Friday, March 4, 2016

Broadcom Identifies $300M Cuts

SAN JOSE, Calif. – Hock Tan has made a lot of progress re-defining Broadcom Corp. in just a month since he acquired it for $37 billion in the semiconductor industry’s biggest deal to date. But the chief executive of the former Avago is not ready to provide details about what the new company looks like yet.
At a high level, Tan organized what is now Broadcom Ltd. into about 24 profit/loss divisions, considered the new company’s core businesses. Each has its own set of market and technology goals and a general manager reporting to him. He estimated they will report consolidated revenues of $3.55 billion in the April quarter, slightly below Wall Street estimates of $3.57 billion.
The next quarter “will be the trough for rest of fiscal year,” Tan said, noting his eight-inch fab is already building RF parts for the next-generation Apple iPhone in which he expects to win as much as 20% more sockets.
Tan also identified about $300 million in discontinued operations from the classic Broadcom Corp. “There’s more than one [non-core] business, [they are] not necessarily in wireless, but we really prefer not to divulge more details because we are running a process,” he said in his first quarterly call with analysts since the merger was announced in May.
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The new Broadcom Ltd. now has as many as 24 separately managed profit/loss units. (Image: Broadcom) Click here for larger image
The new Broadcom Ltd. now has as many as 24 separately managed profit/loss units. (Image: Broadcom)
Click here for larger image
“This is our initial cut, we will go aggressively into finding buyers, and may add businesses to the list later, but this is the Day 1 list we are chasing,” said Anthony Maslowski, CFO of the merged company.
Avago bought LSI Inc. in 2013 for $6.6 billion, one of the largest chip mergers at the time. It then sold pieces of LSI to Intel and to Seagate.
Separately, Tan says he now believes he “may be able to even beat” plans to cut $750 in costs from the combined companies within 18 months. The cuts will carve a bowl-shaped trajectory with more of them falling at the beginning and ends of the period, less than a third of them in the current fiscal year.
Savings from expanded buying power with manufacturers such as TSMC will come “mainly in the middle six quarters,” Maslowski.
Broadcom’s set-top box and wireless connectivity groups remain intact, deemed “sustainable franchises” in the new company. Growth in the set-top group will come mainly from DSL and GPON gateways, he said. Avago’s FBAR filter technology “will improve [classic Broadcom] Wi-Fi modules to surpass performance of anyone else’s,” he said.
Wall Street analysts like the deal so far. “We believe the combined entity has the potential to grow revenue in line or slightly faster than the semi industry, led by dominant positions in a wide array of wired and wireless products. Additionally, we see significant cost synergies leading to [earnings/share] growth that meaningfully exceeds revenue growth,” said analyst Ross Seymore of Deutsche Bank in a report.
Employees who spoke under condition they not be identified said it’s too early to tell how the merger will go but executives are bullish.
“There’ll be some change in how we do things, not so much in technology but in admin and support functions that have to be melded -- We may have some tools that get consolidated, who knows,” said one veteran engineering manager.
When the merger was announced, Henry Samueli, co-founder of Broadcom, said he would work as the new company’s CTO to see how Broadcom’s SoC design re-use methodology could be spread to Avago’s products which tend to be less integrated. “After the deal closes we will see where we can leverage the centralized method and where we can’t – it’s still premature, but I think it will be a blended approach,” Samueli said in May.
“He’s got to learn the Avago technology…We’re in the phase where we’re still trying to figure things out and get them organized…but he’s very excited about it,” the engineering manager said.
Broadcom declined requests for interviews with Samueli and other executives.

http://www.eetimes.com/document.asp?doc_id=1329099

Thursday, March 3, 2016

Samsung ships the world's highest capacity SSD, with 15TB of storage

Samsung Electronics announced Wednesday that it is now shipping the industry's highest-capacity solid-state drive (SSD), the 15.36TB PM1633a.
Samsung revealed it was working on the drive last August, saying it would use the same form factor as for a laptop computer: 2.5-in.
The 2.5-in SSD is based on a 12Gbps Serial Attached SCSI (SAS) interface for use in enterprise storage systems. The PM1633a has blazing fast performance, with random read and write speeds of up to 200,000 and 32,000 I/Os per second (IOPS), respectively. It delivers sequential read and write speeds of up to 1200MBps, the company said. A typical SATA SSD can peak at about 550MBps.
Because the PM1633a comes in a 2.5-in. form factor, IT managers can fit twice as many of the drives in a standard 19-in. 2U (3.5-in.) rack, compared to an equivalent 3.5-in. storage drive. The SSD also sets a new bar for sustainability, Samsung said. The 15.36TB PM1633a drive supports one full drive write per day, which means 15.36TB of data can be written every day on a single drive without failure.

