Monday, February 9, 2015

Clifton's NJ Micro-Electronic Testing sued over bad plane brakes

http://www.northjersey.com/news/clifton-s-nj-micro-electronic-testing-sued-over-bad-plane-brakes-1.1265108

CLIFTON — An electronics testing lab is for a second time the subject of a lawsuit that alleges the company produced false test reports for products that it said were properly working.
New Jersey Micro-Electronic Testing Inc. of Clifton is being sued by a distributor in Dover that sold thousands of airplane brake parts judged by the lab to be functional but that later proved to be defective.
Electrospec, the parts distributor, claims in its suit that the testing lab improperly tested the brake parts or never performed the tests, and that it falsified the test reports. A similar claim was made in 2005 by a former lab employee who said his superiors directed him to fabricate test reports, but the company said those allegations were not proved.
In the new case, none of the flawed brake parts were installed in airplanes, but the fallout for Electrospec was massive, said Darren Summer, the company's vice president. After an investigation by federal inspectors, he said, the company lost millions of dollars in business and was forced to shrink its workforce of 30 employees to eight.
Summer said he hopes the lawsuit, filed in March 2014 in Passaic County Superior Court, will vindicate his business and shine a light on the testing lab's practices.
"The damage is done on my end," Summer said. "Others that have used testing from NJMET, they need to know this. These parts could be in aircraft, in equipment that could fail."
The testing lab's attorney, Jerry Gallagher, said the company denied the new allegations and was "completely confident that it properly tested and thoroughly tested these parts."
Electrospec bought the brake parts from a Chinese supplier in 2008 and sent them for testing to ensure that they were authentic, new and functional, Summer said. The lab said 13,000 of the 20,000 parts passed its tests, and Electrospec sold them to Hydro-Aire, a California-based company that installs aircraft brake systems.
But Hydro-Aire's parent company performed tests of its own, revealing that some of the parts were not working and that they likely had been used and refurbished, said Richard Vrhovc, Electrospec's attorney.
The Federal Aviation Administration sent an alert to the airline manufacturing industry about the faulty parts in 2012 that said they were "not properly tested and could be counterfeit."
Vrhovc said the FAA laid the blame on Electrospec when it should rest with the testing lab.
"NJMET has been skating free on this for three years with no repercussions," he said.
Based on recent testimony from a lab test engineering manager, Vrhovc said, Electrospec plans to amend its suit this month to include an allegation that the lab violated the New Jersey Consumer Fraud Act.
The manager, Thomas Farinella, said in a deposition that he either could not or did not test at least two of the criteria that the lab agreed to review for the brake parts. Test reports show that the parts passed in those areas anyway.
Vrhovc also questioned whether it was possible for the tests to be performed as quickly as the lab reports said they were. One showed that a single worker tested 6,000 parts one day and 2,500 on another, he said.
Gallagher said the lab was reviewing Farinella's testimony. He said the untested areas would not have made a difference in determining whether the parts were faulty. He also said the tests were performed in three to five seconds and often by multiple operators.
Gallagher said Electrospec was using the lab as a "scapegoat" and that Electrospec never represented that the bake parts came from China, where counterfeits often originate. The company could have asked for a specific authenticity test, but it did not do so, he said.
"When you buy parts like this, they can pass today and fail tomorrow," Gallagher said. "If they had disclosed the source of the parts, it really would have been a game changer."
The testing lab was sued in 2005 by a former employee, Mark Williams, who also was represented by Vrhovc. Williams said he was instructed to falsify product-testing reports and that company engineers told him they could not or did not know how to test parts the company agreed to test for clients.
Gallagher denied Williams' allegations and contended that Williams' claims were never proved. The case was resolved in a confidential settlement in 2007.

Monday, November 10, 2014

Issues in Solvent Testing for Counterfeits

http://www.us-tech.com/RelId/1337592/ISvars/default/Issues_in_Solvent_Testing_for_Counterfeits.htm


Fighting against counterfeit electronic components requires many tools, including multiple test methods to identify the counterfeits. Use of improper or incorrect testing procedures can lead to incorrect or misleading results, at times identifying authentic parts as being counterfeit.

