Intel, Samsung, and Qualcomm, made up 72.4 percent of the total market revenue -- an increase on the 69.9 percent of the market for which they accounted in 2013.
Once again, Intel topped the list of global semiconductor vendors by revenue, seeing a return to growth after two years of revenue decline. The company recorded a 7.7 percent growth in revenue over the year to $52.3 billion, with 15.4 percent of the global market share.
Intel was followed by Samsung Electronics, which saw a 13.4 percent growth in revenue for the year to $34.7 billion, taking 10.2 percent market share, and Qualcomm, which came in third with a 12.1 percent increase in revenue to $19.3 billion, claiming 5.7 percent market share.

gartner-semiconductor-table.jpg
(Image: Screenshot by Leon Spencer/ZDNet)
Gartner research vice president Andrew Norwood said that 2014 saw all device categories post positive growth, unlike in 2013, when application-specific integrated circuits, discretes, and microcomponents all declined.
"The memory market was the best performer for the second year in a row, growing 16.6 percent, meaning the rest of the market only achieved 4.9 percent growth," said Norwood. "As a group, DRAM vendors performed best, lifted by the booming DRAM market, which saw revenue increase 32 percent to $46.1 billion, surpassing the all-time high of $41.8 billion set in 1995," he said.
Gartner's findings, outlined in its Market Share Analysis: Semiconductors, Worldwide, 2014 report, comes as a regulatory filing from Samsung reveals that arch rival Apple remains one of the Korean tech giant's top sources of revenue thanks to its semiconductor business.
According to the company's annual end-of-year filings for 2014 to South Korea's Financial Supervisory Service, Apple, Deutsche Telekom, Ingram Micro, Sprint, and Verizon were the top five sources of income for the Korean tech giant, with the companies' business amounting to a collective 13 percent of its revenue.
Samsung's semiconductor business -- one of the company's strongest-performing units -- supplies memory chips for various Apple products. It is also a major contract maker of Apple's A-series processors that power the iPhone.

http://www.zdnet.com/article/global-semiconductor-market-hit-340-billion-in-2014-gartner/

Tuesday, April 7, 2015

After Record Year, Global Chip Sales Are Still Climbing

Last year, companies that manufacture semiconductors — the chips that go in our computers, phones and electronic gadgetry — recorded their best year ever, posting $336 billion in sales. And if the first two months of 2015 are any indicator, they’re on track to do it again.
Today the Semiconductor Industry Association, a trade group, reported that February chip sales reached $27.8 billion, amounting to an increase of nearly 7 percent over the same period a year ago.
On a regional basis, that growth was led by a 17 percent boost to customers in the Americas region. Sales in the Asia Pacific region also rose by nearly 8 percent. Sales declined in Europe year on year by 2 percent and by nearly 9 percent in Japan.
Memory chips — specifically, a type known as DRAM, which is widely used in computers, phones, tablets and servers — led sales, as did analog chips, also widely used in phones and consumer electronics.

http://recode.net/2015/04/06/after-record-year-global-chip-sales-are-still-climbing/

