Friday, July 29, 2016

ams sells NFC, RFID technologies to ST

Sensor specialist ams is selling its NFC and RFID reader IP, technologies and product lines to STMicroelectronics for $79.3million. The deal is also said to include a ‘substantial deferred earn out consideration’. Depending on future results, this could be worth another $37m. However, ams will retain its sensor related NFC/RFID tags business and relevant design capabilities as it looks to develop wireless IoT sensor solutions and support upcoming sensor nodes.
Alexander Everke, ams’ CEO, pictured, said: “Divesting certain RFID/NFC product lines streamlines our product and technology portfolio around our core sensor solutions competence while maximising the value of our high performance wireless IP. This transaction is a next strategic step on our way to make ams the world’s leading provider of sensor solutions for all major end markets.”
Included in the deal are NFC front end and antenna boost solutions, as well as integrated HF/UHF RFID reader assets. Around 50 employees will transfer to ST.

http://www.newelectronics.co.uk/electronics-news/ams-sells-nfc-rfid-technologies-to-st/144020/

Thursday, July 28, 2016

Samsung, SK hynix to spend more on chips for self-driving cars

Korean chipmakers Samsung Electronics and SK hynix are pouring more resources into producing chips for self-driving cars amid their slowing sales in key sectors such as PCs.

SK hynix, the second-largest memory chipmaker next to Samsung, said on July 26 that its car business now makes more than 10 percent of DRAM sales. DRAM chips are used for temporary data storage.

The company added the figure for NAND chips, used for long-term data storage on smartphones and computers, is lower than that for DRAM but continues to grow.

“We are also producing chips for ADAS (advanced driver assistance systems) and self-driving cars since 2015,” the company said in a conference call. “We will continue to focus resources into the futuristic technologies.”

Chipmakers are recently struggling with falling prices as the demand for PCs and smartphones is continuing to decline.

SK hynix said its second-quarter profit plunged 67.1 percent to 452.8 billion won (US$399 million) from a year ago especially due to its slowing DRAM sales. Compared to its compatriot rival Samsung, it has a large sales portion of DRAM chips.

Samsung, the market leader on memory chips, has also been keeping a close eye on automotive chips. The company’s vice chairman and semiconductor business chief Kwon Oh-hyun currently oversees the company’s automotive parts business overall.

Samsung recently acquired a 1.92 percent stake in China’s BYD, the world’s largest electric vehicle maker, in a way for it to expand its presence in the soaring automotive parts market in an era of electric mobility.

The company plans to supply its own connected car solution Samsung Connect Auto to US telecom behemoth AT&T from next month. First unveiled in February this year, the solution is a little plastic box powered by Samsung’s Tizen OS that plugs directly into a vehicle’s on-board diagnostics to monitor the car’s operation, provide updates on eco driving efficiency and offer Internet connections for entertainment.

http://www.koreaherald.com/view.php?ud=20160727000801

Wednesday, July 27, 2016

Tsinghua Leads Creation of $2.8 Billion Chinese Chip Giant

Tsinghua Unigroup Ltd. merged its memory chip-making operations with Chinese government-run XMC’s, creating a $2.8 billion company to spearhead the country’s effort to become a global semiconductor player.
The company is folding XMC, also known as Wuhan Xinxin Semiconductor Manufacturing Corp., into its growing portfolio of assets and consolidating their production capacity, Tsinghua’s billionaire chairman Zhao Weiguo said via e-mail. The newly merged entity is called Changjiang Storage Co. and has a registered capital of 18.9 billion yuan ($2.8 billion), according to a website operated by the State Administration for Industry and Commerce.
Changjiang Storage will count among its shareholders the 138 billion-yuan National Integrated Circuit Industry Investment Fund Co., whose mandate is the development of a domestic chip sector and in which Tsinghua is an investor. Other shareholders include the provincial governments of Wuhan and Hubei, though the website didn’t list their stakes.
Zhao will become chairman of the new entity, he said. Tsinghua, an affiliate of the prestigious Beijing university of the same name, harbors ambitions of becoming a global player in semiconductors. It has pursued deals around the globe as the standard-bearer of China’s effort to build a local industry giant and wean the country off foreign technology. Its core business of semiconductors is seen by the nation’s political leadership as vital to national security.The company is just one of several affiliates of state-backed Tsinghua University, the school that’s produced Chinese leaders from President Xi Jinping to his predecessor Hu Jintao. Other arms include Tsinghua Unisplendour Co. and Tsinghua Tongfang Co.
Together they’ve spearheaded a spate of high-profile acquisitions in recent years. Unigroup bought RDA Microelectronics Inc. and Spreadtrum Communications Inc., and came close to a potential $23 billion bid for Micron Technology Inc. But it withdrew from a $3.8 billion investment in Western Digital Corp. in the face of a U.S. security review.
Its latest target, XMC, began operations in 2008 and says it’s one of the largest players in domestic semiconductors. It’s unveiled plans to participate in the building of a $24 billion semiconductor manufacturing mega-complex that the government is establishing in its home province. XMC didn’t respond to a phone call seeking comment.
Closely held Unigroup had sales of 52 billion yuan ($8 billion) last year with an after-tax profit of 3.9 billion yuan, according to the company. In its chip design business, profit came to $200 million on sales of 13.5 billion yuan. Its target, XMC, began operations in 2008 as a foundry for memory chip and image sensor production.