Over the past few years, new techniques of black top, remark, and resurface marking tests have been implemented to discover nonauthentic marking and coating processes that have been used on electronic components and devices. While these tests can be very effective at identifying counterfeit plastic components, the same tests can also yield false positive readings for ceramic-packaged devices that have not been blacktopped/coated or on can package devices that have not been resurfaced. Some of the experiences with false results from solvent testing were reported at the recent Components for Military and Space Electronics (CMSE) conference in Los Angeles, CA (February 2014).

In one instance, a hermetically sealed non-resurfaced) packaged device which was authentic failed Dynasolve testing, which indicated that it was a counterfeit part. The part in question was a model SNJ54HC4040J from Texas Instruments (www.ti.com) which failed Dynasolve testing that should have never been performed. The component was falsely identified as counterfeit according to the Dynasolve test.
This shows a TO can (non-resurfaced) packaged device that would fail mineral spirits testing for authentic/counterfeit differentiation.
 


In another example, a model LM158H from National Semiconductor, which is supplied in a can-type package, failed mineral spirits testing for authentic/counterfeit verification. The testing on the can (non-resurfaced) device revealed an authentic part to be counterfeit. The mineral spirits testing should never have been performed on this type of packaged component, which are notably those in TO housings, such as TO-3 and TO-8 can packages.

Another category are QML components, which are supplied in hermetic housings, such as ceramic, glass, or TO can packages. These packages and their markings should never have been subjected to acetone, M2P, or Dynasolve solvents since they are not designed to pass these tests in checking for counterfeit/authentic product validation. These solvents should only be used to test plastic-encapsulated-microcircuit (PEMS) housings for blacktopping that had been used to hide any remarking that has been performed.

Experiences in testing a wide range of packaged devices and components for authentic/counterfeit differentiation has helped identify some proper testing methods for different components. The first group of these testing "lessons" applies to a nonmilitary, non-printed-circuit-board (non-PCB) assembly solvent test for remarking and resurfacing according to SAE AS6081, paragraph 4.2.6.4.3 requirements. For example, experience in the use of scrape testing have been useful in early stage detection of resurfaced electronic devices and components. An industry recommendation is for the single-use application of a sterile cotton-tip applicator (6-in.) and wood shaft specimen data collection applicator.

The second group of these testing "lessons" applies to military and industrial non-resurfaced PCB assemblies, for marking permanency testing. Marking permanency testing is performed per the requirements of military standards MIL-STD-883 for microcircuits and MIL-STD-750 for semiconductors. These tests are recommended for use with components and devices in hermetic ceramic and can-type packages which show no evidence of resurfacing as well as for aerospace and military marking tests for other components and devices. Testing involves the use of bristle brushes with three long rows of hard bristles, fabricated from nonreactive materials for checking the resurfacing of the components and devices under test.
Effective scrape testing can help reveal resurfaced electronic components.
 
As an example of testing on hermetically sealed ceramic packaged devices for the MIL-STD marking permanency tests, some test methods that have delivered good results with non-hermetic devices have not shown the same measure of success with hermetic devices. Such tests as mineral spirit tests, acetone tests, 1-methyl, 2-pyrrolidone tests, and Dynasolve tests have been vital in uncovering many anomalies associated with parts that have been remarked or resurfaced. But these same tests, when used improperly on hermetically sealed ceramic devices or can-type packages that have not been resurfaced, can provide false positive results for counterfeiting.

The proper exercises and applications for the first and second groups of devices/components to be tested include performing marking permanency testing according to MIL-STD-883 and MIL-STD-750 requirements for the first group of devices and components, and performing a solvent test for resurfacing according to SAE AS6081 Para 4.2.6.4.3 for the second group of devices and components.