Monday, April 6, 2015

Samsung’s Chip Choice Is a Mixed Verdict for Qualcomm

Samsung Electronics 005930.SE +2.51% delivered a blow to Qualcomm QCOM -0.13% in one key choice of chips in its new Galaxy S6 smartphone. But the South Korean giant seems to be hedging its bets on another Qualcomm technology choice.
Chipworks, a consulting firm that disassembles and analyzes features in mobile devices, reported late Thursday that Samsung used an internally developed wireless modem in the Galaxy S6. Qualcomm had been expected to supply the modem–one of two critical chips in the handset–though Samsung had said earlier this year it would use its own processor chip over Qualcomm’s Snapdragon.
But Chipworks analyzed a Galaxy S6 that was designed for a particular carrier’s network, a person familiar with the situation said Friday. Models built for some other networks, this person said, would use Qualcomm modems, leaving the chip maker with a meaningful share of modems in Galaxy S6 units.
Qualcomm warned in early January that its financial results this year would be hurt as a major customer, which was not identified, had decided not to use the Snapdragon 810 chip in a flagship smartphone. Qualcomm didn’t use Samsung’s name but never disputed that it was referring to the South Korean company.
Handset makers can either buy one chip that handles both calculating and communications–like the Snapdragon–or separate chips for those functions. Qualcomm prefers the first approach, since it tends to get more money for multi-function products.
Apple has tended to  favor separate chips, using its own processors but typically turning to Qualcomm for the wireless modem. Samsung has used prior Snapdragon models but turned to its own Exynos processor this time. Samsung manufactures the chip using an advanced production process that the company says brings performance and power-savings benefits.
“Samsung has always mixed up their vendors,” says Patrick Moorhead, an analyst with Moor Insights & Strategy.
Samsung must consider factors such as keeping its chip factories running at capacity, Moorhead said, in addition to the product-design priorities. The company has a massive plant in Austin, Tex., that supplied Apple-designed processors for that company’s iPhones.
Apple switched from Samsung to Taiwan Semiconductor Manufacturing Co.TSM -0.49% to build chips for the iPhone 6. But Bloomberg this week reported that Apple will switch back to Samsung to supply chips for its next model.
Moorhead, meanwhile, said Samsung may switch back to Qualcomm for its flagship smartphones, once the chip maker comes up with a new version of its Snapdragon line that uses more original circuitry.
The Chipworks teardown revealed not only an Exynos chip and a Samsung modem, but several other kinds of Samsung chip including two processors for managing power, an image processor and a Wi-Fi chip. Samsung, the biggest maker of memory chips, also supplied two varieties of that technology in the Galaxy S6: NAND flash memory and dynamic random-access memory, Chipworks said.

http://blogs.wsj.com/digits/2015/04/03/samsungs-chip-choice-is-a-mixed-verdict-for-qualcomm/

Thursday, April 2, 2015

Start-up touts wireless charging from Wi-Fi and Bluetooth signals

A wireless charging start-up says it has developed a chipset that easily integrates with mobile devices to allow them to charge from existing Wi-Fi and Bluetooth transmitters.
Ossia originally announced its Cota wireless charging technology, in 2013, saying the antenna and chipset could receive power from wireless transmissions up to 30 feet away.
Today, the company announced that mobile device makers can now integrate its Cota chipset into mobile products without adding additional antennas; the chip simply uses the antenna that comes with the mobile device to receive power.
cota concept batteries hr Ossia
Ossia's Cota concept AA batteries. The technology could theoretically keep batteries fully charged.
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Ossia's Cota remote wireless power receiver uses a mobile device's existing antenna, eliminating internal coils needed by magnetic induction wireless charging systems that dominate the market today.
"Wi-Fi and Bluetooth antennas can perform double duty as both data and Cota wireless power receivers," the company said in a statement.
Hatem Zeine, CEO of Ossia and inventor of the Cota system, said the technology addresses internal mobile device "real estate" that limits what can be placed, not only inside smartphones and tablets, but also more compact wearable devices, all of which are increasingly thinner and lighter.
transmitter desktop Ossia
The desktop version of the Cota wireless power transmitter.
Additonally, the Cota chipset can be used in stationary technology, such as in smoke detectors or even AA or AAA batteries, to keep them fully charged.
Ossia hopes to begin shipping its Cota technology to equipment makers this year.
"Not only does Cota not take up any of this valuable space by requiring additional components, but by adding remote wireless power, designers can actually decrease the size of the biggest space hog inside the device: the battery," he said. "When the device receives power remotely, it can be continuously charged, making it possible to use smaller batteries in designs."
transmitter ceiling unit Ossia
The ceiling-mounted version of the Cota wireless charging transmitter.
The Cota receiver chip also includes power management capabilities that manufacturers can leverage to reduce component costs, required circuit board area, and time-to-market, making the industry's most robust wireless power technology also the easiest to integrate.
All that's needed is slight tweaks to the circuitry and firmware, according to a spokesman.
The Cota technology can charge multiple mobile devices at the same time, regardless of whether a device is stationary or moving -- such as a wearable bracelet on someone's wrist. With an effective line-of-site radius of 30 feet, a single Cota charging station can simultaneously charge or power all the battery-operated devices in every room of an average home or office suite, the company said.
The Cota technology consists of two parts: a charger and a receiver. The internal Cota receivers charge batteries and send out omnidirectional beacon signals. Once the Cota charger receives these beacons, it returns thousands of targeted signals that build pockets of energy at only the precise locations of the beacons' origins.
"This pinpoint precision targeting of energy safely and efficiently powers all Cota-equipped devices and batteries within its effective radius, even as they move around the room," Cota said in its marketing material.
Cota claims its technology is "inherently safe." Its tracking beacons use only about 1/10,000th the signal power of Wi-Fi, which itself is a low-power signal.
Cota's energy pockets are created using approximately the same signal strength emitted by a mobile phone during a call.