http://www.bloomberg.com/news/articles/2016-07-26/tsinghua-unigroup-xmc-merge-chip-assets-to-create-chinese-giant

Tuesday, July 26, 2016

SK Hynix tips first-half pickup after sharp second-quarter profit drop


South Korean memory chip maker SK Hynix Inc (000660.KS) on Tuesday tipped a strong pickup in DRAM memory chips for mobile devices in the second half after its second-quarter operating profit fell to its lowest in more than three years.
The world's No. 2 memory chip maker after Samsung Electronics Co Ltd (005930.KS) said key clients would launch new smartphone products, boosting a market which has been hurt by weak demand for consumer electronics.
"The third quarter is a time when demand from key clients for new smartphone products rises significantly, which will have a positive effect," SK Hynix said in a statement.
SK Hynix said in a regulatory filing its April-June profit was 453 billion won ($397 million), the lowest since the first quarter of 2013 and matching analysts' estimates from a Thomson Reuters StarMine SmartEstimate survey.
The chipmaker's shares were down 2.1 percent as of 0206 GMT, compared with a 0.2 percent rise for the broader market .KS11, briefly touching their lowest price since July 8.
Yuanta Securities analyst Lee Jae-yun said concerns about tougher competition amid speculation about a takeover of U.S. Micron Technology Inc (MU.O) was weighing on investor sentiment.
Micron earlier this month announced job cuts and other savings after guiding for weaker-than-expected fiscal third-quarter sales, underscoring the strains on the industry.
Sluggish global economic conditions are weighing on demand for products ranging from smartphones to personal computers, hurting prices for components such as chips.
SK Hynix said second-quarter shipments of DRAM chips, used for temporary data storage, rose 18 percent from January-March while average selling prices fell 11 percent.
Shipments for NAND chips, used for long-term data storage on products such as smartphones and computers, rose 52 percent and the average selling price fell 11 percent.
Second-quarter revenue SK Hynix fell 15 percent from a year earlier to 3.9 trillion won, compared with a Thomson Reuters StarMine SmartEstimate of 3.8 trillion won.
The impending launch of new premium smartphones from firms such as Apple Inc (AAPL.O) and Samsung Electronics could help chipmakers in the current quarter, however.
Researcher TrendForce said earlier this month contract prices for DRAM chips had stabilized in June and would rise by between 4 percent and 8 percent in the third quarter.
SK Hynix also said it would push to grow its memory sales for vehicles, focusing on high-end applications such as self-driving technologies.


http://www.reuters.com/article/us-sk-hynix-results-idUSKCN106079

Monday, July 25, 2016

Samsung Electro-Mechanics to invest W263b in chip technology

Through the investment, Samsung Electro-Mechanics will develop the next-generation chip packaging facilities, which will be deployed at Samsung Display’s manufacturing complex in Cheonan, South Chungcheong Province.

Teaming up with Samsung Electronics’ system LSI division, in charge of developing non-memory chips such as application processors, the electronic components firm will start a project to develop the fan-out wafer level package or FoWLP technology, which can reduce the size of a chip and production cost in a dramatic manner.