The SSD can write from two to 10 times as much data as typical SATA SSDs based on planar MLC and TLC NAND flash technologies.
Samsung said it is betting on the PM1633a SSD line-up to "rapidly become" the overwhelming favorite over hard disks for enterprise storage systems.
"To satisfy an increasing market need for ultra-high-capacity SAS SSDs from leading enterprise storage system manufacturers, we are directing our best efforts toward meeting our customers' SSD requests," Jung-bae Lee, senior vice president of Samsung Electronic's Application Engineering Team, said in a statement. The performance of the PM1633a SSD is based on four factors: the 3D NAND (vertical NAND or V-NAND) chips; 16GB of DRAM; Samsung's proprietary controller chip; and the 12Gbps SAS interface.
The random read IOPS performance is about 1,000 times that of SAS-type hard disk drives and the sequential read and write speeds are more than twice the speed of a typical SATA SSD, the company said.

Combining 512 of Samsung's 256Gbit V-NAND memory chips enables the SSD's unprecedented 15.36TB of data storage capacity in a single drive. V-NAND, or 3D NAND, is a way of stacking NAND cells one atop another like a microscopic skyscraper. Not only does it double the density of standard planar NAND chips, from 128Gbits to 256Gbits, it also increases performance.
Samsung originally announced the 48-layer V-NAND last August, saying it also sports 3-bits per cell or multi-level cell (MLC) NAND technology.

In the V-NAND chip, each cell utilizes the same 3D Charge Trap Flash (CTF) structure in which the cell arrays are stacked vertically to form a 48-storied mass that is electrically connected through 1.8 billion channel holes vertically punching through the arrays by using a special etching technology. In total, each chip contains more than  85.3 billion cells. They each can store 3 bits of data, resulting in 256 billion bits of data -- in other words, 256Gb on a chip that's larger than the tip of a finger.
The 256Gb dies are stacked in 16 layers to form a single 512GB package, with a total of 32 NAND flash packages in the 15.36TB drive. Utilizing Samsung's third-generation, 256-gigabit (Gb) V-NAND technology, which stacks cell-arrays in 48 layers, the PM1633a line-up is expected to be faster and more reliable than its predecessor, the PM1633. That model used Samsung's second-generation, 32-layer, 128Gb V-NAND memory.

In 2014, Samsung became the first company to announce a 3D NAND flash chip with a 3-bit MLC architecture. In October 2014, the company announced it was mass producing a 32-layer V-NAND chip. Then, last August, it followed up by mass producing a 48-layer V-NAND chip.
While Samsung may be the first to do so, it's not alone in developing 48-layer 3D NAND chips. Last year, SanDisk and Toshiba announced that they were also preparing to manufacture 256Gbit, 3-bit-per-cell (X3) 48-layer 3D NAND flash chips that offer twice the capacity of their previously densest memory.

Intel and Micron have also announced 3D NAND products. The two companies  boasted that their technology would enable gum-stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-in. SSDs with greater than 10TB.
Along with the 15.36TB model, Samsung will offer the PM1633a SSD in 7.68TB, 3.84TB, 1.92TB, 960GB and 480GB versions later this year. Because the SSDs are targeted at enterprise use, and will be sold to resellers who'll determine the retail prices, Samsung did not announce its own pricing for the drives.

http://www.computerworld.com/article/3040208/data-storage/samsung-ships-the-worlds-highest-capacity-ssd-with-15tb-of-storage.html

Wednesday, March 2, 2016

Intel, Samsung and others invest another $10 million in Corvallis chip startup pushing the edges of chip technology