Tuesday, August 26, 2014

Samsung, Micron May See DRAM Price Lift as iPhone 6 Crunches Supply Chain

http://blogs.barrons.com/techtraderdaily/2014/08/25/samsung-micron-may-see-dram-price-lift-as-iphone-6-crunches-supply-chain/?mod=BOLBlog

Cowen & Co.’s semiconductor analyst Timothy Arcuri today writes that pricing is set to rise for DRAM memory chips because the entire supply chain in Asia is being rocked by the rush to produce Apple’s (AAPL) iPhone 6.
That is leading to capacity constraints, which in turn may raise prices for DRAM for Samsung Electronics (005930KS) and Micron Technology (MU), two principal suppliers to the iPhone, even though the device itself won’t see a rise in DRAM content:
Our supply chain work in Asia suggests PC DRAM pricing is tracking to a ~3-5% M/M increase in Sept, owing to some pre-iPhone 6 launch supply constraints. While it is too early to see actual supply impact from Samsung ramping DRAM in S3 – likely starting CQ2:15 (we have long said 30k wsm is max it will ultimately produce) – Samsung is back in the supply chain on iPhone 6 for DRAM (in addition to MU via Elpida) after being excluded for iPhone 5/5S. So, we believe Samsung’s production has vectored to a large degree from PC DRAM to mobile DRAM; we feel this is unexpected by the market because Samsung mobile DRAM capacity was already tight based to some degree on captive smartphone demand. While this will help near-term pricing, we don’t see significant DRAM content increase in iPhone 6 unlike NAND where the SKU’s are likely to mix up from 64GB on high-end to now include a 128GB high-end model for both 4.7″ and 5.5″.
Arcuri thinks SanDisk (SNDK) may be a prime beneficiary of the NAND increase mentioned.
In the same report, Arcuri writes that a Chinese government investigation into Qualcomm (QCOM) “might come to a head in the near-term,” citing his examination of the matter and media reports. It may be Qualcomm takes a lower royalty rate, muses Arcuri, but “We feel that, even in a worst case where the NDRC would achieve lower royalty rates in China, QCOM would be better off to cede major swaths of royalties in China rather than jeopardize existing cash flows.”

Fairchild Semiconductor To Close Two Manufacturing Facilities In Realignment

http://www.rttnews.com/2374543/fairchild-semiconductor-to-close-two-manufacturing-facilities-in-realignment.aspx

 Chip maker Fairchild Semiconductor International Inc. (FCS: Quote) said Monday that it will close two manufacturing facilities and reduce its wafer fabrication lines as part of a realignment of its global manufacturing operations. The company noted that the realignment will enable it to improve product quality and lower costs.

San Jose, California-based Fairchild Semiconductor said it will eliminate its internal five-inch manufacturing facilities and significantly reduce its six-inch wafer fabrication lines. This will result in the closure of its manufacturing and assembly facilities in West Jordan, Utah and Penang, Malaysia, as well as the remaining five-inch wafer fabrication lines in Bucheon, South Korea.

Fairchild said the closures of the two manufacturing facilities in West Jordan as well as Utah and its fabrication lines in Bucheon, South Korea, are planned to occur from the second quarter to the fourth quarter of 2015.

The company is working closely with customers to complete the qualifications required and build adequate supply to support their needs. During the transition, Fairchild expects its internal and external supply chain to service customer orders without disruption.

Mark Thompson, Chairman and CEO of Fairchild, said, "The realignment we are announcing today will maximize the utilization of eight-inch factories and reduce the complexity of our manufacturing footprint, while creating the flexibility to support ongoing customer demand through a greater use of external manufacturing sources. Fairchild will continue operating eight-inch wafer fabrication lines in South Portland, Maine and Mountain Top, Pennsylvania, as well as the Bucheon six- and eight-inch fabrication lines."

Fairchild will also continue to operate the assembly and test facilities in Cebu, Philippines and Suzhou, China.

Chip maker Fairchild Semiconductor International Inc. (FCS: Quote) said Monday that it will close two manufacturing facilities and reduce its wafer fabrication lines as part of a realignment of its global manufacturing operations. The company noted that the realignment will enable it to improve product quality and lower costs.

San Jose, California-based Fairchild Semiconductor said it will eliminate its internal five-inch manufacturing facilities and significantly reduce its six-inch wafer fabrication lines. This will result in the closure of its manufacturing and assembly facilities in West Jordan, Utah and Penang, Malaysia, as well as the remaining five-inch wafer fabrication lines in Bucheon, South Korea.