Thanks to an upper hand in its own FoWLP technology, TSMC, a Taiwanese chip foundry firm, was able to strike a supply deal of mobile application processor for Apple’s next iPhones.

http://www.koreaherald.com/view.php?ud=20160722000587

Friday, July 22, 2016

Intel, Samsung, Western Digital investing in Auburn-based tech startup

Technology giants Intel Corp., Samsung Electronics Co. Ltd. and Western Digital Corp. are investing in an Auburn-based startup.
Samsung Ventures, the venture capital arm of Korean consumer electronics company Samsung Electronics, led the $4.5 million equity financing round for Kazan Networks Corp. Intel Capital, the venture arm of the semiconductor-maker Intel (Nasdaq: INTC), and data-storage products developer Western Digital (Nasdaq: WDC) also invested, according to Kazan.
The Auburn-based company, which launched in December 2014, has developed technology to allow cloud data center servers to quickly access solid-state memory that is not physically in or near the server. That “allows for data center configurations that are game changers,” said Bryan Cowger, Kazan Networks' head of marketing.

http://www.bizjournals.com/sacramento/news/2016/07/21/intel-samsung-western-digital-investing-in-startup.html

Thursday, July 21, 2016

Strategic investments in high-performance computing enhance U.S. competitiveness

n recent months, scientists at the Pittsburgh Supercomputing Center reported progress in the fields of genomics, public health, chemistry and machine learning thanks, in part, to a new National Science Foundation-funded supercomputer – Bridges. The system, which was also used to model the possible benefits of influenza vaccine choice, provided compelling results that suggest adopting a vaccine choice policy could curtail the national cost and enormous annual burden of influenza in the United States.
Federal funding and support for supercomputers or high-performance computing (HPC) projects, such as Bridges, is critical for enabling new scientific discoveries and cures for diseases, enhancing national security and cyber defenses and improving economic competitiveness. Yet, U.S. leadership in this market is being contested as other countries are beginning to invest aggressively as they recognize the technology’s strategic importance.
Think of it like the Space Race of the 1960s, but with investment going into software and large-scale HPC systems rather than rockets. The stakes are different, but the potential for world-changing results is just as important.While the U.S. continues to hold a prominent position in HPC, the Associated Press recently reported that China has now officially displaced the U.S. for the first time with the most supercomputers on the Top 500 listing of the fastest supercomputers in the world. Fifteen years ago China didn’t even have one HPC on the Top 500 listing. According to the International Data Corporation, the Asia Pacific region had a HPC growth of 15 percent in 2015, where the U.S. was only at 5 percent. The European Union has recently doubled their investment in supercomputing research, and Japan’s High Performance Computing Initiative program shows they are focused on building an exascale supercomputer by 2020, whereas the U.S. is currently on target for 2023.
The reality is that HPC systems are no longer a technology reserved for elite academic institutions, but are now bleeding into the enterprise, disrupting industries and impacting our nation’s competitiveness and innovation. For example, imagine a wind turbine. Without HPC, researchers could only test for very general system-wide improvements. With it, researchers can use HPC systems to handle massive amounts of data and complex calculations to analyze the impact of friction at multiple points on a single turbine blade, making improvements a millimeter at a time. Efficiency gains can multiply quickly at that level, leading to a whole new paradigm for investing in clean wind energy.
Organizations like the Pittsburgh Supercomputing Center are also pushing the HPC envelope with new and innovative architectures. Bridges represents a new approach to supercomputing that focuses on research problems that are limited by data movement. In addition to serving traditional supercomputing users, Bridges will help researchers tackle new kinds of problems in genetics, the natural sciences and social sciences, where scientists are impacted by the volume of data rather than computational speed. This project highlights another innovative way HPC can help solve pressing issues facing the U.S.
But we can’t stop there. Given the explosion of vast amounts of data and the increasing importance of simulations in scientific research, we need to make the next exponential leap in HPC, exascale computing and next generation computing. To put in perspective, an exascale supercomputer could operate faster than 50 million laptops. As with the semiconductor industry, the country or region that leads HPC and exascale will capture the related economic and societal benefits. The U.S. simply cannot afford to fall behind in this race.
While the private sector continues to make significant HPC-related investments, the federal government also plays a vital role in advancing HPC research. HPE recently participated in an Information Technology Industry Foundation (ITIF) panel on Capitol Hill to urge Congress to fully fund the Administration’s FY2017 request on the National Strategic Computing Initiative (NSCI). The NCSI names three lead agencies, Department of Energy (DOE), Department of Defense, and National Science Foundation to lead these efforts.
Specifically, DOE plans to establish, over the next 15 years, a viable path forward for future HPC systems, and to research new progressive technologies that perform “beyond Moore’s law,” including the all-important exascale computing.
We continue to urge Congress to fund these critical investments, so the U.S. can enjoy the greatest rewards of HPC-driven technology and give our nation the advantage when attempting to solve the world’s most pressing challenges.

http://thehill.com/blogs/congress-blog/technology/288315-strategic-investments-in-high-performance-computing-enhance-us