Through the investment, Samsung Electro-Mechanics will develop the
next-generation chip packaging facilities, which will be deployed at
Samsung Display’s manufacturing complex in Cheonan, South Chungcheong
Province.
Teaming up with Samsung Electronics’ system LSI
division, in charge of developing non-memory chips such as application
processors, the electronic components firm will start a project to
develop the fan-out wafer level package or FoWLP technology, which can
reduce the size of a chip and production cost in a dramatic manner.
Thanks
to an upper hand in its own FoWLP technology, TSMC, a Taiwanese chip
foundry firm, was able to strike a supply deal of mobile application
processor for Apple’s next iPhones.
http://www.koreaherald.com/view.php?ud=20160722000587
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