Fairchild said the closures of the two manufacturing facilities in West Jordan as well as Utah and its fabrication lines in Bucheon, South Korea, are planned to occur from the second quarter to the fourth quarter of 2015.

The company is working closely with customers to complete the qualifications required and build adequate supply to support their needs. During the transition, Fairchild expects its internal and external supply chain to service customer orders without disruption.

Mark Thompson, Chairman and CEO of Fairchild, said, "The realignment we are announcing today will maximize the utilization of eight-inch factories and reduce the complexity of our manufacturing footprint, while creating the flexibility to support ongoing customer demand through a greater use of external manufacturing sources. Fairchild will continue operating eight-inch wafer fabrication lines in South Portland, Maine and Mountain Top, Pennsylvania, as well as the Bucheon six- and eight-inch fabrication lines."

Fairchild will also continue to operate the assembly and test facilities in Cebu, Philippines and Suzhou, China.

Through the combined actions, Fairchild expects to incur cash restructuring and other costs of about $36 million, and non-cash charges of about $25 million for accelerated depreciation.

On completion of the realignment, Fairchild expects to realize annual savings of about $45 million to $55 million from the second quarter of 2014 financial baseline. The company also expects about 75 percent of the estimated savings to be cash savings, with the balance attributable to lower depreciation costs.

FCS is trading at $17.03, up $0.01 or 0.03 percent on a volume of 193,102 shares.

Wednesday, July 23, 2014

STMicro Profit Turnaround Eclipsed by Optimistic Rivals

http://www.bloomberg.com/news/2014-07-23/stmicro-posts-first-profit-in-11-quarters-on-cost-cuts.html

STMicroelectronics NV (STM)’s first profit in 11 quarters, showing Europe’s largest semiconductor maker rebounding from its phone-chip troubles, was eclipsed by rivals’ more optimistic predictions for rising demand.
The chipmaker’s shares fell as much as 4.5 percent after its forecast for the current quarter lined up with analysts’ projections. In contrast, forecasts from Intel Corp. and Texas Instruments Inc. topped estimates, fueling expectations that the smartphone and personal-computer markets are picking up.
“It’s disappointing relative to peers,” said Janardan Menon, an analyst at Liberum Capital Ltd. in London. “ST’s quarter is broadly in line, but many companies in the sector are coming ahead of expectations.”
STMicro is reducing its reliance on the wireless business after shutting down its unprofitable phone-chip unit with Ericsson AB, focusing instead on the more lucrative power-management products, microcontrollers and sensors sold to the likes of Samsung Electronics Co. and Volkswagen AG. The shift is starting to pay off, with costs falling and margins recovering.
The company still faces challenges. Free cash flow was negative $99 million last quarter and the return to profit -- net income was $38 million -- was helped by $100 million of public funding as part of France’s project to aid the development of nanoelectronics technologies. Revenue fell 8.9 percent to $1.86 billion, Geneva-based STMicro said.
Photographer: Simon Dawson/Bloomberg
STMicroelectronics NV Chief Executive Officer Carlo Ferro said, “We anticipate further... Read More

‘Realistic Numbers’

STMicro forecast sales will increase about 3 percent in the current quarter from the second, plus or minus 3.5 percentage points, and gross margin will be about 34.4 percent, plus or minus 2 percentage points. Gross margin last quarter was 34 percent, topping the 33.6 percent analysts predicted.
“The outlook is a result of many things -- growth, transition from legacy products,” Chief Executive Officer Carlo Bozotti said on a conference call. “We gave realistic numbers. What’s important for us is making sure we have the right trajectory.”
The shares fell 4 percent to 6.68 euros at 12:48 p.m. in Paris, giving the company a market value of 6.1 billion euros ($8.2 billion). The stock had jumped 19 percent this year through yesterday.