http://www.computerworld.com/article/2904366/start-up-touts-wireless-charging-from-wi-fi-and-bluetooth-signals.html


Wednesday, April 1, 2015

Counterfeit SD Card Problem is Widespread

TORONTO – Individual consumers and corporate bulk buyers alike should be wary of great prices for secure digital (SD) memory cards: they will find out the hard way the cards are bogus.
The Counterfeit Report recently published its findings about the extent of counterfeit SD cards available for purchase, particularly online from dishonest sellers using eBay, Amazon, and Alibaba offering high capacity cards at deep discounts. Publisher Craig Crosby said the cards and packaging, using common serial numbers, are nearly identical to the authentic product of all major SD card brands.
Tests by the Counterfeit Report found that the cards will work at first, but generally speaking, buyers are purchasing what they think are cards with capacities of 32GB and up. Instead they are getting are cards with 7GB capacity. Counterfeiters simply overwrite the real memory capacity with a false capacity to match any capacity and model they print on the counterfeit packaging and card, Crosby explained. Users can’t determine the actual memory capacity of a counterfeit memory card by simply plugging it into their computer, phone, or camera. When the user hits the limit, the phony card starts overwriting files, which leads to lost data.
The Counterfeit Report often comes across cards in capacities that don’t exist in any product line, and the cards it purchases and tests that are 32GB and up are usually always fake. The counterfeiters make a great profit on the fake cards, and there’s no consequence.
Fraudulent cards do appear genuine, even once users have them in their hands. They don’t realize the cards are counterfeit until they stop working, and blame the manufacturer for making a faulty product. Buying from a major retailer in their store doesn’t necessarily solve the problem either, as counterfeiters purchase genuine items and then exchange them unopened with their fakes.
There is free downloadable software to verify whether an SD card has the specs on the packaging, but it is time-consuming to use, especially for an organization that has bought cards in bulk. Crosby said the problem isn’t relegated to just SD cards; USB and other portable flash drives are also being counterfeited, “If it’s manufactured, it’s been counterfeited.”
When contacted about the problem of bogus SD cards, Kingston said it doesn’t comment on counterfeit issues. Meanwhile, Toshiba product manager Jacky Lee replied by email that each of its SD cards has a unique serial number printed on the card. Typical fake SD cards do not have such a serial number or if they do, it is not unique. Users can use a third party app to test the SD card flash memory size, as most fake SD cards have much lower storage capacity than what they claim, Lee said, advising that consumers and companies buy from a manufacturer-authorized seller. “As a general rule, if the price is too good to be true, then it is probably a counterfeit product,” noted Lee.
According to Crosby, it’s understandable that vendors won’t discuss the problem as it’s hard to get their arms around, and that providing support to customers who buy fraudulent cards with their name on it would take up too many resources. Ultimately, there is little they can do, he said. Manufacturers are understandably guarded about the problem as it affects their brand, and if they post bulletins warning consumers about faulty cards, they are just doing quality assurance for the counterfeiters.
EE Times contacted the SD Association (SDA) about the issue of counterfeit SD cards. Its president, Brian Kumagai, said in an email that the responsibility of counterfeit cards falls to law enforcement. “The SD Association creates SD standards and specifications and promotes their adoption, advancement and use,” he said. “It does not monitor the trade of SD memory card products.”
Kumagai said SD memory card product manufacturers may contract with separate SD standards-related organizations such as SD-3C and 4C Entity for different intellectual property related to SD standards. He added that access to the SD specifications is controlled, and that SDA member companies have access to compliance and testing tools to confirm that their products meet standards and specifications, including interoperability with other SD memory card products.
Kumagi’s advice to consumers or bulk buyers (such as IT departments) was similar to that of Toshiba’s: They should be careful to purchase from authorized sellers, distributors, and resellers. “Your SD memory card product manufacturer is your best resource for any purchase questions.”
There are third-party tools, he said, not related to the SDA, that screen SD memory cards for compliance to SD specifications. Buyers can also access the SD-3C website to view a list of companies that have a Card License Agreement that validates an authorized SD memory card.
Counterfeit SD cards are just part of a larger problem. The Counterfeit Report also keeps an eye out for other phony items such as airbags, smartphones, including the iPhone, as well as peripherals such as chargers, because consumers aren’t aware many of these items are counterfeits, whereas high-end handbags and watches are known to have knockoffs.