Some of the biggest names in the semiconductor industry are looking to a startup in Corvallis to help break a technological impasse that's slowing the advent of new chip technology.
The features on computer chips have become so small that creating them has become a laborious and inconsistent process, impeding the rollout of new chip technologies. Last year, for example, Intel announced it is slowing the pace at which it introduces new generation of manufacturing technology.
Intel and many other chipmakers and semiconductor equipment manufacturers are awaiting the arrival of a long-awaited production tool called extreme ultraviolet (EUV) that will improve the lithography used to imprint features onto a chip. Lithography is a key step in semiconductor manufacturing, putting tiny patterns onto a chip with ultraviolet light.
Corvallis-based Inpria is pioneering new materials engineered specifically for EUV, which the 20-person company says will improve results. Inpria, which spun out of Oregon State University in 2007, announced Tuesday it has raised a second $10 million investment to further its work.
A firm called Air Liquide Venture Capital led Tuesday's round, backed by the investment arms of chipmaking giants Intel and Samsung, each of whom had previously backed Inpria. Materials company Tokyo Ohka Kogyo also contributed.
Conventional lithography requires several steps to put a pattern into a chip, slowing the production process and adding expense. EUV tools promise tinier patterns in fewer steps.
"Intel needs EUV. The semiconductor industry needs EUV to continue to scale cost effectively," said Andrew Grenville, Inpria's chief executive. And after years of delay, he said EUV is showing practical results inside today's factories.
"The pieces are coming together," Grenville said. "They are coming together in a way that's gaining momentum, in a way that brings it to a very real place."
Inpria's materials show more promise with EUV than conventional materials do, according to Grenville. He said Inpria remains on track to begin pilot production of its technology next year and the company hopes to have its technology ready for the 7-nanometer generation of semiconductor equipment -- due to begin production in three or four years.
"We are making progress," Grenville said. "It's a big industry to be making progress in."

http://www.oregonlive.com/silicon-forest/index.ssf/2016/03/intel_samsung_and_others_inves.html

Tuesday, March 1, 2016

EU clears Dell's purchase of EMC Corp


BRUSSELS (Reuters) - The European Commission said on Monday it had cleared Dell Inc's planned $67 billion acquisition of data storage company EMC Corp EMC.N.
Dell unveiled the deal in October last year, the largest ever in the technology industry sector, and designed to enable it to better challenge rivals Cisco Systems Inc CSCO.O, IBM IBM.N and Hewlett-Packard HPQ.N in cloud computing, mobility and cyber security.
The Commission said that the merged entity would have a moderate market share in external enterprise storage systems and would still face strong competition.
In virtualization software, EMC's VMware had a strong position, the Commission found, but would have neither the ability nor the incentive to shut out competitors.
Reuters reported on Feb. 18 that the deal was set to be cleared.


http://ca.reuters.com/article/businessNews/idCAKCN0W21OE

Monday, February 29, 2016

Lattice Semiconductor explores sale amid Chinese interest - sources

L
attice Semiconductor Corp (LSCC.O), a U.S. maker of programmable chips in mobile phones and tablets, is exploring a sale that has attracted interest from a prospective Chinese buyer, according to people familiar with the matter.
The sale process could be a further test of corporate China's ability to snap up U.S. chip makers, after attempted deals by Unisplendour Corp Ltd (000938.SZ) and China Resources Microelectronics Ltd were dropped this month on concerns the United States could block them on national security grounds.
Lattice Semiconductor's sale discussions are also another example of the wave of dealmaking sweeping the industry, fueled by a drive by major consumers of chips, such as Apple Inc (AAPL.O) and Samsung Electronics Co (005930.KS), to cut costs.
Lattice Semiconductor is working with investment bank Morgan Stanley (MS.N) to review interest from potential buyers, including a Chinese party, the people said on Friday. There is no certainty Lattice Semiconductor will agree to any deal, the people added.
The Chinese party's identity could not be immediately established. The sources asked not to be identified because the sale process is confidential. Lattice Semiconductor and Morgan Stanley offered no immediate comment.
Based in Portland, Oregon, Lattice Semiconductor makes programmable logic chips and related software used in everything from smartphones to cars. It has a market capitalization of about $678 million.
Earlier this week, Unisplendour scrapped its planned $3.78 billion investment in U.S. hard-disk maker Western Digital Corp (WDC.O) after the U.S. Committee on Foreign Investment (CFIUS) decided to review the transaction.
A Chinese consortium that included China Resources Microelectronics also lost a $2.5 billion bid to acquire Fairchild Semiconductor (FCS.O) earlier this month. Fairchild cited the risk of CFIUS blocking that deal for its decision.
Lattice Semiconductor has been working to integrate Silicon Image, a U.S. company it bought for $600 million in its biggest-ever deal last year, which expanded its products for video customers.
Lattice Semiconductor Chief Executive Darin Billerbeck said on an earnings conference call earlier this month that he expects the first quarter "to represent a low point" of the year for the company.
Lattice Semiconductor blamed its weak quarterly revenue on Samsung, one of its biggest customers, and its peers struggling with profitability and cheaper phone models.