Intel, Texas

Chipmakers are well-positioned to benefit from an economic recovery. The 18-nation euro-area has returned to growth, though modest, and U.S. expansion is set to accelerate.
“We begin with a favorable macroeconomic backdrop and there are areas where there is strong traction, in automotive and industrial for example,” STMicro’s Bozotti said. “In other areas like wireless, it’s more customer specific.”
Shares of Intel, the world’s largest chipmaker, rose to a 10-year high on July 16 after it forecast sales that indicate demand for PCs is starting to recover among consumers.
Texas Instruments, the biggest maker of analog semiconductors, this week forecast third-quarter profit that may top analysts’ estimates on demand for chips used in industrial machinery, cars and mobile-phone systems. ARM Holdings Plc, the chip designer whose products power Apple Inc.’s iPhone and iPad, said its revenue growth will accelerate.

Wednesday, April 9, 2014

Micron Reorg Focuses on 4 Key Businesses

http://www.eetimes.com/document.asp?doc_id=1321820&

Wednesday, March 19, 2014

Anatomy of an Electronics Counterfeit Operation

http://electronicspurchasingstrategies.com/2014/03/06/anatomy-counterfeiter/

If the supply chain could cobble together a worst-case scenario in counterfeit components, it would read a lot like the case of Hao Yang. Yang, a Chinese national, was prosecuted earlier this year as a co-conspirator in a scheme to sell counterfeit ICs to the U.S. military. Details of the case, outlined on the Immigration and Customs Enforcement (ICE) home page, are familiar:
1. An individual sets up a U.S.-based import and distribution firm under one or several phony identities. According to ICE: “Yang and his co-conspirators created and operated several companies in Maryland, Pennsylvania, and elsewhere, to facilitate the conspiracy, including MS Technologies and A-One Electronics in Baltimore; A-Best Technologies in China; and ARRCORD Group, SMC Group and Smooth LLC.”
2. The principals then procure counterfeit ICs from China and try to sell them as authentic mil-spec components: “The defendant imported counterfeit goods from China and fraudulently sold them as legitimate merchandise,” said U.S. Attorney Rod J. Rosenstein. “Counterfeit integrated circuits from China were falsely represented to be legitimate American-made parts.”
The counterfeit circuits received by Yang, a number of which were military-grade, were supplied by one specific co-conspirator located in China.
3. Operate as a distributor: The ICE press release doesn’t divulge how the scheme was uncovered, but from the language of the release it appears that some, if not all, the counterfeits were headed to different secondary handlers before they got into the military supply chain. “This co-conspirator sold, or attempted to sell, the circuits to various individuals, companies and government agencies in the United States,” ICE said in its report. The U.S. government organ outlined the following steps taken by the counterfeiters:
  • Yang used his residence to warehouse the counterfeit goods, including counterfeit military goods, sent to him by his co-conspirators in China. He then shipped specific items to buyers in the United States based on the order information provided by his co-conspirators. Yang maintained numerous bank accounts to deposit his illegal commissions and make payments associated with his counterfeit activities. He also used the commissions he received from his co-conspirators to pay for living expenses and other purchases, including his 2010 Acura TSX sedan.
  • The counterfeit circuits received by Yang, a number of which were military-grade, were supplied by one specific co-conspirator located in China. This co-conspirator sold, or attempted to sell, the circuits to various individuals, companies and government agencies in the United States. Yang then distributed the counterfeit circuits, via his domestic businesses, to the buyers in the United States sometimes in repackaged form.
  • The co-conspirator paid Yang a commission of $500 per month for his distribution services. To conceal the fact that the counterfeit circuits were being imported from China, Yang and his co-conspirator formed ARRCORD Group to create the appearance that the co-conspirator’s company in China (from which the counterfeit circuits were being distributed) was actually based in the United States. By using counterfeit circuits, their malfunction or failure could likely have caused serious bodily injury or impaired military operations, personnel or national security.
  • Throughout the course of the conspiracy, Yang also obtained other counterfeit goods, including computer software, DVDs, and sports jerseys, from other co-conspirators in China and Hong Kong, which he then distributed in the United States. As was the case with the counterfeit circuits, Yang and these other co-conspirators concealed the fact that the goods they sold were counterfeit and produced in China and Hong Kong. Yang received commissions from these co-conspirators of $1,000 to $2,000 per month for his distribution services.
