Cage Chao, Taipei; Jessie Shen, DIGITIMES [Tuesday 22 November 2016]
Qualcomm, Samsung Electronics, MediaTek, Apple and
Spreadtrum Communications are gearing up to roll out their 10nm mobile
chips which will be shipped in smartphones during 2017.
Qualcomm
recently announced its 10nm mobile chips will be built by Samsung's
foundry business. Qualcomm's Snapdragon 835 is in production now and
expected to ship in commercial devices in the first half of 2017, the
company said.
Samsung's next-generation Exynos series
will also be built in-house using 10nm process technology. Mass
production of Samsung's 10nm Exynos mobile chips is expected to kick off
in the first half of 2017, according to industry sources.
MediaTek
will reportedly roll out two 10nm mobile chips - the Helio X30 and X35 -
manufactured using TSMC's 10nm FinFET process. MediaTek is among TSMC's
first group of customers adopting 10nm process technology.
MediaTek
is expected to enter volume production for the Helio X30-series SoCs
between the end of 2016 and early-2017, and the X35 series will be built
using a lower-spec variant of the foundry's 10nm processes, according
to previous reports.
TSMC will also be engaged in the
manufacture of 10nm chips for HiSilicon, which will power Huawei's
flagship smartphone series for 2017, industry sources believe.
http://www.digitimes.com/news/a20161121PD211.html
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