http://www.reuters.com/article/us-latticesemiconductor-m-a-idUSKCN0W000D

Friday, February 26, 2016

IP Requirements Changing

Twenty years ago the electronics industry became interested in the notion of formalizing re-use through third-party IP. It has turned out to be harder than anyone imagined.
In 1996, the Virtual Socket Interface Alliance (VSIA) was formed to standardize the development, distribution and licensing of IP. Soon afterward, companies with a couple of people in a garage put up their IP developer shingle to enter the gold rush. Quality suffered, and the industry quickly developed a bad reputation. Additional effort was soon placed on defining the set of expected deliverables that should go along with an IP block. That set of deliverables continues to be a moving target. Even today, the industry is poised for the next set of requirements that potentially will define a new set of directions and capabilities for the industry.
Few of the original IP developers remain. Most were consolidated into a handful of large suppliers. One that is still in business is Digital Core Design (DCD), based in Poland.
“We have been part of the IP market since 1999, so we remember the times when the IP market was created,” says Tomeq Cwienk, PR manager for DCD. “For us, the design process was never about developing an IP block, selling it and forgetting about it. Every single core we build was tailored to the project needs.”
Since that initial effort, the IP industry has undergone a fundamental change. “Twenty years ago when an IP block was purchased, such as a USB block, the integrator understood the protocol themselves and they just wanted IP for it,” notes Kevin Yee, product marketing director for Cadence. “Today when they buy IP they don’t know much about the protocol.”
This is a key change for IP, which increasingly looks like a black box. But for this scheme to work, the vendor has to selectively expose aspects of the IP so it can be properly used and integrated. “SoC design these days is less about design and more about integration,” continues Yee. “Twenty years ago a PCI block was a good percentage of that die, but today it is a very small part of the design. The number of IP blocks used in a design is increasing exponentially. It used to be 1 or 2 blocks. Now it is possibly 50 or 60 blocks.”
With this change comes an associated migration of knowledge and a change in the development schedules. IP frequently is developed in parallel with the SoC rather than ahead of time. “There are two key challenges that we constantly face,” says Prasad Subramaniam, vice president of research and development and design technology for eSilicon. “There is schedule pressure because the IP is a prerequisite for the chip to happen, and you have to make sure that they are of good quality. You’re often building IP that is compliant to certain standards and oftentimes these standards are evolving, or they are not so straightforward to interpret because you’re reading a 500-page document and you want to make sure you pick up all the nuances that are described in the standard.”
Another major change is related to the size and complexity of the IP blocks. “Just as the scope of the chips has changed, IP has moved up the food chain as well,” says Yee. “Where we used to have a simple IP protocol, it is now much more complex, more software around it. Integrators need to understand different things about it.”
That means that the IP has to be developed differently. “You have to build in a lot of flexibility into your IP,” adds Yee. “Otherwise you are building a custom IP every time and that model doesn’t work. A lot of companies that used to develop their own IPs have switched to third-party IP. A lot of customers use multiple nodes and multiple processes and that means that maintenance becomes more difficult.”
The deliverables expected for an IP block can vary a lot depending upon several aspects of that block. The first distinction is whether the block is a hard or soft core, and the second is if it whether it is considered to be library IP, standard interface IP or star IP. (A more detailed description for each of these can be found in the Knowledge Centers (Intellectual Property, Hard IP, Soft IP, Digital IP).
IP developers have been integrating greater amounts of functionality into a single block. Examples include complete audio or video subsystems. That could help relieve SoC integrators from having to worry about certain aspects of the design. “Today, there is a big requirement for security and we see this from all angles – automotive, Internet of Things etc.,” says Andrew Faulkner, senior director of product marketing for Sidense. “Because of this we are adding more features that allow our One Time Programmable (OTP) memory to hook seamlessly into security systems and to co-operate with various different security strategies. In addition, we are adding capabilities such as saving secure keys and locking those keys while minimizing or preventing side-channel attacks. It has gone from providing a memory to adding system-level features.”
New deliverables
In order to make some of the IP blocks more black box, alternative ways must be found to provide the information that is needed for SoC integration, such as information about quality and the ways in which the block can be used. “One big advancement has been in coverage,” says Gabriel Chidolue, verification technologist for Mentor Graphics. “Integrators would like to see how the IP provider has verified what they are delivering and that it meets the specification. Another requirement is for ease of configuration and concepts such as IP-XACT have come a long way in helping IP consumers leverage IP in many different contexts. It defines how you connect IP blocks together and how to hook it up to a verification environment.”
There are multiple viewpoints as to what needs to be exposed. “Another view that comes out of that is a machine understandable view of all of the registers that are inside of the block,” adds Drew Wingard, chief technology officer at Sonics. “There is technology that takes that and creates the databook version of the chip. Just the register description of some chips can be more than 3,000 pages long, so automating that can be a big deal.”