  • Between March 2011 and April 2013, Yang received hundreds of shipments from China and Hong Kong, including shipments involving integrated circuits. For example, in June 2012, Yang received two shipments of counterfeit military-grade integrated circuits sent to ARRCORD Group at his residence and also received three shipments of other counterfeit goods, including DVDs and counterfeit computer software, sent to SMC Group at Yang’s residence. The Manufacturers Suggested Retail Price of the counterfeit DVDs and computer software was over $58,000.
False-front distribution operations have been around forever and have proliferated with adoption of the Internet. These companies frequently change names and maintain multiple bank accounts. They are often one- or two-person operations.  The military market is targeted by counterfeiters because of the high value of military components and because devices that have reached their end of life (EOL) are often sold into the open market; Military equipment has a longer lifespan than commercial products so EOL components are frequently in demand.
After discovering counterfeit electronics components in its supply chain, the U.S. Department of Defense (DoD) stepped up its anti-counterfeit efforts. In December 2011, revisions to the National Defense Authorization Act (NDAA) were signed by President Obama. Among its provisions, the NDAA calls for DoD contractors and subcontractors to report counterfeit electronic parts or suspect counterfeit electronic parts via the Government Industry Data Exchange Program (GIDEP). It also specifies the need to source electronic components from “trusted suppliers” if the devices are not available directly from component manufacturers or through authorized distributors. According to ICE, Yang was selling goods as late as 2013.
The GIDEP requirements and the term “trusted supplier” have spurred controversy in the electronics supply chain. Individuals familiar with GIDEP, for example, point to a possible shortcoming in the requirement. Both buyers and sellers of suspected counterfeit parts are identified in GIDEP reports. Experts posit that companies avoid GIDEP for fear of legal repercussions and the stigma associated with counterfeiting. The ICE release doesn’t say if GIDEP played a role in the Yang case. (EPS has a call into ICE to see if that information is available).
“Trusted supplier” is also a hot button in the industry. Advocates of the authorized supply chain object to the term because it includes independent distributors. Independents differ from authorized distributors in that they are not franchised directly by component suppliers. Also, because independents buy and sell excess inventory in the open market, there’s a higher risk of sourcing counterfeits. Top-tier independents have invested in processes and equipment to minimize the risk of counterfeits and have distanced themselves from brokers – companies that speculate in electronic commodities and fly-by-night companies such as Yang’s.
The government has embarked on other efforts to stem counterfeiting such as the use of plant DNA to track components through the supply chain. Separately, the electronics industry is working on its own counterfeit-mitigation standards. Under the auspices of SAE International, an association of engineers and related technical experts in the aerospace, automotive and commercial-vehicle industries, the G-19CI committee released its first standard,  AS5553. The committee is working on a revision. In 2013, SAE released the standard (AS6081) for independent distributors.
Clearly, anti-counterfeiting has become a priority. “Counterfeit military goods pose a threat to our national security as they could end up in the wrong hands and legitimate manufacturing and high technology businesses may believe they are receiving authentic goods,” the ICE report noted, adding Homeland Security and ICE ”… will continue to protect the American public and America’s warfighters from the introduction of counterfeit, non-conforming, and substandard materials and goods from entering the United States.”
However, the electronics industry remains divided on anti-counterfeiting efforts. The authorized channel in general opposes measures that include independent distributors. Military contractors say independents are sometimes their only choice. It’s also difficult to tell just how bad the problem is. GIDEP data, which shows a decline in counterfeiting reports during 2013, is only part of the picture. The commercial supply chain collects data from industry consortia and organizations that accept and investigate anonymous tips.
Yang stopped short of being a worst-case scenario because the scheme was uncovered. As a standalone example, the Yang case counts as an anti-counterfeiting victory. In the grand scheme of things, it’s difficult to determine if it also represents progress in any of the government’s anti-counterfeiting efforts.  Yang offered a plea agreement and faces a maximum of 10 years in prison, according to ICE.