http://www.eetimes.com/document.asp?doc_id=1326059

Counterfeit products rife in Africa electrical market, says survey

Counterfeiting of common electrical products, including cables and breakers, is widespread across Africa, according to a survey conducted by global energy management and automation company Schneider Electric.
The results of the study released on Monday indicate that counterfeiting of electrical products occurs in 40% to 80% of African markets.
The five most counterfeited products in rank include cables, breakers, sockets, switches and extension cords.
The results suggest that China is the main source of counterfeit electrical goods entering the continent followed by some other countries in Asia.
Counterfeit products manufactured locally have predominantly emerged out of Tanzania, Nigeria and the Ivory Coast, said Tracy Garner, Anti-Counterfeiting Global Manager at Schneider.
The survey found that ABB, Hager, General Electric, Schneider, Legrand and Siemens are the brands experiencing the highest levels of intellectual property rights abuse in Africa.
Garner said: “For the first time, all stakeholders of the African electrical market will be able to move forward, based on a solid picture of reality.”

Surveying counterfeit electrical products

Schneider conducted the survey in 11 African countries: Cameroon, Republic of the Congo, Democratic Republic of the Congo (DRC), Ghana, Guinea, Ivory Coast, Kenya, Nigeria, Tanzania and Uganda from December 2013 through to March 2014.
Over 500 key personnel were approached by 37 African investigators answering a total of 8,185 questions, carried out over a four month period.
One question posed to the candidates was:
What are the main counterfeited electrical goods that you know of in your country?
graph 1
Schneider Electric graph depicting results of most counterfeited electrical products
A second question asked:
In the following list, what would you say are the most counterfeit brands?
Schneider electric survey
Schneider Electric graph illustrating most counterfeited electrical brands

http://www.esi-africa.com/counterfeit-products-rife-in-africa-electrical-market-says-survey/