The newest enabler for exposing information about the power capabilities of a block and its external needs comes with the latest release of IEEE 1801-2015, often called UPF. “With UPF 3.0 it becomes possible to add a power model deliverable,” continues Wingard. “Now with any tool that understands UPF 3.0, you get an unambiguous description of it that could be used to calculate how much power could be consumed in different modes of operation.”
Navraj Nandra, senior director of marketing for IP in Synopsys adds more detailed aspects of it. “UPF is used to model retention, isolation, power switching and power gating. UPF is the plan of record for all our IP.”
It all comes down to providing the right information to enable the SoC integrator to do their job more efficiently. “When you take a concept such as power, they realize they understand the flow from a functional point of view if everything is powered from the same supply,” explains Chidolue. “However, if I start breaking things up into multiple power domains, the system integrator need a little bit more guidance about the internal functional behavior.”
There are many issues that need to be resolved. “The point here is that the vendors must take responsibility for ensuring their IP works in external environments, and this is hard to do,” asserts Dave Kelf, vice president of marketing for OneSpin Solutions. “It is not enough to deliver an integration documentation that describes the necessary integration steps. The vendor must provide a complete environment that can be configured to operate in the foreign territory of their customer’s design.”
Characterization
Several industries place additional demands on IP providers. “Recently, IP consumers have become more concerned about IP reliability and ease of integration into the ASIC,” says Vamshi Krishna, senior IP field application engineer at Open-Silicon. “Because to this, there is a demand for additional deliverables such as silicon characterization reports, certifications, evaluation boards along with the standard deliverables.”
Characterization places additional pressures on the food chain. “Our silicon has to be qualified in advance of the SoC doing their integration,” says Sidense’s Faulkner. “That is not always possible because it takes a similar amount of time to qualify the IP as it does an IC. There are 1,000 or 2,000 hours of reliability testing. It has to go to the fab. It has to be packaged and then tested. This can be quite lengthy. We are finding that we have to work very closely with the foundries. We have to create PDKs and SPICE models, and that means a high degree of risk because if we are developing our solution at the same time as them, then this is a conundrum that we have to find a way through.”
Depending upon the type of IP, characterization can become an even bigger problem. “Generally, for hard IP we would like to have models at various operating conditions, slow process, fast process, typical process; low temperature, high temperature,” says Subramaniam. “For certain types of IP, such as digital, the corners can be limited to worst case condition, but for analog IP we would like to have many corners.”
Growing software content
When you look at charts of development effort, it is not uncommon to see software being defined as requiring more time and effort than hardware for complex SoCs these days. But the increase in software content for IP has been more limited. “Software refers to device drivers and possible some application layers,” says Krishna. “The investment for this software IP block is low and, in general, do not exceed the investment on hardware.”
There are also not quite the same quality constraints for this software. “You need to deliver drivers with your IP, so that there is a reference,” says Larry Lapides, vice president of sales for Imperas. “But how can you keep up with having Linux, FreeRTOS, VxWorks, ThreadX and so on. You can’t do them all, but you do need to have one or two reference implementations.”
Part of the reason for the slow software growth is the nature of the IP targets. “The software component right now is probably small, and it’s unclear to me whether it will grow,” says Subramaniam. “This is because if you’re trying to target a hardware IP block you probably want to put more and more into the hardware to get the most out of it, and therefore the software component of it should be small.”
Wingard agrees for most cases. “We don’t see the software content exceeding hardware any time soon for most IP blocks. But in media, it might be true today. Audio subsystems have to deal with a large number of compression and decompression standards and things like echo cancelation. These tend to be written in software. People who have done well in this area probably have spent more on software than hardware. In graphics, it is probably about there. In video, decoders and encoders are sufficiently challenging hardware designs, so it is probably on the edge there. The other place may be security. Hardware security could include RSA, DES and all of the other crypto function. So they may be close to having more software than hardware.”
But while the IP may not need large quantities of software, there is a growing need to run software on a model of the complete SoC, and that may mean additional models being requested. “While software may be a significant component of the IP,” says Lapides, “what is more important is having the high-level models for integration verification and you also need the fast untimed models for software development.”
Additional models can be added to that list. “Some IP can impact the performance of the design and thus the desire to deliver a performance model of the IP,” says Wingard. “This may help the customer to make sure that the collection of blocks has enough performance, when combined together, with all of the other things that are all working together, to share resources to such things as memory. Sometimes that performance model is fairly simple and at other times it might looks like the description of traffic associated with this block along with the time domain view of it.”
One thing is blazingly clear. The IP market is a work in progress and the demands placed on the industry are increasing all of the time. It is no longer possible to develop a hardware block and expect it to be adopted by the industry. The role of IP is to help and decrease the workload on the SoC integrator and that requires a very large amount of collateral be provided along with the functionality.