3D Qualcomm SoCs by 2016

PORTLAND, Ore. — The future of three-dimensional (3D) very large scale integration (VLSI) for system-on-chips (SoCs) will not stack die connected by through-silicon-vias (TSVs), but will build them on a single layered die, according to Karim Arabi, vice president of engineering at Qualcomm speaking at the International Symposium on Physical Design (ISPD-2015, Mar. 29-April 1).
"Our 3D VLSI technology, which we call 3DV, enables die size to be shrunk in half, while simultaneously increasing yields," Arabi told us.
Qualcomm's motivation, according to Arabi, is market share in the 18 billion smartphones that he predicts will be produced by 2018 — "more than all the computers and other electronic devices combined," he told us. He also noted that even though the cloud is offloading some computationally intensive applications — such as speech recognition — there will still be an increasing need for local processing power for most smartphone functions.
Karim Arabi, vice president of engineering at Qualcomm describes how its next-generation SoCs will use up to three layers without through-silicon-vias (TSVs) to reduce die size and increase yields.
(Source: EETimes)
Karim Arabi, vice president of engineering at Qualcomm describes how its next-generation SoCs will use up to three layers without through-silicon-vias (TSVs) to reduce die size and increase yields.
(Source: EETimes)
In the long term, Qualcomm is building neural processing units (NPUs) modeled on the human brain, "because they are highly flexible and highly efficient for the next generation of mobile devices, cloud computing, Big Data processing, deep learning and machine learning," Arabi told us. But for the near term, Qualcomm is extending the capabilities of its already popular SoCs with its new type of 3DV interconnection and process technology.
Qualcomm is creating two basic types of 3DV interconnection methods with the hope of deploying them by 2016. These new types of 3D interconnection comes in two flavors face-to-back (F2B) and face-to-face (F2F).
In the fabrication process of front-to-back (F2B) 3DVs (a) the bottom tier is created the same way as 2D-ICs. (b,c,d) To add another layer, first a thin layer of silicon is deposited on top of the bottom tier. (e) This front-end-of-line (FEOL) process of the top tier permits the addition of normal vertical vias and top-tier contacts.  (f) Finally back-end-of-line (BEOL) processing creates the top-tier. 
(Source:Qualcomm)
In the fabrication process of front-to-back (F2B) 3DVs (a) the bottom tier is created the same way as 2D-ICs. (b,c,d) To add another layer, first a thin layer of silicon is deposited on top of the bottom tier. (e) This front-end-of-line (FEOL) process of the top tier permits the addition of normal vertical vias and top-tier contacts. (f) Finally back-end-of-line (BEOL) processing creates the top-tier.
(Source:Qualcomm)
F2B is easier because it doesn't need precision bonding but instead just puts a thin layer of silicon on top of the finished first layer and starts building the second layer using traditional vias. Unfortunately, the bottom layer was likely produced using temperatures as high as 1,200 degrees Celsius. The next layer, however, will have to limit temperatures in order to keep from liquidating layer one's copper interconnects, which have a melting point of 1,085 degrees Celsius. To solve, Qualcomm could use tungsten as interconnects on layers one, which are slightly slower, but have a melting point of 5,930 degrees Celsius. A second solution would be to limit the temperatures on the top level, to say 625 degrees Celsius, which would lessen the performance of the second layer transistors by 27.8 percent for PMOS and 16.2 percent for NMOS. Thus the ideal 3D chip is unachievable today using F2B, overall sacrificing about 37 percent in performance and 41 percent in power.
F2F, on the other hand, allows both chips to use copper interconnects and optimally performing transistors, but has the disadvantage, according to Arabi, that the F2F method requires larger vias the size of which are limited by the accuracy with which the two facing wafers can be bonded. Qualcomm, however, believes that by using a mix of the two techniques it will be able to produce fully optimized 3DV SoCs with an unlimited number of layers. In fact, with appropriate partitioning and floor planning, Arabi believes 3DV chips can be produced that are faster, smaller, consume less power and operate at lower temperatures than putting the same functions on a single 2-D chip.
In the fabrication process of front-to-front (FF) 3DVs requires wafer-level bonding and hence the vias can only be a small as the accuracy of the bonding method.
(Source: Qualcomm)
In the fabrication process of front-to-front (FF) 3DVs requires wafer-level bonding and hence the vias can only be a small as the accuracy of the bonding method.
(Source: Qualcomm)
The final advantage of 3DV chips, according to Arabi, is that you only need to use the most expensive and latest node technology on the bottom layer. For instance, the bottom layer housing the CPU, GPU and other high-speed devices can be fabricated at 10-to-14 nanometer, whereas the higher layers housing less critical functions can be fabricated at a less expensive relaxed node of, say, 28-nanometers. He also predicted that the best yielding SoCs will only use two layers, whereas three layers will likely only be used for customers who also want to integrate radio frequency (RF) functions on the top layer.

http://www.eetimes.com/document.asp?doc_id=1326174