http://semiengineering.com/ip-requirements-changing/

Thursday, February 25, 2016

MWC 2016: MediaTek Helio P20 Octa-Core Mobile Chip Aims To Make Smartphones More Efficient

MediaTek wasted no time at the Mobile World Congress and showcased two new SoC models, namely the Helio P20 for smartphones and the MT2511 for bio-sensing wearables.
The Helio P20 follows in the steps of P10, a mid-range CPU targeted at tablets and smartphones. It sports ARM's state of the art Mali-T880 GPU. Helio P20 is an octo-core CPU, with Cortex-A53 cores running at 2.3GHz.
MediaTek used the 16 nm FinFET Plus (16FF+) process to manufacture the chipset, switching from the previous 28 nm standard. This enables the CPU to go as high as 2.3 GHz instead of only 2 GHz.
According to the OEM, the new chip consumes 25 percent less power than its predecessor, Helio P10. Not only that, but MediaTek says that the GPU offers 25 percent more performance in video and gaming apps.
Helio P20 is a premiere, being the first SoC that works on Samsung's LPDDR4X RAM module. This offers increased bandwidth over the LPDDR3, by as much as 70 percent.
Another notable upgrade in the P20 is that it offers WorldMode LTE Category 6 support alongside 2x20 carrier aggregation, enabling it to download files at 300 Mbps and upload them at 50 Mbps.
Dual-SIM fans will be happy to know that the SoC has global standby for two SIMs, as well as multicast service backed by LTE multimedia. The LTE multimedia support lets users get HD video content over LTE connections.
"Helio P20 meets today's consumer demand for sleek, powerful yet highly power efficient mobile devices," says Jeffrey Ju, executive vice president and co-chief operating officer at MediaTek.
Ju points out that multimedia activities and battery life are among the most important criteria for consumers, and his company manages to offer both to a high standard.
Helio P20 SoC equipped gadgets will start shipping in Q2 of 2016.
MediaTek provides SoCs for midrange smartphones, the most notable example being HTC One M9s.
MediaTek also revealed the MT2511, the first foray of the company into "bio-sensing analogue front-end (AFE) chip." The MT2511 should give processing power to fitness and health devices. MediaTek touts that power efficiency of the chip is unmatched.
The MT2511 eliminates the interference and motion artifacts when it collects the electrical signals of the heart. It accomplishes this by using high sample rate from 64 to 4 KHz and a 100db dynamic range.
The chipset is able to store pulse data, making it an asset in pulse oximetry (SpO2), electroencephalography (EEG), electromyography (EMG) and blood pressure analysis.
Both the 'Internet of Things' and wearable industry will want to use the MT2511 in devices such as active lifestyle smart watches, fitness trackers or sports bands. MediaTek announced that the manufacturing stage for the MT2511 starts during the first half of the year.
"We can only begin to imagine how health-related wearables will improve both medical care and everyday wellness all around the world," says  JC Hsu, MediaTek's Corporate VP and GM of the IoT business unit.
Hsu goes on to add that the mobile health market leads the technology field in terms of growth quickness.
Are you excited about the new chipsets from MediaTek? Let us know in the comment section below.

http://www.techtimes.com/articles/135868/20160224/mwc-2016-mediatek-helio-p20-octa-core-mobile-chip-aims-to-make-smartphones-more-efficient.htm